Product Specifications
Core Features
- Part Number: XC5206-5PQ208C
- Device Family: XC5200 Series Commercial FPGA
- Logic Capacity: 6,000 equivalent system gates
- Speed Grade: -5 (standard performance tier)
- Package Configuration: PQ208 (208-pin Plastic Quad Flat Pack)
- Operating Temperature: Commercial grade (0ยฐC to +70ยฐC)
Logic Architecture Details
- Technology: SRAM-based reconfigurable logic architecture
- Configurable Logic Blocks: 196 CLBs with 4-input lookup tables and flip-flops
- User I/O Capability: Up to 160 bidirectional user-configurable pins
- Internal Memory: Distributed SelectRAM memory integrated within CLBs
- Clock Resources: Multiple global clock networks with low-skew distribution
- Configuration Method: Volatile SRAM configuration cells
- Supply Voltage: 5.0V ยฑ10% single-supply operation
- Typical Gate Delay: 8.5ns propagation delay for -5 speed grade
- System Performance: Up to 40 MHz maximum operating frequency
Package Specifications
- Package Type: PQFP (Plastic Quad Flat Pack)
- Pin Count: 208 total pins
- Package Footprint: 28mm x 28mm body size
- Lead Pitch: 0.5mm (0.0197 inch) center-to-center spacing
- Package Height: 3.4mm maximum seated height
- Lead Configuration: Gull-wing leads for surface mount assembly
- Coplanarity: ยฑ0.10mm maximum lead deviation
Price Information
XC5206-5PQ208C pricing structure reflects its high I/O count and commercial-grade specifications:
- Prototype Quantities (1-9 pieces): Available through major electronic distributors
- Development Orders (10-49 pieces): Standard commercial pricing applies
- Small Production (50-199 pieces): First-tier volume pricing available
- Medium Volume (200-999 pieces): Enhanced quantity break discounts
- Large Volume (1000+ pieces): Direct factory pricing and supply agreements
- Academic Institutions: Educational discounts for qualifying research and coursework
FPGA pricing is influenced by global semiconductor market conditions, foundry capacity, and supply-demand dynamics. For current pricing information, delivery schedules, and stock availability, contact authorized Xilinx distributors or sales representatives.
Documents & Media
Essential Technical Documentation
- Product Datasheet: XC5200 Series FPGA Complete Technical Specifications (DS015)
- Programming Manual: XC5200 Configuration and Bitstream Generation Guide
- Package Documentation: PQ208 Mechanical Specifications and PCB Design Guidelines
- Electrical Specifications: DC characteristics, AC timing parameters, and power analysis
Comprehensive Design Resources
- Application Notes Library:
- XAPP045: XC5200 Performance Optimization and Timing Closure
- XAPP052: Power Supply Design for High I/O Count FPGAs
- XAPP067: Boundary Scan Implementation in XC5200 Devices
- XAPP075: Signal Integrity Considerations for PQ208 Package
- XAPP089: High-Speed I/O Design Techniques
- Reference Manuals: XC5200 Architecture Guide and Implementation Methodology
- Migration Documentation: Upgrade paths from previous FPGA generations
Software and Development Tools
- CAD Software Support: Compatible with Xilinx Foundation Series and Alliance tools
- Device Libraries: Comprehensive VHDL and Verilog simulation models
- Timing Models: Detailed timing analysis files and constraint templates
- Example Projects: Reference designs demonstrating key features and capabilities
- Programming Utilities: Bitstream generation, download, and verification tools
Quality and Reliability Information
- Qualification Reports: Commercial temperature testing and characterization data
- Reliability Analysis: MTBF calculations and failure rate projections
- Package Qualification: Thermal cycling, mechanical stress, and environmental testing
- Application Guidelines: Best practices for commercial environment deployment
Related Resources
Development and Programming Tools
- XC5206-5PQ208C Evaluation Platform: Complete development kit with reference designs
- Programming Hardware: Xilinx Parallel Cable IV, USB Platform Cable, or JTAG programmers
- Design Software: Xilinx ISE Foundation Suite with comprehensive XC5200 support
- Verification Tools: ChipScope Pro analyzer for in-system debugging and analysis
- Simulation Environment: Integration with industry-standard simulators
Supporting Component Ecosystem
- Configuration Devices: XC1700D series serial configuration PROMs and Flash memory
- Power Supply Solutions: Switching regulators and LDOs optimized for FPGA applications
- Clock Generation: Crystal oscillators, PLLs, and programmable clock synthesizers
- Interface Components: Bus transceivers, level shifters, and I/O protection devices
- Passive Components: Recommended capacitors, inductors, and EMI filtering solutions
Target Application Markets
- Data Acquisition Systems: Multi-channel ADC interfaces and sensor processing
- Communication Equipment: Protocol processors, packet switching, and interface bridges
- Test and Measurement: Automated test equipment and instrumentation controllers
- Industrial Automation: PLC interfaces, motor control, and process monitoring
- Digital Signal Processing: Real-time filtering, signal conditioning, and analysis
- Embedded Systems: Custom peripheral controllers and system-on-chip implementations
Professional Services and Support
- Technical Consulting: Application engineering support and design review services
- Training Programs: FPGA design methodology courses and certification programs
- IP Core Library: Pre-verified intellectual property blocks and reference designs
- Third-Party Services: Design houses, contract manufacturers, and system integrators
- Online Resources: User forums, knowledge base, and community support
Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Directive Compliance: Lead-free package options meeting EU Directive 2011/65/EU
- WEEE Directive: Compliant with European waste electrical equipment regulations
- REACH Regulation: Full compliance with Registration, Evaluation, and Authorization of Chemicals
- California Proposition 65: Compliant materials and packaging systems
- China RoHS: Meets Chinese Restriction of Hazardous Substances requirements
- Green Initiative: Environmentally conscious manufacturing and packaging practices
Operating Environment Specifications
- Commercial Temperature Range: 0ยฐC to +70ยฐC ambient operating conditions
- Storage Temperature Limits: -65ยฐC to +150ยฐC non-operating storage range
- Relative Humidity: 5% to 95% non-condensing humidity tolerance
- Atmospheric Pressure: Sea level to 2000 meters altitude operation
- Shock and Vibration: Commercial-grade mechanical stress tolerance
Quality Assurance and Reliability
- Manufacturing Quality: ISO 9001:2015 certified production facilities
- Device Reliability: JEDEC standard qualification testing per JESD47
- Package Reliability: Temperature cycling, thermal shock, and humidity stress testing
- Electrostatic Discharge: Class 1C ESD protection per JEDEC JESD22-A114
- Latch-up Immunity: Guaranteed latch-up free operation per JEDEC JESD78
- Mean Time Between Failures: Statistical reliability projections and field data
International Trade and Export Control
- Export Control Classification Number: ECCN 3A001.a.2.a under U.S. Export Administration Regulations
- Harmonized System Code: 8542.31.0001 for integrated circuits classification
- Country of Origin Marking: Manufacturing location indicated on device package
- Export License Requirements: Generally license-free for most commercial destinations
- Technology Transfer Controls: Subject to dual-use technology export regulations
Supply Chain Integrity and Compliance
- Conflict Minerals Compliance: SEC Rule 13p-1 compliant sourcing practices
- Supplier Qualification: Audited and certified manufacturing partners
- Anti-Counterfeiting: Authorized distribution channels and security features
- Product Traceability: Complete lot genealogy and manufacturing history
- Ethical Sourcing: Responsible mineral sourcing and labor practice verification
Handling and Storage Protocols
- Moisture Sensitivity Level: MSL-3 classification per JEDEC J-STD-020D
- Dry Pack Requirements: Moisture barrier bag storage with humidity indicator
- Floor Life Limits: 168 hours maximum exposure at โค30ยฐC/60% relative humidity
- Bake-out Procedures: 125ยฐC for 24 hours if moisture exposure exceeded
- ESD Protection: Antistatic handling requirements and grounded workstation setup
Packaging and Shipping Options
- Standard Packaging: Anti-static tubes for prototype and small quantity orders
- Tape and Reel: Available for high-volume automated assembly processes
- Tray Packaging: JEDEC standard trays for manual and semi-automated placement
- Custom Marking: Device identification and date codes per customer requirements
- Lead Time: Standard 8-12 week delivery for commercial orders
Regulatory Certifications
- FCC Compliance: Electromagnetic compatibility for U.S. market applications
- CE Marking: European Conformity for EU market distribution
- UL Recognition: Component recognition for end-product safety certification
- Canadian Standards: CSA compliance for Canadian market requirements
- International Standards: IEC and ISO compliance where applicable
The XC5206-5PQ208C provides maximum I/O flexibility and proven reliability for demanding commercial applications. Its extensive pin count and robust feature set make it an excellent choice for interface-heavy designs, data acquisition systems, and applications requiring significant external connectivity.
Keywords: XC5206-5PQ208C, high I/O FPGA, Xilinx XC5200, PQ208 package, 160 I/O pins, commercial FPGA, interface-intensive design, data acquisition, 208-pin FPGA, programmable logic device
