The XCKU3P-1FFVD900I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, industrial automation, and high-performance computing.
Product Specifications
The XCKU3P-1FFVD900I features robust specifications that make it ideal for complex digital signal processing and high-speed data applications:
Core Architecture:
- Logic Cells: 356,160 system logic cells
- CLB Flip-Flops: 548,160
- CLB LUTs: 274,080
- Block RAM: 17.1 Mb total block RAM
- UltraRAM: 36 Mb distributed memory
- DSP Slices: 1,728 DSP48E2 slices
Package & Interface:
- Package Type: FFVD900 (900-pin Flip Chip BGA)
- Speed Grade: -1 (standard performance)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- I/O Pins: 520 user I/O pins
- Transceivers: 16 GTH transceivers supporting up to 16.3 Gbps
Performance Features:
- 16nm FinFET+ process technology
- Low power consumption with multiple power domains
- Advanced clocking capabilities with CMTs (Clock Management Tiles)
- PCIe Gen3 x8 and Gen4 x4 support
- DDR4-2666 memory interface support
Pricing Information
The XCKU3P-1FFVD900I pricing varies based on quantity and distribution channel. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders of 100+ units. Lead times may vary from 12-20 weeks depending on market conditions and inventory levels.
Documents & Media
Technical Documentation:
- XCKU3P-1FFVD900I Product Brief and Datasheet
- Kintex UltraScale+ Architecture Overview
- PCB Design Guidelines for FFVD900 package
- Power Estimation and Thermal Management Guide
- Programming and Configuration User Guide
Development Resources:
- Vivado Design Suite compatibility documentation
- Reference designs and application notes
- IP core compatibility matrix
- Constraint files and footprint information
Evaluation Tools:
- KCU116 Evaluation Board (compatible platform)
- Development kit documentation and tutorials
- Example projects and demonstrations
Related Resources
Compatible Products:
- XCKU5P-1FFVD900I (higher logic density option)
- XCKU9P-1FFVD900I (maximum performance variant)
- Supporting power management ICs and clock generators
- High-speed memory modules (DDR4, QDR-IV)
Development Tools:
- Vivado Design Suite (latest version recommended)
- Vitis unified software platform
- ChipScope Pro for debugging
- System Generator for DSP applications
Application Areas:
- 5G wireless infrastructure and base stations
- Video processing and broadcast equipment
- High-frequency trading systems
- Aerospace and defense applications
- Machine learning acceleration
- Software-defined radio (SDR) implementations
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Conflict minerals compliant
- Halogen-free package option available
Operating Conditions:
- Junction Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 85% non-condensing
- Altitude: Up to 2000m operational
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export licensing may be required for certain destinations
Quality & Reliability:
- Automotive grade options available (XCKU3P-1FFVD900E)
- JEDEC standards compliance
- Qualification testing per MIL-STD-883
- Extended temperature variants available
The XCKU3P-1FFVD900I represents an excellent balance of performance, power efficiency, and cost-effectiveness for mid-range FPGA applications requiring substantial logic resources and high-speed connectivity. Its proven architecture and comprehensive development ecosystem make it an ideal choice for accelerating time-to-market in complex digital designs.
