Product Specifications
The XC6VHX250T-2FFG1154I features robust specifications that set it apart in the high-performance FPGA market:
Logic and Memory Resources:
- Logic Cells: 241,152 cells providing extensive programmable logic capacity
- CLB Slices: 37,680 slices for flexible logic implementation
- Block RAM: 19,344 Kb total memory with 552 36Kb blocks
- Distributed RAM: 9,420 Kb for distributed memory applications
DSP and Processing:
- DSP48E1 Slices: 768 dedicated DSP blocks for high-speed arithmetic operations
- Maximum operating frequency optimized for signal processing applications
- Advanced clocking resources with multiple clock management tiles
I/O and Connectivity:
- Package: 1154-pin Flip Chip Fine Pitch BGA (FFG1154)
- User I/O Pins: 600 maximum user I/O pins
- High-speed serial transceivers for advanced connectivity
- Multiple voltage standards support (1.2V, 1.5V, 1.8V, 2.5V, 3.3V)
Performance Grade:
- Speed Grade: -2 (standard performance)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Advanced 40nm CMOS technology process
Price
The XC6VHX250T-2FFG1154I is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and industrial-grade specifications. Contact authorized Xilinx distributors for current pricing information, as costs may vary based on order quantity, delivery requirements, and regional availability. Volume discounts are typically available for production quantities, and engineering samples may be available for qualified design projects.
Documents & Media
Comprehensive technical documentation supports the XC6VHX250T-2FFG1154I implementation:
Product Documentation:
- Complete datasheet with electrical specifications and timing parameters
- Package and pinout documentation for PCB design
- Configuration and programming guides
- Power consumption and thermal management guidelines
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- PCB layout guidelines and design rules
- Signal integrity recommendations
Software Support:
- Xilinx ISE Design Suite compatibility
- IP core libraries and reference implementations
- Simulation models and timing analysis tools
- Programming and debugging utilities
Related Resources
The XC6VHX250T-2FFG1154I integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Tools:
- Xilinx Vivado Design Suite for modern FPGA development
- ChipScope Pro analyzer for real-time debugging
- System Generator for DSP applications
- EDK (Embedded Development Kit) for processor integration
Compatible Products:
- Other Virtex-6 family devices for scalable solutions
- Xilinx processors and SoC products
- Memory interfaces and high-speed connectivity IP
- Third-party IP cores and development boards
Support Services:
- Xilinx technical support and documentation portal
- Training courses and certification programs
- Design services and consulting support
- Community forums and knowledge base
Environmental & Export Classifications
The XC6VHX250T-2FFG1154I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package
- REACH regulation compliance
- Halogen-free materials available
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive-grade reliability testing
- JEDEC standard compliance
- Long-term supply commitment
Export Classifications:
- ECCN (Export Control Classification Number) classification applies
- Subject to U.S. export administration regulations
- International trade compliance documentation available
- Regional import/export requirements may apply
Reliability Specifications:
- MTBF (Mean Time Between Failures) data available
- Qualification test results per JEDEC standards
- Package moisture sensitivity level classification
- Electrostatic discharge (ESD) protection ratings
The XC6VHX250T-2FFG1154I represents the pinnacle of Virtex-6 FPGA technology, delivering the performance, reliability, and features required for the most demanding applications. Its combination of high logic density, advanced DSP capabilities, and robust I/O performance makes it an excellent choice for next-generation system designs requiring maximum computational power and flexibility.
