The XCKU15P-2FFVE1517E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing markets.
Product Specifications
The XCKU15P-2FFVE1517E features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 1,143,000 system logic cells with 38,040 configurable logic blocks (CLBs) and 5,520 DSP slices for intensive signal processing applications.
Key specifications of the XCKU15P-2FFVE1517E include:
- Logic Cells: 1,143,000 system logic cells
- Block RAM: 75.9 Mb total block RAM memory
- UltraRAM: 45 Mb of UltraRAM for large memory requirements
- DSP Slices: 5,520 DSP48E2 slices supporting up to 928 GHz DSP performance
- Package: FFVE1517 (1517-pin flip chip BGA)
- Speed Grade: -2 (high performance)
- I/O Pins: 832 user I/O pins
- Transceivers: 32 GTY transceivers supporting up to 32.75 Gbps
- PCIe: Integrated PCIe Gen4 x16 endpoint and root port
The XCKU15P-2FFVE1517E operates across commercial temperature ranges and supports multiple voltage standards, making it suitable for diverse application environments.
Price
Pricing for the XCKU15P-2FFVE1517E varies based on quantity, distribution channel, and market conditions. Contact authorized distributors or AMD Xilinx directly for current pricing information. Volume discounts are typically available for large quantity orders. The XCKU15P-2FFVE1517E represents premium pricing within the Kintex UltraScale+ portfolio due to its high logic density and advanced features.
Documents & Media
Comprehensive documentation supports the XCKU15P-2FFVE1517E development process:
Datasheets: The official XCKU15P-2FFVE1517E datasheet provides detailed electrical specifications, pinout information, and performance characteristics. DC and switching characteristics are thoroughly documented for design validation.
User Guides: Kintex UltraScale+ FPGAs User Guide covers architecture details, clocking resources, memory interfaces, and configuration options specific to the XCKU15P-2FFVE1517E.
Package Information: FFVE1517 package drawings, thermal specifications, and mechanical dimensions are available in dedicated package documentation.
Development Tools: Vivado Design Suite documentation includes tutorials and reference designs optimized for the XCKU15P-2FFVE1517E architecture.
Application Notes: Specialized application notes cover topics like high-speed design techniques, power management, and signal integrity considerations for XCKU15P-2FFVE1517E implementations.
Related Resources
The XCKU15P-2FFVE1517E ecosystem includes extensive development resources:
Development Boards: Several evaluation platforms feature the XCKU15P-2FFVE1517E, enabling rapid prototyping and design validation. These boards typically include high-speed connectors, memory interfaces, and debugging capabilities.
IP Cores: AMD Xilinx IP catalog provides pre-verified IP cores optimized for the XCKU15P-2FFVE1517E, including communication protocols, signal processing functions, and interface controllers.
Reference Designs: Complete reference designs demonstrate XCKU15P-2FFVE1517E capabilities in applications like 5G wireless infrastructure, video processing, and machine learning acceleration.
Third-Party Solutions: Partner ecosystem offers specialized tools, IP, and services supporting XCKU15P-2FFVE1517E development, including high-level synthesis tools and verification platforms.
Training Resources: Online training modules and workshops provide in-depth coverage of XCKU15P-2FFVE1517E features and design methodologies.
Environmental & Export Classifications
The XCKU15P-2FFVE1517E meets stringent environmental and regulatory requirements:
RoHS Compliance: The XCKU15P-2FFVE1517E is fully RoHS compliant, meeting lead-free soldering requirements for commercial and industrial applications.
Temperature Ratings: Commercial grade devices operate from 0ยฐC to 85ยฐC junction temperature, while extended temperature variants support -40ยฐC to 100ยฐC operation.
Export Classification: The XCKU15P-2FFVE1517E carries specific Export Control Classification Numbers (ECCN) under U.S. export regulations. Verify current export classification requirements for international shipments.
Quality Standards: Manufacturing follows ISO 9001 quality management standards with comprehensive testing and qualification procedures ensuring XCKU15P-2FFVE1517E reliability.
Packaging: Lead-free packaging options support environmental compliance requirements while maintaining electrical performance and mechanical reliability standards.
The XCKU15P-2FFVE1517E represents the pinnacle of FPGA technology, combining high performance, advanced features, and comprehensive development support for next-generation system designs.
