The XCKU13P-3FFVE900E is a cutting-edge Field-Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing markets.
Product Specifications
The XCKU13P-3FFVE900E features advanced 16nm FinFET+ technology, providing superior power efficiency and performance optimization. This FPGA incorporates 1,743,000 system logic cells with 2,520 DSP slices for intensive signal processing applications. The device includes 38.1 Mb of block RAM and 150.8 Mb of UltraRAM, enabling substantial on-chip memory capacity for complex data processing tasks.
Key specifications include:
- Package: FFVE900 (900-pin Flip-Chip Fine-Pitch BGA)
- Speed Grade: -3 (highest performance grade)
- I/O Pins: 520 user I/Os
- Transceivers: 32 GTY transceivers supporting up to 32.75 Gbps
- PCIe Support: PCIe Gen3 and Gen4 capability
- Operating Temperature: Extended commercial grade (0ยฐC to 85ยฐC)
Price Information
The XCKU13P-3FFVE900E pricing varies based on quantity, distribution channel, and current market conditions. For accurate pricing and availability, consult authorized AMD Xilinx distributors such as Digi-Key, Mouser Electronics, or Arrow Electronics. Volume pricing discounts are typically available for production quantities.
Documents & Media
Essential documentation for the XCKU13P-3FFVE900E includes:
Technical Documentation:
- Kintex UltraScale+ FPGAs Data Sheet (DS922)
- XCKU13P Device-Specific Product Brief
- Packaging and Pinout Specifications
- PCB Design Guidelines for FFVE900 Package
Development Resources:
- Vivado Design Suite compatibility guides
- Power estimation tools and calculators
- Thermal management application notes
- Signal integrity design recommendations
Reference Designs:
- Evaluation board schematics and layouts
- Sample HDL code and IP core implementations
- Performance benchmarking reports
Related Resources
Development Platforms:
- KCU116 Evaluation Board (compatible alternative for prototyping)
- Vivado Design Suite and Software Development Kit (SDK)
- IP Catalog with optimized cores for Kintex UltraScale+ architecture
Complementary Products:
- Compatible power management solutions
- High-speed connectors and interface components
- Cooling solutions for thermal management
- Programming and debugging tools
Technical Support:
- AMD Xilinx Forums and community resources
- Application engineering support services
- Training courses and certification programs
Environmental & Export Classifications
The XCKU13P-3FFVE900E complies with international environmental and regulatory standards:
Environmental Compliance:
- RoHS Directive 2011/65/EU compliant (lead-free)
- REACH Regulation compliance for restricted substances
- Conflict minerals reporting in accordance with SEC regulations
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- HTS (Harmonized Tariff Schedule) classification for international shipping
- Country-specific export licensing requirements may apply
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive AEC-Q100 qualification available for specific grades
- Military and aerospace screening options available
The XCKU13P-3FFVE900E represents the pinnacle of FPGA technology, combining exceptional performance, flexibility, and reliability for the most demanding applications. Its advanced architecture and comprehensive ecosystem support make it the ideal choice for next-generation system designs requiring high-performance programmable logic solutions.
