Product Specifications
The XC6VSX475T-1FFG1156C features robust specifications that position it as a leading choice for complex digital designs:
Core Architecture:
- Logic Cells: 475,520 system gates
- Configurable Logic Blocks (CLBs): 59,440
- Block RAM: 38,304 Kb total memory
- DSP48E1 Slices: 2,016 dedicated DSP blocks
- Speed Grade: -1 (standard performance)
Package Details:
- Package Type: FFG1156 (Fine-Pitch Ball Grid Array)
- Pin Count: 1,156 pins
- Operating Temperature: Commercial grade (0°C to +85°C)
- Package Size: 35mm x 35mm
I/O Capabilities:
- Maximum User I/O: 600 pins
- High-speed serial transceivers: 36 GTX transceivers
- Data rates up to 6.6 Gbps per transceiver
- Multiple I/O standards support including LVDS, SSTL, and HSTL
The XC6VSX475T-1FFG1156C incorporates advanced 40nm process technology, ensuring optimal power efficiency while maintaining high performance standards essential for mission-critical applications.
Price
Pricing for the XC6VSX475T-1FFG1156C varies based on quantity, distribution channel, and current market conditions. This enterprise-grade FPGA typically falls within the premium pricing tier due to its advanced capabilities and high logic density.
Pricing Considerations:
- Volume discounts available for quantities over 100 units
- Lead times may vary from 12-20 weeks depending on availability
- Authorized distributors offer competitive pricing and technical support
- Engineering samples available for qualified customers
Contact authorized Xilinx distributors for current pricing and availability information specific to your application requirements.
Documents & Media
Comprehensive technical documentation supports the XC6VSX475T-1FFG1156C implementation:
Essential Documentation:
- Virtex-6 FPGA Data Sheet (DS150) – Complete electrical and timing specifications
- Virtex-6 FPGA Configuration User Guide (UG360) – Configuration and programming details
- Virtex-6 FPGA Memory Interface Solutions User Guide (UG406) – Memory controller implementation
- PCB Design Guidelines for Virtex-6 FPGAs – Layout recommendations and constraints
Development Tools:
- Vivado Design Suite compatibility for design entry and implementation
- ISE Design Suite support for legacy project migration
- ChipScope Pro for real-time debugging and analysis
- Reference designs and application notes for common implementations
Package Information:
- FFG1156 package mechanical drawings and specifications
- Thermal management guidelines and thermal resistance data
- Pin assignment files and UCF templates for common interfaces
Related Resources
The XC6VSX475T-1FFG1156C ecosystem includes extensive resources to accelerate development:
Development Boards:
- Virtex-6 SX475T Development Kit for rapid prototyping
- Third-party evaluation boards with pre-configured interfaces
- Custom carrier boards available from design service partners
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio including memory controllers and DSP functions
- Partner IP solutions for specialized applications
- Open-source IP repositories and community contributions
Training and Support:
- Xilinx University Program materials and courses
- Technical webinars covering Virtex-6 design best practices
- Community forums and knowledge base access
- Professional design services and consulting support
Application Examples:
- Software-defined radio implementations
- High-frequency trading systems
- Image and video processing accelerators
- Aerospace and defense signal processing solutions
Environmental & Export Classifications
The XC6VSX475T-1FFG1156C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance for European markets
- Moisture Sensitivity Level (MSL): Level 3
- Operating humidity: 10% to 90% non-condensing
Export Control Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Country of Origin: Various (check specific lot codes)
- Export licensing may be required for certain destinations
- Compliance with International Traffic in Arms Regulations (ITAR) where applicable
Quality Standards:
- ISO 9001:2015 certified manufacturing processes
- Automotive grade options available (contact factory)
- Extended temperature variants for industrial applications
- Radiation-tolerant versions available for space applications
Packaging and Handling:
- ESD sensitive device requiring proper handling procedures
- Tape and reel packaging available for automated assembly
- Tray packaging for prototype and low-volume applications
- Custom packaging options available upon request
The XC6VSX475T-1FFG1156C represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support. Its advanced architecture and extensive resource availability make it the preferred choice for engineers developing next-generation digital signal processing solutions.