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XC6VLX130T-1FFG1156I: High-Performance Virtex-6 FPGA for Advanced Applications

Original price was: $20.00.Current price is: $19.00.

Product Specifications

The XC6VLX130T-1FFG1156I features a comprehensive set of specifications that make it ideal for complex digital designs:

Logic Capacity:

  • 130,000 logic cells providing extensive programmable resources
  • 20,480 CLB slices for flexible logic implementation
  • 8,160 Kb of distributed RAM for local data storage

Memory Resources:

  • 264 Block RAM/FIFO blocks (18 Kb each)
  • Total Block RAM capacity of 4,824 Kb
  • Support for various memory configurations including single-port, dual-port, and FIFO modes

DSP Performance:

  • 192 DSP48E1 slices for high-performance signal processing
  • 25×25 multipliers with pre-adders and post-adders
  • Optimized for digital filtering, FFT, and mathematical operations

I/O Capabilities:

  • 600 user I/O pins in the 1156-pin Fine-Pitch Ball Grid Array (FFG) package
  • Support for multiple I/O standards including LVDS, SSTL, and HSTL
  • High-speed transceiver capability for advanced connectivity

Package and Operating Conditions:

  • FFG1156 package (35mm x 35mm) for optimal thermal performance
  • Industrial temperature range (-40ยฐC to +100ยฐC)
  • Speed grade -1 for balanced performance and power consumption

Price

The XC6VLX130T-1FFG1156I is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and industrial-grade reliability. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing typically varies based on order quantities, with significant savings available for bulk purchases and long-term contracts.

Documents & Media

Comprehensive technical documentation supports the XC6VLX130T-1FFG1156I implementation:

Technical Documentation:

  • Virtex-6 Family Overview datasheet with complete electrical specifications
  • DC and AC switching characteristics documentation
  • Package and pinout information including ball assignments
  • Configuration and programming guidelines

Development Resources:

  • Vivado Design Suite compatibility information
  • ISE Design Suite project templates and examples
  • IP core integration guides for common applications
  • Power estimation and thermal management guidelines

Application Notes:

  • High-speed design considerations and PCB layout recommendations
  • Signal integrity guidelines for optimal performance
  • Programming and configuration best practices
  • Debugging and troubleshooting procedures

Related Resources

The XC6VLX130T-1FFG1156I ecosystem includes extensive development support:

Development Boards:

  • ML605 Evaluation Platform featuring the XC6VLX240T for compatibility testing
  • Custom carrier boards designed specifically for the FFG1156 package
  • Third-party development platforms supporting Virtex-6 LXT series

Software Tools:

  • Xilinx Vivado Design Suite for design entry, synthesis, and implementation
  • ChipScope Pro for real-time debugging and analysis
  • Embedded Development Kit (EDK) for processor-based designs
  • System Generator for DSP applications

IP Cores:

  • Extensive library of verified IP cores including processors, interfaces, and DSP functions
  • Memory controllers for DDR3, DDR2, and other memory technologies
  • High-speed serial transceivers and protocol stacks
  • Custom IP development services and support

Support Services:

  • Technical support through Xilinx customer portal
  • Training courses and certification programs
  • Design services and consulting support
  • Community forums and knowledge base access

Environmental & Export Classifications

The XC6VLX130T-1FFG1156I meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS compliant with lead-free manufacturing processes
  • REACH regulation compliance for European markets
  • Conflict minerals reporting and supply chain transparency
  • ISO 14001 environmental management system certification

Operating Environment:

  • Industrial temperature range qualification (-40ยฐC to +100ยฐC junction temperature)
  • Humidity resistance per JEDEC standards
  • Shock and vibration resistance for harsh environments
  • Altitude and atmospheric pressure specifications for aerospace applications

Export Classifications:

  • Export Administration Regulations (EAR) classification for US export control
  • Harmonized Tariff Schedule (HTS) codes for international shipping
  • Country-specific import/export documentation requirements
  • Encryption capabilities disclosure for security-sensitive applications

Quality Standards:

  • Automotive Quality Grade (AQG) certification available
  • Military and aerospace screening options
  • Extended temperature and radiation-tolerant variants
  • Comprehensive quality assurance and traceability programs

The XC6VLX130T-1FFG1156I represents the pinnacle of FPGA technology, combining exceptional performance, comprehensive features, and industrial-grade reliability. Whether developing advanced communication systems, high-performance computing applications, or sophisticated digital signal processing solutions, this Virtex-6 FPGA provides the flexibility and capability needed for demanding applications across aerospace, defense, telecommunications, and industrial markets.