Product Specifications
Core Architecture
The XC6VSX315T-2FFG1759I features a sophisticated architecture built on advanced 40nm technology, providing optimal power efficiency and performance. Key specifications include:
Logic Resources:
- 315,000 logic cells for complex digital signal processing
- 19,200 slices with advanced CLB (Configurable Logic Block) architecture
- 1,540 DSP48E1 slices for high-speed arithmetic operations
- 1,344 36Kb block RAMs providing 48.2 Mb total memory
Connectivity & I/O:
- 1,200 user I/O pins for extensive connectivity options
- 24 GTX transceivers supporting up to 6.5 Gbps data rates
- Advanced clocking architecture with 20 clock management tiles
- Multiple voltage standards support (1.2V, 1.5V, 1.8V, 2.5V, 3.3V)
Package Details:
- FFG1759 package: 1759-pin Flip-Chip Fine-Pitch BGA
- Speed grade: -2 (industrial temperature range)
- Operating temperature: -40ยฐC to +100ยฐC
- Advanced thermal management capabilities
Performance Characteristics
The XC6VSX315T-2FFG1759I delivers exceptional performance metrics that make it suitable for the most demanding applications:
- Maximum operating frequency: Up to 600 MHz
- Low power consumption with intelligent power management
- High-speed serial connectivity with integrated transceivers
- Advanced DSP capabilities for real-time signal processing
Pricing Information
XC6VSX315T-2FFG1759I pricing varies based on quantity, supplier, and market conditions. The device is positioned as a premium FPGA solution, with typical pricing reflecting its advanced capabilities and high logic density.
Pricing factors include:
- Volume discounts for bulk orders
- Lead time and availability
- Distributor markup and regional variations
- Market demand and supply chain conditions
For current pricing and availability, contact authorized Xilinx distributors or visit official semiconductor marketplaces. Educational and development pricing may be available for qualified institutions and projects.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and pin-out diagrams
- User Guide: Comprehensive implementation and design guidelines
- Migration Guide: Transition information from previous Virtex generations
- Power Estimation Tools: Xilinx Power Estimator (XPE) support files
Development Resources
- Vivado Design Suite: Full toolchain support for synthesis and implementation
- IP Catalog: Access to hundreds of pre-verified IP cores
- Reference Designs: Proven implementations for common applications
- Application Notes: Specific use-case implementations and optimizations
Media Assets
- High-resolution product images and package diagrams
- Block diagrams and architecture illustrations
- Video tutorials and webinar recordings
- Technical presentation materials
Related Resources
Development Tools
The XC6VSX315T-2FFG1759I is fully supported by Xilinx’s comprehensive development ecosystem:
Vivado Design Suite: Industry-leading FPGA design tools providing synthesis, place-and-route, timing analysis, and debugging capabilities specifically optimized for Virtex-6 devices.
Evaluation Boards: ML605 and other development platforms featuring the XC6VSX315T-2FFG1759I for rapid prototyping and evaluation.
Compatible IP Cores
- DSP IP: Advanced signal processing cores including FFT, FIR filters, and digital up/down converters
- Connectivity IP: Ethernet, PCIe, USB, and other high-speed interface controllers
- Memory Controllers: DDR3, DDR2, and other memory interface solutions
- Video Processing: Advanced video codecs and image processing pipelines
Application Examples
- Wireless Infrastructure: Base station signal processing and beamforming
- Medical Imaging: Real-time image processing and reconstruction
- Industrial Automation: High-speed motor control and machine vision
- Test & Measurement: High-bandwidth data acquisition and analysis
Environmental & Export Classifications
Environmental Compliance
The XC6VSX315T-2FFG1759I meets stringent environmental and quality standards:
RoHS Compliance: Fully compliant with RoHS (Restriction of Hazardous Substances) directive, ensuring lead-free and environmentally responsible manufacturing.
REACH Regulation: Compliant with EU REACH regulation for chemical safety and environmental protection.
Conflict Minerals: Xilinx maintains responsible sourcing practices in accordance with conflict minerals regulations.
Quality Standards
- Automotive Grade: AEC-Q100 qualified versions available for automotive applications
- Industrial Temperature: Extended operating temperature range (-40ยฐC to +100ยฐC)
- Quality Assurance: Manufactured in ISO 9001 certified facilities
Export Classification
ECCN (Export Control Classification Number): The XC6VSX315T-2FFG1759I is subject to U.S. export regulations and requires proper export licensing for certain destinations.
ITAR Status: Non-ITAR controlled for standard commercial applications, but specific implementations may require ITAR compliance.
International Shipping: Available for international shipping with proper export documentation and compliance verification.
Packaging & Handling
- MSL (Moisture Sensitivity Level): Level 3 classification requiring proper handling and storage
- ESD Protection: Electrostatic discharge sensitive device requiring proper ESD precautions
- Thermal Considerations: Requires appropriate thermal management in high-performance applications
Conclusion
The XC6VSX315T-2FFG1759I represents the pinnacle of Virtex-6 FPGA technology, offering unmatched performance, flexibility, and reliability for advanced digital signal processing applications. With its extensive logic resources, high-speed transceivers, and comprehensive development ecosystem, this FPGA provides the foundation for next-generation electronic systems across multiple industries.
Whether you’re developing cutting-edge wireless infrastructure, advanced medical devices, or high-performance computing solutions, the XC6VSX315T-2FFG1759I delivers the performance and capabilities needed to bring your most ambitious projects to life.
