The XCKU3P-1FFVD900E is a cutting-edge field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in communications, aerospace, defense, and industrial automation.
Product Specification
The XCKU3P-1FFVD900E features advanced 16nm FinFET+ process technology, offering superior power efficiency and performance optimization. This FPGA incorporates 356,160 logic cells with 1,824 CLB slices, providing extensive programmable logic resources for complex digital signal processing applications.
Key specifications of the XCKU3P-1FFVD900E include 27 Mb of block RAM, 1,368 DSP slices for high-speed mathematical operations, and multiple high-speed transceivers supporting data rates up to 32.75 Gbps. The device comes in a 900-pin FFVD BGA package, measuring 35mm x 35mm, making it suitable for space-constrained designs while maintaining excellent thermal performance.
The XCKU3P-1FFVD900E operates across commercial temperature ranges (-40ยฐC to +100ยฐC) and supports multiple I/O standards including LVDS, SSTL, and high-speed differential signaling. With its -1 speed grade, this FPGA delivers optimal timing performance for time-critical applications.
Price
Pricing for the XCKU3P-1FFVD900E varies based on quantity, distribution channel, and current market conditions. Contact authorized distributors or AMD Xilinx directly for current pricing information and volume discounts. Educational institutions and qualifying research organizations may be eligible for special academic pricing programs.
Documents & Media
Comprehensive technical documentation for the XCKU3P-1FFVD900E is available through AMD Xilinx’s official website, including detailed datasheets, user guides, and application notes. Key resources include the Kintex UltraScale+ Data Sheet (DS922), PCB Design Guide, and Power Estimation Methodology documentation.
Development tools such as Vivado Design Suite provide complete support for the XCKU3P-1FFVD900E, including synthesis, implementation, and debugging capabilities. Reference designs, IP cores, and evaluation boards are available to accelerate development cycles and reduce time-to-market.
Related Resources
The XCKU3P-1FFVD900E is supported by a comprehensive ecosystem of development tools, IP libraries, and third-party solutions. Vivado Design Suite offers advanced design entry, synthesis, and implementation flows specifically optimized for Kintex UltraScale+ devices.
Compatible evaluation boards and development kits enable rapid prototyping and validation of XCKU3P-1FFVD900E designs. Third-party IP providers offer specialized functions including video processing, communications protocols, and signal processing algorithms optimized for this FPGA architecture.
Training resources, webinars, and community forums provide ongoing support for engineers working with the XCKU3P-1FFVD900E. AMD Xilinx’s Alliance Partner Program connects users with qualified design service providers and system integrators.
Environmental & Export Classifications
The XCKU3P-1FFVD900E complies with RoHS (Restriction of Hazardous Substances) directives and is manufactured using lead-free processes. The device meets JEDEC standards for moisture sensitivity and electrostatic discharge protection, ensuring reliable operation in various environmental conditions.
Export classification for the XCKU3P-1FFVD900E follows standard semiconductor export control regulations. Users should verify current export requirements and restrictions based on their specific application and destination country. The device is typically classified under ECCN (Export Control Classification Number) 3A001 for general commercial applications.
Environmental operating specifications include commercial temperature grades with optional industrial and extended temperature variants available. The XCKU3P-1FFVD900E is designed for long-term reliability with comprehensive qualification testing including thermal cycling, humidity exposure, and accelerated aging protocols.
The XCKU3P-1FFVD900E represents AMD Xilinx’s commitment to delivering high-performance, energy-efficient FPGA solutions for next-generation electronic systems across multiple industries and applications.
