The XCKU3P-L1FFVB676I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and industrial automation.
Product Specifications
The XCKU3P-L1FFVB676I features advanced 20nm UltraScale+ architecture that provides optimal power efficiency and performance. This FPGA incorporates 356,160 logic cells and 1,824 DSP slices, making it ideal for complex signal processing and data acceleration tasks. The device includes 19.1 Mb of block RAM and supports multiple I/O standards for flexible system integration.
Key specifications of the XCKU3P-L1FFVB676I include a FFVB676 package type with 676 pins, enabling extensive connectivity options. The device operates across commercial and extended temperature ranges, ensuring reliable performance in various environmental conditions. With its advanced clocking resources and high-speed transceivers, this FPGA supports data rates up to 32.75 Gbps per channel.
The XCKU3P-L1FFVB676I integrates hardened IP blocks including PCIe Gen3 controllers and Ethernet MAC, reducing development time and improving system performance. The device supports DDR4 memory interfaces up to 2400 Mbps, providing high-bandwidth memory access for data-intensive applications.
Price
Pricing for the XCKU3P-L1FFVB676I varies based on quantity, delivery requirements, and current market conditions. Contact authorized distributors or AMD Xilinx directly for current pricing information and volume discounts. Educational institutions and qualifying research organizations may be eligible for special academic pricing programs.
Documents & Media
Comprehensive documentation for the XCKU3P-L1FFVB676I includes detailed datasheets, user guides, and application notes available through AMD Xilinx’s official documentation portal. The product documentation package features pin-out diagrams, electrical characteristics, timing specifications, and design guidelines essential for successful implementation.
Technical resources include reference designs, example projects, and development board schematics that accelerate design cycles. Video tutorials and webinar recordings provide additional guidance for developers working with the XCKU3P-L1FFVB676I. Software tools including Vivado Design Suite offer complete development environment support for this FPGA.
Related Resources
The XCKU3P-L1FFVB676I ecosystem includes compatible development boards, evaluation kits, and reference platforms that streamline prototyping and development processes. Popular development platforms support this FPGA with pre-configured interfaces and example designs.
Third-party IP cores and design services specifically optimized for the XCKU3P-L1FFVB676I are available through AMD Xilinx partner programs. Training courses and certification programs help engineers maximize their proficiency with this advanced FPGA technology.
Community forums and technical support resources provide ongoing assistance for XCKU3P-L1FFVB676I implementation challenges. Regular software updates and IP core releases ensure continued compatibility and feature enhancements.
Environmental & Export Classifications
The XCKU3P-L1FFVB676I meets stringent environmental standards including RoHS compliance and REACH regulations. The device is manufactured using environmentally responsible processes and materials that minimize ecological impact while maintaining high reliability standards.
Export classification for the XCKU3P-L1FFVB676I follows applicable international trade regulations and export control laws. Customers should verify current export restrictions and licensing requirements based on their specific application and destination country. The device classification may affect availability in certain regions or for specific end-use applications.
Temperature qualification ranges from commercial (0ยฐC to 85ยฐC) to extended (-40ยฐC to 100ยฐC) operating conditions, ensuring reliable operation across diverse deployment environments. The XCKU3P-L1FFVB676I undergoes comprehensive qualification testing including thermal cycling, humidity exposure, and mechanical stress validation to ensure long-term reliability.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade reliability testing where applicable. The device supports various quality grades to meet different application requirements and reliability expectations.
The XCKU3P-L1FFVB676I represents AMD Xilinx’s commitment to delivering high-performance, energy-efficient FPGA solutions for next-generation applications requiring advanced processing capabilities and flexible implementation options.
