Product Specification
The XCKU3P-2FFVB676I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s acclaimed Kintex UltraScale+ family. This advanced FPGA delivers the optimal balance between system performance and power efficiency, making it ideal for demanding applications requiring superior processing capabilities.
Key Technical Specifications
Core Architecture:
- FPGA Family: Kintex UltraScale+
- Part Number: XCKU3P-2FFVB676I
- Logic Elements: 355,950 cells
- Speed Grade: -2 (Industrial temperature range)
- Manufacturing Process: 20nm technology node
Memory & Storage:
- Block RAM (BRAM): 12.7 Mbit embedded block RAM
- Distributed RAM: 4.7 Mbit
- UltraRAM: On-chip UltraRAM memory for reduced BOM cost
I/O & Connectivity:
- Total I/O Pins: 280 user I/O pins
- Package Type: 676-pin FCBGA (Flip Chip Ball Grid Array)
- Transceivers: 16 high-speed transceivers
- Data Rate: Up to 32.75 Gb/s
Power & Operating Conditions:
- Core Supply Voltage (VCCINT): 0.825V – 0.876V (typical 0.85V)
- I/O Supply Voltage: 3.3V
- Operating Temperature Range: -40ยฐC to +100ยฐC (TJ)
- Maximum Operating Frequency: 775MHz
Physical Characteristics:
- Package: 676-BBGA, FCBGA surface mount
- Mounting Type: Surface Mount Technology (SMT)
- Logic Blocks: 162,720 configurable logic blocks (CLBs)
Clock Management:
- Mixed-Mode Clock Manager (MMCM)
- Phase-Locked Loop (PLL) support
- Advanced clock distribution network
Price Information
The XCKU3P-2FFVB676I pricing varies by quantity and distributor. Recent market data indicates:
- Reference Price: Approximately $2,387.43 USD (single unit)
- Lead Time: Typically 25 weeks from major distributors
- Availability: Active product status with global distribution
- Packaging: Standard tray packaging for volume orders
Note: Due to semiconductor market fluctuations since 2021, prices are subject to change. Contact authorized distributors for current pricing and volume discounts. The XCKU3P-2FFVB676I is available from major distributors including DigiKey, Mouser, Newark, and other authorized AMD Xilinx partners.
Documents & Media
Technical Documentation
- Official Datasheet: XCKU3P-2FFVB676I PDF datasheet available from AMD Xilinx
- Product Change Notifications: Available through authorized distributors
- Package Pinout Files: ASCII and CSV format files available
- User Guide: UG575 – UltraScale and UltraScale+ Package Information
Design Resources
- CAD Models: Symbol and footprint files available via SnapEDA
- Technical Specifications: Complete electrical and timing characteristics
- Application Notes: Design guides for Kintex UltraScale+ implementation
- Reference Designs: Available through AMD Xilinx support portal
Development Tools
- Vivado Design Suite: Primary development environment for XCKU3P-2FFVB676I
- Programming Tools: Vivado synthesis and implementation tools
- Evaluation Boards: Various development boards supporting XCKU3P family
Related Resources
Compatible Development Platforms
- Kintex UltraScale+ Evaluation Kits
- XCKU3P Development Boards
- Reference Design Platforms
- Starter Kits for Rapid Prototyping
Application Areas
The XCKU3P-2FFVB676I excels in:
- Wireless MIMO Technology: Advanced antenna processing
- Nx100G Networking: High-speed data center applications
- Packet Processing: Network infrastructure equipment
- DSP-Intensive Functions: Digital signal processing applications
- Data Center Acceleration: Compute-intensive workloads
Speed Grade Options
The XCKU3P family offers multiple speed grades:
- -3/-3E: Highest performance variants
- -2/-2I: Industrial temperature range (XCKU3P-2FFVB676I)
- -1/-1I: Standard performance options
- -2LE/-1LI: Low-power variants supporting dual voltage operation
Alternative Part Numbers
- XCKU3P-2FFVB676E: Extended temperature range variant
- XCKU3P-1FFVB676I: -1 speed grade option
- XCKU3P-3FFVB676E: Highest performance variant
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant
- SVHC: No SVHC (15-Jan-2019) – Substance of Very High Concern free
- REACH Compliant: Meets European chemical regulations
- Lead-Free: Complies with lead-free manufacturing standards
Export Control Classifications
- ECCN (Export Control Classification Number): 3A991.d
- USHTS (US Harmonized Tariff Schedule): 8542390001
- TARIC (EU Tariff Code): 8542399000
- CNHTS (China Harmonized Tariff Schedule): 8542399000
Quality & Reliability
- Product Status: Active and in production
- Quality Standard: Meets AMD Xilinx quality specifications
- Warranty: 12 months from date of purchase
- Traceability: Full supply chain traceability maintained
Shipping & Handling
- ESD Protection: Anti-static packaging for all shipments
- Moisture Sensitivity: Appropriate handling for semiconductor storage
- Global Distribution: Available through worldwide authorized distributors
Keywords: XCKU3P-2FFVB676I, AMD Xilinx FPGA, Kintex UltraScale+, 355950 logic elements, 676-FCBGA, industrial temperature FPGA, high-speed transceivers, networking FPGA, DSP processing, MIMO technology
