Product Specifications
The XC6VLX130T-3FFG484C features an impressive array of resources optimized for high-performance applications. This FPGA contains 130,760 logic cells and 20,000 slices, providing substantial processing capability for complex digital designs. The device includes 552 DSP48E1 slices for efficient signal processing operations, along with 6,408 Kb of block RAM for on-chip memory requirements.
The XC6VLX130T-3FFG484C operates at a -3 speed grade, delivering superior timing performance for demanding applications. The device features 12 GTX transceivers capable of operating at speeds up to 6.6 Gbps, enabling high-speed serial communication interfaces. The FPGA supports various I/O standards and includes 240 user I/O pins in the FFG484 package format.
Key specifications include 40nm process technology for reduced power consumption and enhanced performance, support for DDR3 memory interfaces up to 1866 Mbps, and integrated PCIe endpoint blocks. The XC6VLX130T-3FFG484C also features advanced clock management resources with six MMCMs (Mixed-Mode Clock Managers) and 12 PLLs for flexible clocking solutions.
Pricing Information
The XC6VLX130T-3FFG484C pricing varies based on order quantity, packaging requirements, and distribution channel. For current pricing information and volume discounts on the XC6VLX130T-3FFG484C, contact authorized Xilinx distributors or semiconductor suppliers. Educational institutions and research organizations may qualify for special academic pricing on the XC6VLX130T-3FFG484C.
When evaluating XC6VLX130T-3FFG484C costs, consider the total system value including development tools, IP licensing, and support services. The investment in this high-performance FPGA often provides significant returns through reduced development time and superior system performance compared to alternative solutions.
Documents & Media
Comprehensive documentation supports XC6VLX130T-3FFG484C development and implementation. The official Xilinx datasheet provides detailed electrical specifications, timing parameters, and package information for the XC6VLX130T-3FFG484C. Additional resources include the Virtex-6 FPGA Configuration User Guide, PCB Design Guidelines, and Power Estimation Spreadsheets.
Development support materials for the XC6VLX130T-3FFG484C include reference designs, application notes, and design examples demonstrating best practices for high-speed design implementation. The Xilinx ISE Design Suite provides complete development environment support for the XC6VLX130T-3FFG484C, including synthesis, place and route, and timing analysis tools.
Video tutorials and webinars covering XC6VLX130T-3FFG484C design techniques are available through Xilinx training resources. These materials help engineers maximize the performance potential of the XC6VLX130T-3FFG484C in their specific applications.
Related Resources
The XC6VLX130T-3FFG484C ecosystem includes various development boards and evaluation kits for rapid prototyping and system validation. The ML605 Evaluation Kit provides a comprehensive platform for exploring XC6VLX130T-3FFG484C capabilities, featuring high-speed connectors, memory interfaces, and peripheral devices.
Compatible IP cores enhance XC6VLX130T-3FFG484C functionality across multiple application domains. These include processor cores, communication protocol stacks, DSP libraries, and interface controllers optimized for Virtex-6 architecture. The Xilinx LogiCORE IP portfolio provides pre-verified solutions that accelerate XC6VLX130T-3FFG484C-based design development.
Third-party tools and services support XC6VLX130T-3FFG484C implementation, including high-level synthesis tools, verification platforms, and design consulting services. These resources help teams leverage the full potential of the XC6VLX130T-3FFG484C while reducing development risk and time-to-market.
Environmental & Export Classifications
The XC6VLX130T-3FFG484C meets stringent environmental standards for commercial and industrial applications. The device operates across a commercial temperature range of 0°C to +85°C, with industrial temperature variants available for extended operating conditions. RoHS compliance ensures the XC6VLX130T-3FFG484C meets environmental regulations for lead-free manufacturing.
Export classification for the XC6VLX130T-3FFG484C follows applicable government regulations, with specific ECCN (Export Control Classification Number) designations determining shipping restrictions to certain countries. Customers should verify current export status and compliance requirements before ordering the XC6VLX130T-3FFG484C for international applications.
The XC6VLX130T-3FFG484C packaging uses halogen-free materials and recyclable components, supporting environmentally conscious design practices. Moisture sensitivity level ratings and proper handling procedures ensure reliable XC6VLX130T-3FFG484C performance throughout the manufacturing and assembly process.
Quality certifications for the XC6VLX130T-3FFG484C include ISO 9001 manufacturing standards and automotive-grade reliability testing where applicable. These certifications provide confidence in XC6VLX130T-3FFG484C reliability for mission-critical applications across aerospace, defense, communications, and industrial markets.
