The XCKU9P-2FFVE900I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing sectors.
Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+ (KU9P)
- Speed Grade: -2 (High Performance)
- Package Type: FFVE900 (Flip-Chip Fine-Pitch BGA)
- Pin Count: 900 pins
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
Logic Resources
- Logic Cells: 726,784 equivalent logic cells
- CLB Slices: 57,600 configurable logic blocks
- LUTs: 460,800 lookup tables (6-input)
- Flip-Flops: 921,600 flip-flops
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 22.5 Mb UltraRAM capacity
DSP and Processing
- DSP Slices: 2,520 DSP48E2 slices
- Processing System: ARM Cortex-A53 (not applicable for KU9P)
- Maximum Operating Frequency: Up to 741 MHz
I/O and Connectivity
- Maximum User I/O: 520 user I/O pins
- High-Speed Transceivers: 32 GTH transceivers
- Transceiver Speed: Up to 16.3 Gbps per channel
- PCIe Support: PCIe Gen3 x16 and PCIe Gen4 x8
Memory Interface
- DDR4 Support: Up to DDR4-2666 with 72-bit ECC
- Memory Controllers: 4 independent memory controllers
- HBM2 Support: High Bandwidth Memory integration ready
Pricing Information
The XCKU9P-2FFVE900I pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized distributors for current pricing:
- Single Unit Price: Contact for quote
- Volume Pricing: Available for 100+ units
- Lead Time: 12-16 weeks (standard)
- Minimum Order Quantity: 1 unit
- Availability: Production status
Note: Prices subject to change. Contact AMD Xilinx or authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Product Brief: XCKU9P-2FFVE900I overview and key features
- Datasheet: Complete electrical specifications and characteristics
- User Guide: Kintex UltraScale+ FPGAs configuration guide
- Package and Pinout Specifications: FFVE900 package details
- PCB Design Guidelines: Layout recommendations and constraints
Development Resources
- Vivado Design Suite: Complete development environment
- IP Catalog: Pre-verified IP cores and reference designs
- Application Notes: Implementation guides and best practices
- Evaluation Boards: Development and prototyping platforms
Software Tools
- Vivado ML: Machine learning-optimized design tools
- Vitis: Unified software platform for application development
- Hardware Manager: Device programming and debugging tools
Related Resources
Compatible Products
- Development Boards: VCU118, VCU128 evaluation platforms
- Memory Modules: DDR4 SODIMM and RDIMM compatible modules
- Clock Solutions: Low-jitter clock generators and oscillators
- Power Management: Efficient power delivery solutions
Reference Designs
- 5G Wireless: Beamforming and massive MIMO implementations
- Video Processing: 4K/8K video codec and streaming solutions
- Machine Learning: CNN and DNN acceleration frameworks
- High-Speed Networking: 100G/400G Ethernet implementations
Support Resources
- Technical Support: AMD Xilinx technical support portal
- Community Forums: Developer discussion and knowledge sharing
- Training Programs: Online and instructor-led training courses
- Application Engineering: Custom design consultation services
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU RoHS directive requirements
- REACH Compliant: Complies with EU REACH regulation
- Conflict Minerals: Conflict-free sourcing certification
- ISO 14001: Environmental management system certified
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters above sea level
Export Control Information
- ECCN Classification: 3A001.a.2 (US Export Administration Regulations)
- Country of Origin: Various (check specific part marking)
- Export License: May require export license for certain destinations
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
Quality and Reliability
- Qualification Standards: Automotive AEC-Q100 Grade 2
- MTBF: >1,000,000 hours at 55ยฐC
- Quality System: ISO 9001:2015 certified manufacturing
- Traceability: Full component traceability and lot tracking
Key Applications
The XCKU9P-2FFVE900I excels in applications requiring high-performance signal processing, including 5G wireless infrastructure, aerospace and defense systems, machine learning acceleration, high-speed networking equipment, and advanced driver assistance systems (ADAS).
Conclusion
The XCKU9P-2FFVE900I represents the pinnacle of FPGA technology, combining exceptional processing power with advanced connectivity features. Its robust architecture and comprehensive development ecosystem make it an ideal choice for next-generation applications demanding maximum performance and flexibility.
For technical support and additional information about the XCKU9P-2FFVE900I, contact AMD Xilinx or visit the official product page.
