Product Specifications
The XC3SD3400A-FGG676C offers robust specifications that make it ideal for complex DSP implementations:
Core Architecture:
- Logic Cells: 53,712 system gates
- Configurable Logic Blocks (CLBs): 1,596
- Block RAM: 126 blocks (2,268 Kbits total)
- Distributed RAM: 95 Kbits
- DSP48 Slices: 126 dedicated multipliers
Package Details:
- Package Type: Fine-pitch Ball Grid Array (FGG676)
- Pin Count: 676 pins
- Package Size: 27mm x 27mm
- Operating Temperature: Commercial (0ยฐC to +85ยฐC)
Performance Characteristics:
- Speed Grade: -4 (standard performance)
- Maximum System Clock: Up to 320 MHz
- Low power consumption optimized for battery-powered applications
- Advanced clock management with Digital Clock Managers (DCMs)
The XC3SD3400A-FGG676C features comprehensive I/O capabilities with support for various interface standards including LVDS, SSTL, and HSTL, making it versatile for diverse system integration requirements.
Price
Pricing for the XC3SD3400A-FGG676C varies based on quantity, supplier, and market conditions. Typical pricing ranges from $45 to $85 per unit for standard commercial quantities. Volume pricing discounts are available for orders exceeding 1,000 units. For current pricing and availability of the XC3SD3400A-FGG676C, contact authorized Xilinx distributors or electronic component suppliers.
Factors affecting XC3SD3400A-FGG676C pricing include:
- Order quantity and volume commitments
- Delivery timeline requirements
- Regional market availability
- Distributor relationships and negotiated rates
Documents & Media
Essential documentation for the XC3SD3400A-FGG676C includes comprehensive technical resources to support design and implementation:
Technical Documentation:
- Spartan-3A DSP FPGA Data Sheet (DS610)
- XC3SD3400A-FGG676C Package and Pinout Information
- Spartan-3A DSP FPGA User Guide
- ISE Design Suite Software Documentation
- Application Notes for DSP implementation
Design Resources:
- Reference designs and example projects
- IP core libraries optimized for XC3SD3400A-FGG676C
- Board design guidelines and layout recommendations
- Power estimation and thermal management guides
Software Tools:
- ISE Design Suite compatibility information
- Vivado Design Suite migration guides
- ChipScope Pro debugging tools documentation
All documentation for the XC3SD3400A-FGG676C is available through the official Xilinx website and design resource centers.
Related Resources
The XC3SD3400A-FGG676C ecosystem includes various supporting resources and complementary products:
Development Boards:
- Spartan-3A DSP Starter Kit featuring XC3SD3400A-FGG676C
- Custom evaluation boards from third-party vendors
- Prototype and development platforms
Compatible IP Cores:
- Digital filters and signal processing cores
- Communication protocol stacks
- Memory controllers and interfaces
- Video and image processing solutions
Design Tools:
- System Generator for DSP
- AccelDSP Synthesis Tool
- CORE Generator System
- ISE Design Suite with XC3SD3400A-FGG676C support
Training and Support:
- Xilinx University Program resources
- Online training modules specific to Spartan-3A DSP
- Community forums and design support
Environmental & Export Classifications
The XC3SD3400A-FGG676C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Halogen-free options available
- Green packaging and materials
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- HTS Code: 8542.31.0001
- Country of Origin: Various (based on manufacturing location)
- Standard commercial export licensing
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive-grade options (AEC-Q100 qualified)
- Industrial temperature range variants
- Extended reliability testing and qualification
Packaging Information:
- MSL (Moisture Sensitivity Level): Level 3
- Storage temperature: -65ยฐC to +150ยฐC
- Recommended reflow profile specifications
- ESD protection classification: Class 1C
The XC3SD3400A-FGG676C represents an excellent choice for designers requiring high-performance DSP capabilities in a flexible, programmable platform. Its combination of dedicated DSP resources, ample logic capacity, and comprehensive tool support makes it ideal for next-generation digital signal processing applications.
