Product Overview
The XCKU3P-1FFVA676I is a high-performance Field Programmable Gate Array (FPGA) manufactured by AMD Xilinx, part of the acclaimed Kintex UltraScale+ family. This advanced FPGA delivers exceptional performance-per-watt efficiency in a compact 676-pin FCBGA package, making it ideal for demanding applications in wireless communications, networking, and data center infrastructure.
1. Product Specifications
Core Architecture
- Part Number: XCKU3P-1FFVA676I
- Family: Kintex UltraScale+ FPGA
- Manufacturer: AMD Xilinx
- Process Technology: 20nm FinFET
- Speed Grade: -1 (Industrial temperature range)
Logic Resources
- Configurable Logic Blocks (CLBs): 162,720 blocks
- Total Logic Cells: 355,950 macrocells
- Lookup Tables (LUTs): High-density 6-input LUTs
- Flip-Flops: Dedicated registers for sequential logic
Memory Resources
- Block RAM: 12,700 Kbit total capacity
- UltraRAM: On-chip high-density memory blocks
- Distributed RAM: Additional memory resources within CLBs
Package & I/O
- Package Type: 676-pin Flip Chip Ball Grid Array (FCBGA)
- Total I/O Pins: 256 user I/O
- Package Size: Compact form factor optimized for high-density applications
- Pin Count: 676 total pins
Power Specifications
- Core Voltage (VCCINT): 0.85V nominal
- I/O Voltage: Multiple voltage standards supported
- Power Optimization: Multiple power modes for optimal efficiency
- Static Power: Optimized for low standby consumption
Operating Conditions
- Temperature Range: Industrial (-40ยฐC to +100ยฐC)
- Speed Grade Performance: -1 grade provides balanced performance and power
- Voltage Tolerance: Industrial-grade voltage specifications
2. Pricing Information
Market Pricing
The XCKU3P-1FFVA676I pricing varies based on quantity, distributor, and market conditions. Current market intelligence shows:
- Unit Pricing: Contact authorized distributors for current quotes
- Volume Discounts: Available for quantities over standard minimums
- Price Monitoring: Real-time price tracking available through electronic component suppliers
- Regional Variations: Pricing may vary by geographic location and local distributor networks
Pricing Factors
- Lead times and availability
- Order quantity and volume breaks
- Distributor relationships
- Market demand fluctuations
- Currency exchange rates
Note: For the most current XCKU3P-1FFVA676I pricing, contact authorized AMD Xilinx distributors or submit a request for quotation (RFQ) through electronic component distribution networks.
3. Documents & Media
Technical Documentation
- Official Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines
- Package Files: Pinout and mechanical drawings
- Design Files: Reference designs and application notes
Software Tools
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified intellectual property cores
- System Generator: Model-based design tools
- SDSoC Development Environment: System-level optimization tools
Application Resources
- Reference Designs: Proven implementation examples
- Application Notes: Best practices and design guidelines
- White Papers: Technical deep-dive documentation
- Video Tutorials: Step-by-step implementation guides
Support Materials
- Errata Documents: Known issues and workarounds
- Migration Guides: Transition from previous generations
- Thermal Guidelines: Heat dissipation and cooling recommendations
- Layout Guidelines: PCB design best practices
4. Related Resources
Development Platforms
- Evaluation Boards: Purpose-built development platforms
- Starter Kits: Complete development ecosystems
- Third-Party Boards: Partner-developed solutions
- Custom Solutions: Application-specific implementations
Compatible Products
- Memory Interfaces: DDR4, LPDDR4, QDR-IV support
- High-Speed Transceivers: Multi-gigabit serial connectivity
- Clock Management: Advanced PLL and clock distribution
- Power Management: Integrated power solutions
Design Services
- Technical Support: Expert engineering assistance
- Training Programs: Comprehensive educational resources
- Consulting Services: Professional design guidance
- Community Forums: Peer-to-peer technical discussions
Software Ecosystem
- IP Portfolio: Extensive library of verified cores
- Partner Solutions: Third-party IP and tools
- Open Source Tools: Community-developed resources
- Cloud-Based Development: Remote design capabilities
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Restriction of Hazardous Substances certified
- REACH Compliance: European chemical regulation conformity
- Conflict Minerals: Responsible sourcing verification
- Green Manufacturing: Environmentally conscious production processes
Export Control Classifications
- ECCN (Export Control Classification Number): 3A991.d
- HTS (Harmonized Tariff Schedule): 8542390001 (US)
- TARIC: 8542399000 (European Union)
- Export Restrictions: Subject to applicable export control regulations
Quality Standards
- ISO Certifications: Quality management system compliance
- Automotive Grade: AEC-Q100 qualified variants available
- Military Standards: MIL-STD specifications where applicable
- Industrial Certifications: IEC and other international standards
Packaging & Shipping
- Moisture Sensitivity Level (MSL): Level 3 classification
- Anti-Static Packaging: ESD protection during transport
- Tray Packaging: Standard industrial packaging format
- Global Distribution: Worldwide availability through authorized channels
Key Applications
The XCKU3P-1FFVA676I excels in demanding applications including:
- Wireless Infrastructure: 5G base stations and MIMO technology
- Networking Equipment: 100G+ Ethernet and packet processing
- Data Center Acceleration: AI/ML inference and data analytics
- Video Processing: 4K/8K encoding and real-time streaming
- Industrial Automation: Real-time control and monitoring systems
- Test & Measurement: High-speed signal processing and analysis
Why Choose XCKU3P-1FFVA676I?
Superior Performance: Advanced 20nm FinFET technology delivers exceptional speed and efficiency
Optimal Balance: Best-in-class performance-per-watt ratio for power-sensitive applications
Proven Reliability: Industrial-grade specifications ensure reliable operation in demanding environments
Comprehensive Ecosystem: Complete development tools and extensive IP library accelerate time-to-market
Future-Ready: Scalable architecture supports evolving application requirements
For technical support, pricing inquiries, or additional information about the XCKU3P-1FFVA676I, contact your local AMD Xilinx distributor or authorized sales representative.
