1. Product Specifications
Core Features
- Device Family: XCR22 Universal PLD
- Process Technology: 0.5ยต EยฒCMOS
- Package Type: 24-pin TSOIC (VO24I)
- Speed Grade: 7ns
- Supply Voltage: 5V
- Operating Temperature: Industrial grade (-40ยฐC to +85ยฐC)
Technical Specifications
- Logic Gates: 220 gates
- Macro Cells: 10 programmable macro cells
- Registers: 10 internal registers
- User I/Os: 22 configurable input/output pins
- Pin-to-Pin Delay: 7.5ns maximum
- Static Current: <75ยตA (ultra-low power consumption)
- Power Technology: True Zero Power with Fast Zero Power (FZP) design
Advanced Features
- TotalCMOS Technology: Industry’s first complete CMOS SPLD implementation
- Programmable Logic Array: AND/OR structure for sum-of-products implementation
- Output Macro Cells (OMC): Individually configurable as dedicated input, combinatorial output, or registered output
- JEDEC Compatibility: Function/JEDEC map compatible with Bipolar, UVCMOS, EECMOS 22V10s
- Program Cycles: 1000 guaranteed program/erase cycles
- Electronic Signature: Built-in identification capability
- Security Features: Security bit for unauthorized access prevention
Package Advantages
- Space Efficient: 24-pin TSOIC uses 93% less PCB space compared to 28-pin PLCC
- Flow-Through Pinouts: PCB-friendly design for simplified layout
- Industrial Rating: Extended temperature range for harsh environments
2. Pricing Information
The XCR22V10-7VO24I is competitively priced in the PLD market, with costs varying based on quantity and distributor. Typical pricing ranges from $6-15 per unit depending on volume commitments. For current pricing and availability:
- Contact authorized Xilinx distributors for volume pricing
- Industrial customers may qualify for extended temperature grade pricing
- Consult with electronic component suppliers for real-time market rates
- Consider lead times which may vary from 2-12 weeks depending on global supply conditions
Note: Prices subject to change based on market conditions and availability. Contact suppliers directly for current quotations.
3. Documents & Media
Technical Documentation
- Official Datasheet: XCR22V10 Universal PLD Device Datasheet (Xilinx)
- Programming Guide: XPLA Professional Programming Software Documentation
- Application Notes: AN022 – XCR22V10 Design Implementation Guidelines
- JEDEC Files: Standard JEDEC programming file format support
- Pin Configuration: Detailed pinout diagrams and electrical characteristics
Design Resources
- SPICE Models: Available for circuit simulation
- Footprint Libraries: CAD library files for major PCB design tools
- Reference Designs: Sample applications and design examples
- Programming Software: XPLA Professional suite compatibility
- Socket Information: ASM24TS socket module for TSOIC package programming
Compliance Documents
- RoHS Declaration: Environmental compliance certification
- Quality Certifications: ISO 9001 manufacturing standards
- Reliability Reports: MTBF and qualification test results
4. Related Resources
Development Tools
- Xilinx XPLA Professional: Primary development and programming environment
- ISE Design Suite: Legacy support for older design flows
- Third-Party Programmers: Universal device programmer compatibility
- Socket Modules: ASM24TS for TSOIC package programming
Compatible Devices
- XCR22V10-10VO24I: 10ns speed grade alternative
- XCR22LV10-7VO24I: 3.3V low-voltage variant
- XCR22V10-7SO24I: Standard SOIC package option
- XCR22V10-7PC28C: 28-pin PLCC package alternative
Application Areas
- Industrial Control Systems: Process automation and control logic
- Communications Equipment: Protocol handling and interface logic
- Automotive Electronics: Engine management and safety systems
- Consumer Electronics: Device control and user interface logic
- Test Equipment: Automated test systems and measurement devices
Technical Support
- Xilinx Technical Forums: Community-driven support and discussion
- Application Engineers: Direct technical assistance for complex designs
- Training Resources: Online courses and webinars for PLD design
- Design Services: Third-party design consultation available
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Restriction of Hazardous Substances Directive 2011/65/EU
- REACH Compliant: Registration, Evaluation, Authorization of Chemicals regulation
- Lead-Free Package: Environmentally friendly solder and packaging materials
- Halogen-Free: Reduced environmental impact packaging options available
- WEEE Compliant: Waste Electrical and Electronic Equipment Directive
Export Control Classifications
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (check specific lot markings)
- Export Restrictions: Subject to U.S. Export Administration Regulations (EAR)
- Dual-Use Technology: May require export licenses for certain destinations
Quality Standards
- Manufacturing Standard: ISO 9001:2015 certified facilities
- Automotive Grade: Available in AEC-Q100 qualified versions
- Military Grade: MIL-STD-883 screening available for defense applications
- Industrial Grade: Extended temperature and reliability specifications
- Commercial Grade: Standard operating conditions and specifications
Packaging and Handling
- MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30ยฐC/60% RH)
- ESD Classification: Class 1 (>1000V Human Body Model)
- Storage Temperature: -65ยฐC to +150ยฐC
- Reflow Temperature: Pb-free reflow profile compatible
- Tape and Reel: Standard packaging for automated assembly
The XCR22V10-7VO24I represents Xilinx’s commitment to delivering high-performance, low-power programmable logic solutions. With its innovative FZP technology and compact TSOIC packaging, this device offers an optimal balance of functionality, efficiency, and cost-effectiveness for modern electronic designs.
