The XCKU15P-1FFVA1760I is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and industrial markets.
Product Specification
The XCKU15P-1FFVA1760I features advanced 16nm FinFET+ technology, offering superior power efficiency and performance optimization. This FPGA incorporates 1,143,000 system logic cells and 5,520 DSP slices, making it ideal for complex signal processing and computation-intensive applications.
Key Technical Specifications:
- Logic Cells: 1,143,000 system logic cells
- Block RAM: 75.9 Mb total block RAM
- DSP Slices: 5,520 DSP58 slices
- Package Type: FFVA1760 (Fine pitch Flip Chip Array)
- Speed Grade: -1 (Standard performance)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- I/O Pins: 832 user I/O pins
- Transceivers: Up to 32 GTY transceivers at 32.75 Gbps
- PCIe Support: PCIe Gen4 x16 capability
The XCKU15P-1FFVA1760I supports advanced clocking resources with up to 24 clock management tiles (CMTs), ensuring precise timing control for high-speed applications. The device includes hardened IP blocks for Ethernet, Interlaken, and PCIe interfaces, reducing development time and improving system reliability.
Price
The XCKU15P-1FFVA1760I pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized distributors for current pricing information and volume discounts. Educational and prototyping discounts may be available for qualifying customers.
For accurate pricing on the XCKU15P-1FFVA1760I, request quotes from:
- Authorized AMD Xilinx distributors
- Electronic component suppliers
- Direct from AMD Xilinx sales representatives
Documents & Media
Technical Documentation for XCKU15P-1FFVA1760I:
- Product Data Sheet (DS892)
- Kintex UltraScale+ FPGAs Configuration User Guide
- Packaging and Pinout Specifications
- PCB Design Guidelines
- Thermal Design Guidelines
- Power Management User Guide
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Hardware debugging documentation
- Constraint files and example projects
Quality and Reliability:
- Product reliability reports
- Quality certifications
- Test specifications and procedures
Related Resources
Development Tools for XCKU15P-1FFVA1760I:
- Vivado Design Suite (required for development)
- Vitis Unified Software Platform
- ChipScope Pro debugging tools
- IP Catalog and reference designs
Evaluation Platforms:
- Kintex UltraScale+ development boards
- Third-party evaluation modules
- Prototyping platforms and starter kits
Support Resources:
- Technical support forums
- Application engineering support
- Training courses and webinars
- Community forums and user groups
Compatible Products:
- Other Kintex UltraScale+ family devices
- Zynq UltraScale+ MPSoCs
- Complementary power management ICs
- High-speed memory interfaces
Environmental & Export Classifications
Environmental Compliance: The XCKU15P-1FFVA1760I meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device is manufactured using environmentally responsible processes and materials.
Operating Conditions:
- Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Supply Voltage: Multiple voltage domains (0.85V to 1.8V)
- Humidity: Non-condensing environments
- Altitude: Up to 2000m operational
Export Classifications: The XCKU15P-1FFVA1760I is subject to export control regulations. Verify current export classification status before international shipment or use in controlled applications.
- ECCN: Check current Export Control Classification Number
- HTS Code: Harmonized Tariff Schedule classification
- Country Restrictions: May apply based on end-use and destination
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive quality standards compliance where applicable
- Military and aerospace grade options available
Package Information:
- Package Type: FFVA1760 Fine pitch BGA
- Dimensions: 42.5mm x 42.5mm
- Ball Pitch: 1.0mm
- Package Height: 2.5mm nominal
- Moisture Sensitivity: Level 3
The XCKU15P-1FFVA1760I represents cutting-edge FPGA technology, combining high performance with power efficiency for next-generation applications requiring advanced programmable logic capabilities.
