The XCKU3P-2FFVB676E is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional price-performance-power balance for demanding applications including wireless MIMO technology, Nx100G networking, and data center acceleration.
Product Specifications
Core Architecture
- Family: Kintex UltraScale+ XCKU3P Series
- Technology Node: 20nm FinFET process
- Logic Elements: 355,950 macrocells
- Logic Blocks: 162,720 configurable logic blocks (CLBs)
- Speed Grade: -2 (maximum operating frequency: 775MHz)
Memory and Storage
- Total RAM: 12,700 Kbit (1.7 MB)
- Block RAM: Advanced UltraRAM technology
- Memory Interfaces: High-speed DDR3/DDR4 support
Input/Output Specifications
- I/O Count: 280 user I/O pins
- Package Type: FCBGA-676 (Flip-Chip Ball Grid Array)
- Pin Count: 676 pins total
- I/O Voltage: 3.3V nominal
Power Requirements
- Core Voltage: 0.85V (825mV – 876mV range)
- Power Optimization: Advanced power management features for optimal performance-per-watt
Clock Management
- Clock Resources: Mixed-Mode Clock Manager (MMCM) and Phase-Locked Loop (PLL)
- Clock Distribution: Advanced clock tree architecture
Operating Conditions
- Operating Temperature Range: 0ยฐC to 100ยฐC (TJ – Junction Temperature)
- Commercial temperature grade: Standard operating conditions
Key Features
- Advanced DSP Processing: Optimized for signal processing applications
- Packet Processing: Ideal for network acceleration and data center workloads
- Soft Processor Support: MicroBlazeโข soft processor compatibility
- High-Speed Connectivity: Next-generation transceivers for 100G+ applications
Price
Current Market Pricing (as of June 2025):
- Quantity 1-999: Contact for quote
- Quantity 1000+: $2,110.55 – $2,387.16 per unit
- Lead Time: 35 weeks estimated factory production time
Note: Pricing varies by distributor and quantity. Contact authorized distributors for current pricing and availability.
Authorized Distributors:
- Mouser Electronics
- DigiKey
- Element14/Newark
- Avnet
- OMO Electronic
Documents & Media
Technical Documentation
- Official Datasheet: Available from AMD Xilinx and authorized distributors
- Package Pinout Files: Available in TXT and CSV formats from Xilinx UltraScale package pinout files
- User Guide Reference: UG575 – UltraScale Package and Pinout Guide
- Product Change Notifications: Available through distributor portals
Design Resources
- ECAD Models: CAD models available for download
- Development Tools: Vivado Design Suite compatibility
- Reference Designs: Application-specific reference implementations
- Technical Support: 24/7 technical support through AMD Xilinx
Media Files
- Product Images: High-resolution package photos
- Block Diagrams: Architecture overview diagrams
- Application Notes: Implementation guidelines and best practices
Related Resources
Development Tools
- Vivado Design Suite: Complete design environment for UltraScale+ devices
- SDK/Vitis: Software development kit for embedded applications
- IP Catalog: Extensive library of verified IP cores
Evaluation Platforms
- Development Boards: Compatible evaluation and development platforms
- Reference Designs: Pre-built application examples
- Demo Applications: Ready-to-run demonstration projects
Training and Support
- Technical Documentation: Comprehensive user guides and tutorials
- Training Courses: Online and instructor-led training programs
- Community Forums: Technical support communities
- Application Engineering: Direct support from AMD Xilinx experts
Alternative Products
- XCKU5P-2FFVB676E: Higher-capacity variant in same package
- XCKU3P-1FFVB676E: Industrial temperature grade version
- Other UltraScale+ Devices: Family alternatives for different requirements
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Yes – RoHS Compliant
- SVHC Status: No SVHC (15-Jan-2019)
- Lead-Free: Compliant with lead-free manufacturing standards
- Halogen-Free: Available in halogen-free variants
Export Control Classifications
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- ECCN Classification: 3A991.d
- Export Restrictions: Subject to US Export Administration Regulations
Packaging and Handling
- ESD Protection: Anti-static packaging required
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating applies
- Storage Requirements: Controlled temperature and humidity storage
- Handling Procedures: ESD-safe handling protocols mandatory
Quality and Reliability
- Quality Standards: ISO 9001 manufacturing
- Reliability Testing: Extensive qualification testing
- Warranty: Standard manufacturer warranty terms
- Traceability: Full manufacturing traceability
The XCKU3P-2FFVB676E represents the cutting edge of FPGA technology, combining advanced 20nm manufacturing with proven UltraScale+ architecture to deliver optimal performance for next-generation applications in networking, data centers, and signal processing.
