The XC7K325T-2FBG676C is a powerful field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, engineered to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing. This advanced FPGA combines superior processing capabilities with energy efficiency, making it an ideal choice for complex digital signal processing and high-speed data processing applications.
Product Specifications
The XC7K325T-2FBG676C features impressive technical specifications that set it apart in the FPGA market. This device incorporates 326,080 logic cells and 445 DSP slices, providing substantial computational resources for complex algorithms and signal processing tasks. The FPGA includes 16,020 CLB slices and 890 I/O pins, offering extensive connectivity options for diverse system architectures.
Built on advanced 28nm technology, the XC7K325T-2FBG676C delivers enhanced performance while maintaining power efficiency. The device supports DDR3-1866 memory interfaces and features integrated block RAM totaling 16,020 Kb, ensuring fast data access and storage capabilities. The FPGA operates at commercial temperature ranges and comes in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, providing robust thermal performance and reliable operation.
Key specifications include a speed grade of -2, indicating optimized performance characteristics for high-frequency applications. The device supports multiple I/O standards and voltage levels, making it compatible with various system requirements and legacy interfaces.
Price
Pricing for the XC7K325T-2FBG676C varies based on quantity, supplier, and market conditions. Enterprise customers typically receive volume discounts, while smaller quantities may be available through authorized distributors. For current pricing information and availability, contact authorized Xilinx distributors or semiconductor suppliers who can provide detailed quotations based on specific requirements and order volumes.
The XC7K325T-2FBG676C represents excellent value considering its extensive feature set and performance capabilities. When evaluating cost, consider the total system solution including development tools, support resources, and long-term availability commitments that contribute to overall project success.
Documents & Media
Comprehensive documentation supports XC7K325T-2FBG676C implementation and development. Essential resources include the official datasheet containing detailed electrical specifications, timing parameters, and pin configuration information. The Kintex-7 FPGA Data Sheet provides complete technical specifications, operating conditions, and performance characteristics specific to this device family.
Package and pinout documentation offers detailed mechanical drawings, pin assignments, and routing guidelines essential for PCB design and layout. User guides cover configuration methods, programming procedures, and best practices for optimal performance. Application notes demonstrate specific use cases and implementation techniques for common design patterns.
Xilinx provides extensive software documentation for Vivado Design Suite, the primary development environment for XC7K325T-2FBG676C projects. Training materials, video tutorials, and reference designs accelerate development cycles and help engineers maximize device capabilities.
Related Resources
The XC7K325T-2FBG676C ecosystem includes numerous development tools and resources that enhance design productivity. Vivado Design Suite provides comprehensive synthesis, implementation, and debugging capabilities specifically optimized for Kintex-7 devices. The software includes advanced timing analysis, power optimization tools, and integrated logic analyzers for thorough design verification.
Development boards and evaluation kits enable rapid prototyping and proof-of-concept development. These platforms typically include the XC7K325T-2FBG676C along with supporting components, interfaces, and example designs that demonstrate device capabilities. Reference designs cover common applications including digital signal processing, video processing, and high-speed communications.
Third-party IP cores and design services expand functionality and reduce development time. Certified IP providers offer optimized cores for specific applications, while design service partners provide expertise for complex implementations requiring specialized knowledge.
Environmental & Export Classifications
The XC7K325T-2FBG676C meets stringent environmental and regulatory standards required for commercial and industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing processes and materials selection.
Temperature specifications cover commercial operating ranges typically from 0ยฐC to +85ยฐC for junction temperature, with specific derating curves provided in technical documentation. The device undergoes comprehensive reliability testing including temperature cycling, humidity exposure, and mechanical stress testing to ensure long-term operational stability.
Export classification information is available through official channels, with specific ECCN (Export Control Classification Number) designations that may affect international shipping and distribution. Customers requiring export compliance documentation should consult with authorized distributors who can provide current classification status and any applicable restrictions.
