Product Specifications
The XC6VSX475T-2FFG1759C features an impressive array of technical specifications that make it ideal for complex digital designs:
Logic Capacity & Performance:
- 475,520 logic cells providing extensive design flexibility
- Speed grade -2 for optimized performance-to-power ratio
- Advanced 40nm process technology for enhanced efficiency
- Up to 1,540 user I/O pins for comprehensive connectivity
Memory & DSP Resources:
- 38,304 Kb of block RAM for data storage and buffering
- 2,016 DSP48E1 slices for high-performance arithmetic operations
- Distributed RAM capabilities for additional memory requirements
- Built-in FIFO and shift register functionality
Package & Interface:
- FFG1759 package (Fine-pitch Ball Grid Array)
- 1759-pin configuration for maximum I/O density
- Support for multiple I/O standards including LVDS, DDR3, and PCIe
- High-speed serial transceivers for advanced connectivity
Clock Management:
- Multiple clock management tiles (CMTs)
- Phase-locked loops (PLLs) for precise clock generation
- Clock distribution networks for system synchronization
- Low-jitter performance for timing-critical applications
Price
The XC6VSX475T-2FFG1759C is positioned as a premium FPGA solution, with pricing reflecting its advanced capabilities and extensive feature set. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing may vary based on order quantity, delivery requirements, and specific customer agreements. The investment in the XC6VSX475T-2FFG1759C provides exceptional value for applications requiring high-performance processing and extensive I/O capabilities.
Documents & Media
Comprehensive technical documentation and support materials are available for the XC6VSX475T-2FFG1759C:
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- Pin-out diagrams and package mechanical drawings
- Power consumption analysis and thermal management guidelines
- Migration guides from previous FPGA generations
Design Resources:
- Vivado Design Suite compatibility information
- IP core integration guidelines
- Reference designs and application notes
- PCB layout recommendations and design rules
Software Support:
- ISE Design Suite development environment
- ChipScope Pro debugging tools
- Power analysis and optimization utilities
- Simulation models and timing files
Related Resources
The XC6VSX475T-2FFG1759C ecosystem includes various complementary products and resources:
Development Platforms:
- Evaluation boards featuring the XC6VSX475T-2FFG1759C
- Reference designs for common applications
- Debug and programming tools
- Third-party development solutions
Compatible Products:
- Memory interfaces and controllers
- High-speed connectivity IP cores
- DSP and communications IP libraries
- Power management solutions
Support Services:
- Technical support and consultation
- Training programs and certification courses
- Design review and optimization services
- Long-term availability programs for critical applications
Environmental & Export Classifications
The XC6VSX475T-2FFG1759C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant for lead-free manufacturing
- Operating temperature range: 0ยฐC to +85ยฐC (commercial grade)
- Storage temperature range: -65ยฐC to +150ยฐC
- Humidity tolerance up to 85% non-condensing
Quality & Reliability:
- Automotive-grade quality standards available
- Extended temperature variants for harsh environments
- Comprehensive reliability testing and qualification
- Long-term supply commitment for critical applications
Export Classifications:
- Export control classification numbers (ECCN) compliance
- International traffic in arms regulations (ITAR) considerations
- Country-specific import/export documentation
- Restricted party screening requirements
The XC6VSX475T-2FFG1759C represents the pinnacle of FPGA technology, combining exceptional performance, comprehensive features, and robust reliability. Whether deployed in next-generation communications infrastructure, advanced radar systems, or high-performance computing applications, this FPGA delivers the processing power and flexibility needed for tomorrow’s most demanding digital designs.
