1. Product Specifications
Core Architecture
- FPGA Family: Virtex-6 SXT (Signal Processing Optimized)
- Logic Cells: 314,880 cells for complex digital designs
- Process Technology: Advanced 40nm copper process technology
- Operating Voltage: 0.9V for low power consumption
- Speed Grade: -L1 (Low Power variant)
Physical Characteristics
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Package Size: 42.5mm x 42.5mm
- Pin Count: 1759 pins
- Package Description: FFG1759C FCBGA package
- Weight: Optimized for compact designs
I/O and Connectivity
- User I/O Pins: 720 high-performance I/O pins
- GTX Transceivers: 24 GTX high-speed serial transceivers
- Data Rates: Supports various data rates with oversampling capability
- Connectivity Options: Advanced serial connectivity for modern protocols
Performance Features
- DSP Slices: Optimized for digital signal processing applications
- Block RAM: Generous memory resources for data buffering
- MMCM Blocks: Mixed-Mode Clock Managers for advanced clocking
- Clock Management: Zero-delay buffering, frequency synthesis, phase shifting
- Jitter Filtering: Advanced input jitter filtering capabilities
Environmental Specifications
- Operating Temperature: Commercial grade temperature range
- Speed Grades Available: -3, -2, -1, and -1L variants
- Power Efficiency: Low power -1L speed grade for energy-conscious designs
2. Price
The XC6VSX315T-L1FFG1759C is available through authorized distributors worldwide. Pricing varies based on:
- Order Quantity: Volume discounts available for bulk purchases
- Lead Time: Stock availability affects pricing tiers
- Regional Distribution: Prices may vary by geographic location
- Package Options: Different packaging and testing requirements
Pricing Information: Contact authorized distributors for current market pricing, volume discounts, and availability. Leading distributors include Worldway Electronics, FPGAkey, BOSER Technology, and other certified AMD partners.
Cost Considerations: This premium FPGA represents significant value for high-performance applications requiring advanced DSP capabilities and extensive I/O resources.
3. Documents & Media
Technical Documentation
- Datasheet: Complete technical specifications and electrical characteristics
- User Guide: Comprehensive implementation guidelines and best practices
- Programming Guide: Detailed instructions for FPGA configuration
- Application Notes: Specific use case implementations and optimizations
- Pin-out Diagrams: Detailed pin assignment and package information
Design Resources
- Reference Designs: Pre-built designs for common applications
- IP Cores: Tested intellectual property blocks for rapid development
- PCB Footprint Files: CAD library files for board design
- Symbol Libraries: Schematic symbols for design tools
- Timing Models: Simulation models for design verification
Software Tools
- Vivado Design Suite: Primary development environment (recommended)
- ISE Design Suite: Legacy tool support for existing projects
- SDK: Software development kit for embedded applications
- Programming Tools: Configuration and debugging utilities
Media Resources
- Product Videos: Technical overviews and application demonstrations
- Webinars: Training sessions and design methodology presentations
- Case Studies: Real-world implementation examples and results
4. Related Resources
Development Platforms
- Evaluation Boards: ML605, KC705, and other Virtex-6 development platforms
- Starter Kits: Entry-level development kits for learning and prototyping
- Reference Designs: Communications, DSP, and embedded system examples
- Training Materials: Online courses and certification programs
Support Ecosystem
- Community Forums: FPGA developer community discussions and solutions
- Technical Support: Direct access to AMD technical experts
- Knowledge Base: Searchable database of common issues and solutions
- Design Services: Professional design assistance and consultation
Compatible Products
- Virtex-6 Family: Related FPGAs in the same architecture family
- Memory Interfaces: DDR3, QDR, and other high-speed memory controllers
- Communication Protocols: PCIe, Ethernet, and other standard interfaces
- Debug Tools: ChipScope Pro and other verification utilities
Third-Party Solutions
- IP Providers: Certified third-party IP cores and solutions
- Design Tools: Compatible EDA tools and simulation environments
- Training Partners: Authorized training providers and curriculum
- System Integrators: Partners for complete system development
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Compliance: Meets European chemical safety regulations
- Conflict Minerals: Compliant with conflict-free sourcing requirements
- Green Product: Qualifies as environmentally responsible technology
Quality Standards
- ISO Certifications: Manufactured under strict quality management systems
- Automotive Grade: Selected variants available for automotive applications
- Industrial Grade: Extended temperature range options available
- Military Grade: Qualified versions for defense applications
Export Control Information
- ECCN Classification: Export control classification for international shipping
- Country Restrictions: Compliance with export administration regulations
- License Requirements: Documentation needed for specific destinations
- Dual-Use Technology: Appropriate handling for sensitive applications
Packaging and Shipping
- Anti-Static Packaging: ESD-safe packaging for component protection
- Moisture Sensitivity: Level-appropriate handling and storage requirements
- Traceability: Full supply chain documentation and lot tracking
- Transportation: Certified for safe international shipping
Lifecycle Information
- Product Status: Active product with long-term support commitment
- Obsolescence: Advance notification policy for end-of-life planning
- Replacement Parts: Migration path and compatible alternatives
- Support Duration: Extended support timeline for critical applications
Key Benefits of XC6VSX315T-L1FFG1759C:
- High-performance 40nm FPGA technology
- Extensive DSP processing capabilities
- 720 user I/O pins for complex connectivity
- Low power consumption with -L1 speed grade
- Comprehensive development tool support
- RoHS compliant and environmentally friendly
- Wide availability through authorized distributors
The XC6VSX315T-L1FFG1759C represents the pinnacle of FPGA technology for applications demanding the highest levels of performance, connectivity, and signal processing capability. Whether you’re developing advanced communication systems, high-speed data processing platforms, or cutting-edge embedded systems, this FPGA provides the programmable foundation for innovation and success.
