The XCKU5P-2SFVB784E is a premium AMD (formerly Xilinx) Kintex UltraScale+ FPGA designed for demanding applications requiring exceptional price/performance/power balance. This advanced field programmable gate array features 20nm FinFET technology with 474,600 logic cells, -2 speed grade, and extended temperature range operation in a 784-pin FCBGA package.
1. Product Specifications
Core Architecture
- Device Family: AMD Kintex UltraScale+ FPGAs
- Technology Node: 20nm FinFET technology
- Logic Cells: 474,600 cells
- Speed Grade: -2 speed grade
- Core Voltage: 0.85V (standard operation)
Package & Environmental Specifications
- Package Type: 784-pin FCBGA (Flip Chip Ball Grid Array)
- Temperature Range: Extended temperature (-40°C to +100°C)
- I/O Count: 304 I/O pins
- Package Form: Tray packaging
Key Features
- Best price/performance/watt balance in FinFET node
- Power options that deliver optimal balance between required system performance and smallest power envelope
- Advanced DSP capabilities for signal processing applications
- High-speed transceiver support for connectivity applications
- Ideal for packet processing and DSP-intensive functions
- Applications ranging from wireless MIMO technology to Nx100G networking and data center
Memory & Logic Resources
- Block RAM: 16,900 Kbit total capacity
- DSP Slices: Optimized for high-performance signal processing
- CLB Count: 216,960 configurable logic blocks
- UltraRAM: On-chip memory to reduce BOM costs
2. Pricing Information
The XCKU5P-2SFVB784E pricing varies based on quantity, availability, and distributor. Pricing and lead time depend on quantity required, availability, and warehouse location. Contact authorized distributors for current pricing:
- Quantity Pricing: Volume discounts available for bulk orders
- Lead Time: Varies by distributor and stock availability
- Availability: Available through authorized electronic component distributors
- Stock Status: Check with distributors for real-time inventory
For accurate pricing and availability, contact authorized AMD/Xilinx distributors or submit RFQ requests through electronic component suppliers.
3. Documents & Media
Official Documentation
- Product Datasheet: Complete technical specifications and electrical characteristics
- Pin-out Files: Available in TXT and CSV formats
- Package Files: Mechanical drawings and thermal specifications
- User Guides: Implementation and design guidelines
- Application Notes: Best practices and design examples
Development Resources
- Vivado Design Suite: Primary development environment
- IP Cores: Pre-verified intellectual property blocks
- Reference Designs: Sample implementations and starting points
- Evaluation Boards: Development platforms for prototyping
Technical Support
- Design methodology guides
- Power estimation tools
- Timing analysis documentation
- Migration guides from previous generations
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA design environment
- System Generator: High-level synthesis tools
- PetaLinux: Embedded Linux development
- Vitis Unified Software Platform: Software development environment
Compatible IP Cores
- High-speed connectivity cores (100G Ethernet, PCIe)
- Signal processing cores (FFT, FIR filters)
- Video processing IP
- Security and encryption cores
- Memory interface controllers
Application Areas
- 5G Wireless Infrastructure: Wireless MIMO technology applications
- Data Center Acceleration: Nx100G networking and data center applications
- Industrial Automation: High-performance control systems
- Aerospace & Defense: Mission-critical applications
- Medical Imaging: Real-time signal processing
- Automotive: Advanced driver assistance systems
Training & Education
- AMD technical training courses
- University program resources
- Online learning modules
- Certification programs
5. Environmental & Export Classifications
Export Control Information
- ECCN Classification: 3A991.d (Export Control Classification Number)
- Jurisdiction: U.S. Department of Commerce Export Administration Regulations (EAR)
- License Requirements: May require export license for certain destinations
- End-Use Restrictions: Subject to dual-use technology controls
Trade Classifications
- USHTS Code: 8542390001 (U.S. Harmonized Tariff Schedule)
- TARIC Code: 8542399000 (EU tariff classification)
- Country of Origin: Varies by manufacturing location
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Compliance: European chemical regulation compliance
- Conflict Minerals: Responsibly sourced materials
- ISO 14001: Environmental management system compliance
Safety & Quality Standards
- Operating Temperature: Extended range (-40°C to +100°C)
- Storage Temperature: -65°C to +150°C
- Humidity: 5% to 85% relative humidity (non-condensing)
- Quality Standards: ISO 9001 certified manufacturing
Packaging & Handling
- ESD Protection: Electrostatic discharge sensitive device
- Moisture Sensitivity: Level 3 (168 hours at 30°C/60% RH)
- Package Marking: Full traceability information
- Shelf Life: 12 months in original packaging
Note: The XCKU5P-2SFVB784E represents AMD’s commitment to delivering high-performance, power-efficient FPGA solutions. As part of the Kintex UltraScale+ family, it provides the most cost-effective solution for high-end capabilities including transceiver and memory interface line rates, as well as 100G connectivity cores.
For the latest specifications, pricing, and availability information, consult official AMD documentation or contact authorized distributors.
