1. Product Specifications
Technical Specifications – XC3SD3400A-4FG676CES
| Parameter | Specification |
|---|---|
| Part Number | XC3SD3400A-4FG676CES |
| Manufacturer | AMD (formerly Xilinx) |
| Product Family | Spartan-3A DSP FPGA |
| System Gates | 3.4 Million |
| Logic Cells | 53,712 |
| Maximum Frequency | 667 MHz (-4 speed grade) |
| User I/O | 469 pins |
| Package Type | 676-FBGA (Fine-pitch Ball Grid Array) |
| Process Technology | 90nm CMOS |
| Core Voltage | 1.2V |
| Operating Temperature | Extended temperature range |
| Configuration | Multiple configuration options supported |
Memory and DSP Resources
- Block RAM: Enhanced 18Kb dual-port block RAMs with output registers
- DSP Slices: XtremeDSP DSP48A slices for multiply-accumulate operations
- Multipliers: Dedicated 18×18 bit multipliers
- Clock Management: Digital Clock Manager (DCM) for precise timing control
- Configuration Memory: Fast configuration and reconfiguration capabilities
Package Details
The XC3SD3400A-4FG676CES features a 676-pin FBGA package optimized for:
- High-density board layouts
- Excellent thermal performance
- Reliable signal integrity
- Industry-standard footprint compatibility
2. Price
Current Pricing Information – XC3SD3400A-4FG676CES
Note: Pricing for the XC3SD3400A-4FG676CES varies based on quantity, supplier, and market conditions. Current availability shows 355 units in stock from distributors.
Typical Price Range:
- Small quantities (1-10 units): $300-400 per unit
- Medium quantities (40+ units): $200-300 per unit
- Volume pricing (400+ units): Contact for quotation
Where to Buy XC3SD3400A-4FG676CES:
- Authorized AMD/Xilinx distributors
- Electronic component suppliers
- Online marketplaces with verified sellers
Pricing subject to change. Contact authorized distributors for current pricing and volume discounts.
Cost-Effectiveness Benefits
The XC3SD3400A-4FG676CES offers superior price-to-performance ratio compared to:
- Custom ASICs (lower NRE costs)
- Discrete DSP solutions (reduced board space)
- Competing FPGA families (better DSP integration)
3. Documents & Media
Official Documentation
Datasheet and Technical References:
- Spartan-3A DSP FPGA Family Datasheet (DS610)
- XC3SD3400A-4FG676CES Product Brief
- Pin-out and Package Information
- Electrical characteristics and timing specifications
Design Resources:
- Reference designs and application notes
- Development board schematics
- PCB layout guidelines for 676-FBGA package
- Thermal management recommendations
Software and Tools:
- ISE Design Suite compatibility
- Vivado Design Suite support (legacy)
- Programming and configuration guides
- Simulation models and libraries
Video Resources
- Product overview presentations
- Design tutorial videos
- Application-specific implementation guides
- Troubleshooting and debugging techniques
Application Notes
Key application notes for XC3SD3400A-4FG676CES include:
- DSP implementation best practices
- Clock domain crossing techniques
- Power optimization strategies
- Signal integrity considerations for FBGA packages
4. Related Resources
Development Tools and Kits
Recommended Development Platforms:
- Spartan-3A DSP Starter Kit
- Evaluation boards with XC3SD3400A variants
- Third-party development modules
- Custom carrier boards and adapters
Software Development Environment:
- ISE Design Suite (primary development environment)
- ModelSim simulation tools
- ChipScope Pro debugging tools
- Third-party synthesis and place-and-route tools
Compatible Products and Accessories
Complementary Components:
- Configuration memory devices
- Power management ICs optimized for Spartan-3A DSP
- High-speed interface components
- Clock generation and distribution circuits
Programming and Configuration:
- JTAG programming cables
- Configuration PROMs
- In-system programming solutions
- Boundary scan test equipment
Technical Support Resources
- AMD Xilinx forums and community support
- Technical documentation library
- Application engineering consultation
- Training courses and webinars
Alternative and Compatible Parts
Pin-Compatible Alternatives:
- XC3SD3400A-5FG676CES (higher speed grade)
- XC3SD3400A-4FGG676C (similar specifications)
- Migration path to newer FPGA families
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance: The XC3SD3400A-4FG676CES meets RoHS (Restriction of Hazardous Substances) requirements for lead-free manufacturing and environmental safety.
Environmental Standards:
- WEEE (Waste Electrical and Electronic Equipment) compliant
- REACH regulation compliance
- Conflict minerals reporting available
- Green packaging initiatives supported
Operating Environmental Conditions
| Parameter | Specification |
|---|---|
| Operating Temperature | Extended commercial/industrial range |
| Storage Temperature | -65ยฐC to +150ยฐC |
| Humidity | 5% to 95% non-condensing |
| Altitude | Up to 2000m operational |
Export and Trade Classifications
Export Control Information:
- ECCN (Export Control Classification Number): Check current regulations
- HTS (Harmonized Tariff Schedule) classification available
- Country of origin marking compliant
- Export license requirements vary by destination
Quality and Reliability:
- Automotive grade versions available (AEC-Q100 qualified)
- Military and aerospace grade options
- Extended temperature range variants
- Long-term supply commitment from AMD
Packaging and Shipping
Environmental Packaging:
- Moisture sensitivity level (MSL) rating provided
- Anti-static packaging for ESD protection
- Recyclable packaging materials
- Dry pack storage requirements specified
Logistics Information:
- Lead-time information available from distributors
- Global supply chain support
- Regional distribution centers
- Just-in-time delivery options
Why Choose XC3SD3400A-4FG676CES?
The XC3SD3400A-4FG676CES represents the perfect balance of performance, cost-effectiveness, and design flexibility for modern DSP applications. This FPGA delivers more functionality and bandwidth per dollar than ever before, setting new standards in programmable logic and DSP processing.
Key Advantages:
- Proven DSP Performance: Optimized for high-performance digital signal processing
- Cost-Effective Solution: Lower total system cost compared to ASIC alternatives
- Design Flexibility: Field-upgradeable and reconfigurable architecture
- Comprehensive Ecosystem: Extensive tool support and design resources
- Industry Support: Backed by AMD’s long-term commitment and global support
Target Applications:
- Broadband access equipment
- Home networking devices
- Digital television and display systems
- Wireless communication systems
- Industrial automation and control
- Medical imaging equipment
- Test and measurement instruments
Contact authorized distributors for current availability, pricing, and technical support for the XC3SD3400A-4FG676CES FPGA solution.
