“We’ve trusted Rayming with multiple PCB orders, and they’ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC6VSX475T-2FFG1759E: High-Performance Virtex-6 SXT FPGA for Advanced Digital Signal Processing

Original price was: $20.00.Current price is: $19.00.

1. Product Specification

Core Architecture Specifications

  • Family: Virtex-6 SXT (Signal Processing Technology)
  • Logic Cells: 476,160 cells with advanced ASMBL™ architecture
  • Process Technology: 40nm CMOS fabrication process
  • Supply Voltage: 1.0V core with low-power 0.9V option available
  • Package: 1759-pin Fine-pitch Ball Grid Array (FCBGA)
  • Speed Grade: -2 (high-performance grade)
  • Temperature Grade: Extended (E) – Industrial temperature range
  • I/O Count: 840 user I/O pins

Memory and DSP Resources

  • Block RAM: High-density embedded memory blocks
  • DSP Slices: Advanced DSP48E1 slices for signal processing
  • Distributed RAM: Configurable logic block-based memory
  • MMCM/PLL: Mixed-Mode Clock Manager with advanced clocking features

Performance Characteristics

  • Operating Frequency: Up to 600+ MHz internal clock speeds
  • Power Consumption: 15% lower than competitive 40nm FPGAs
  • Performance Improvement: 15% higher performance vs. previous generation
  • Serial Transceivers: High-speed GTX transceivers (model dependent)

Key Features

  • Third-generation Advanced Silicon Modular Block (ASMBL™) architecture
  • Integrated Interface Blocks for PCI Express designs
  • Advanced clocking with zero-delay buffering and frequency synthesis
  • Superior signal integrity and timing closure
  • Compatible with Xilinx ISE Design Suite and Vivado Design Suite

2. Price

Current Market Pricing:

The XC6VSX475T-2FFG1759E pricing varies by distributor and quantity:

  • Small Quantities (1-10 units): Contact authorized distributors for current pricing
  • Volume Pricing: Significant discounts available for quantities over 100 units
  • Lead Time: Typically 6-12 weeks for standard orders
  • Availability Status: Available through authorized Xilinx/AMD distributors

Authorized Distributors:

  • Digi-Key Electronics
  • Avnet
  • Arrow Electronics
  • Mouser Electronics
  • Regional distributors worldwide

Note: Pricing fluctuates based on market conditions, availability, and order volume. Request quote (RFQ) for current pricing from authorized distributors.

3. Documents & Media

Official Documentation

  • Datasheet: DS150 – Virtex-6 Family Overview
  • User Guide: UG365 – Virtex-6 FPGA Packaging and Pinout Specifications
  • User Guide: UG366 – Virtex-6 FPGA Configuration
  • User Guide: UG361 – Virtex-6 FPGA SelectIO Resources
  • User Guide: UG362 – Virtex-6 FPGA Clocking Resources

Design Resources

  • Reference Designs: Available through Xilinx IP catalog
  • Application Notes: Signal processing and high-speed design guides
  • Development Boards: Virtex-6 FPGA ML605 Evaluation Kit
  • Software Tools: ISE Design Suite, Vivado Design Suite
  • IP Cores: Extensive library of DSP and connectivity IP

Media Resources

  • Product photos and package drawings
  • Pin-out diagrams and mechanical drawings
  • Thermal and power analysis tools
  • Design methodology guides
  • Video tutorials and webinars

4. Related Resources

Development Tools

  • Vivado Design Suite: Next-generation FPGA design environment
  • ISE Design Suite: Traditional FPGA development platform
  • SDK (Software Development Kit): For embedded processor development
  • ChipScope Pro: Integrated logic analyzer for debugging

Evaluation Platforms

  • ML605 Evaluation Kit: Comprehensive development platform
  • Virtex-6 FPGA Embedded Kit: Embedded system development
  • Custom carrier boards: Third-party development solutions

IP Portfolio

  • DSP IP: Digital filters, FFT/IFFT, and signal processing blocks
  • Connectivity IP: PCIe, Ethernet, and high-speed serial protocols
  • Video & Imaging IP: Video processing and image enhancement cores
  • Memory Controllers: DDR3/DDR2 and other memory interface IP

Technical Support

  • Community Forums: Xilinx Developer Community
  • Application Engineers: Regional technical support
  • Training Programs: FPGA design courses and certification
  • Design Services: Partner ecosystem for custom development

Competitive Analysis

  • Performance Benchmarks: Comparison with competing FPGA families
  • Migration Guides: Upgrading from previous Virtex generations
  • Alternative Solutions: Cross-reference with current AMD FPGA families

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Status: Non-compliant (contains restricted substances)
  • REACH Compliance: Contact manufacturer for REACH declaration
  • Conflict Minerals: Compliant with conflict minerals regulations
  • Packaging: Lead-free package assembly available in newer variants

RoHS Information

The XC6VSX475T-2FFG1759E does not comply with current RoHS (Restriction of Hazardous Substances) directives due to the presence of restricted materials typical in 40nm process technology from its era. For applications requiring RoHS compliance, newer generation FPGAs or RoHS-compliant variants should be considered.

Export Control Classification

  • ECCN (Export Control Classification Number): Consult current export control documentation
  • Country of Origin: Manufactured in various locations – check specific lot marking
  • Export Restrictions: Subject to U.S. export administration regulations
  • International Trade: Requires proper export licensing for certain destinations

Environmental Considerations

  • Operating Temperature: Extended commercial range (-40°C to +100°C)
  • Storage Temperature: -55°C to +150°C
  • Humidity: 85% relative humidity, non-condensing
  • ESD Sensitivity: Class 1 ESD sensitive device – proper handling required
  • Thermal Management: Advanced thermal design required for high-performance applications

Quality Standards

  • ISO Certification: Manufactured under ISO 9001 quality systems
  • Reliability Testing: Extensive qualification per JEDEC standards
  • Quality Grade: Industrial temperature and quality screening
  • Traceability: Full lot traceability and quality documentation available

Sustainability Initiatives

  • Lifecycle Assessment: Environmental impact documentation available
  • Recycling Programs: Participate in electronic waste recycling initiatives
  • Green Design: Energy-efficient operation reduces overall system power consumption
  • Supply Chain: Committed to responsible sourcing and manufacturing practices

Keywords: XC6VSX475T-2FFG1759E, Virtex-6 FPGA, AMD Xilinx, signal processing FPGA, 40nm FPGA, high-performance FPGA, digital signal processing, embedded systems, telecommunications FPGA, aerospace electronics

For the most current specifications, pricing, and availability of the XC6VSX475T-2FFG1759E, contact your local AMD/Xilinx authorized distributor or visit the official AMD Adaptive and Embedded Computing website.