The XCKU9P-1FFVE900I represents AMD Xilinx’s flagship Kintex UltraScale+ FPGA, delivering exceptional processing power and versatility for demanding applications. This advanced programmable logic device combines high-performance computing capabilities with energy efficiency, making it ideal for aerospace, defense, communications, and industrial automation projects.
Product Specifications
The XCKU9P-1FFVE900I features robust specifications designed for complex digital signal processing and high-speed data applications:
Core Architecture:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,286,000
- CLB LUTs: 573,000 6-input lookup tables
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 45 Mb integrated UltraRAM blocks
DSP and Processing:
- DSP Slices: 2,520 DSP48E2 slices
- Maximum DSP performance for signal processing applications
- Advanced multiply-accumulate functionality
I/O and Connectivity:
- Package: FFVE900 (900-pin flip chip BGA)
- High-speed serial transceivers for multi-gigabit communication
- PCIe Gen3/Gen4 support
- DDR4-2666 memory interface support
Speed Grade: -1 (commercial temperature range) Operating Temperature: 0ยฐC to +85ยฐC (Industrial grade I-suffix)
Pricing Information
The XCKU9P-1FFVE900I pricing varies based on quantity and distribution channel. Contact authorized AMD Xilinx distributors for current pricing on the XCKU9P-1FFVE900I. Volume discounts are typically available for orders exceeding 100 units. Lead times may vary depending on global semiconductor availability.
Documents & Media
Technical Documentation:
- XCKU9P-1FFVE900I Product Brief and Datasheet
- Kintex UltraScale+ FPGA Data Sheet (DS892)
- Packaging and Pinout Specifications
- Power and Thermal Design Guidelines
- Migration and Compatibility Guides
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Development board recommendations
- Programming and configuration guides
Media Resources:
- High-resolution product images
- Block diagrams and architecture overviews
- Application demonstration videos
- Webinar recordings on XCKU9P-1FFVE900I implementation
Related Resources
Development Tools:
- Vivado Design Suite (required for XCKU9P-1FFVE900I development)
- Vitis Unified Software Platform
- Hardware debugging tools and analyzers
Evaluation Platforms:
- Compatible evaluation boards featuring the XCKU9P-1FFVE900I
- Development kits and starter platforms
- Reference design repositories
Support Resources:
- AMD Xilinx Community Forums
- Technical support portal access
- Training courses and certification programs
- Application engineering consultation services
Compatible Products:
- Other Kintex UltraScale+ family devices
- Zynq UltraScale+ alternatives for embedded applications
- Memory and connectivity solutions optimized for XCKU9P-1FFVE900I
Environmental & Export Classifications
Environmental Compliance: The XCKU9P-1FFVE900I meets stringent environmental standards:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting template available
- ISO 14001 certified manufacturing facilities
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- HTS Classification: 8542.33.0001
- Country of Origin: Various (check specific lot documentation)
- Export licensing may be required for certain destinations
Quality Standards:
- Automotive grade options available (contact for XCKU9P-1FFVE900I-AES variants)
- Military temperature range versions under separate part numbers
- Quality management system ISO 9001 certified
- Reliability testing per JEDEC standards
Packaging Information:
- Moisture sensitivity level (MSL): Level 3
- Storage requirements: controlled temperature and humidity
- ESD sensitive device – proper handling required
- Tape and reel packaging available for automated assembly
The XCKU9P-1FFVE900I delivers cutting-edge FPGA performance while maintaining compliance with global environmental and export regulations, ensuring seamless integration into worldwide supply chains and applications.
