The XC3S700A4FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3 family, designed to deliver exceptional performance for a wide range of digital design applications. This advanced programmable logic device combines flexibility, reliability, and cost-effectiveness, making it an ideal choice for engineers and developers working on complex digital systems.
Product Specifications
The XC3S700A4FTG256C features robust technical specifications that support demanding applications across multiple industries:
Core Architecture:
- Logic cells: 13,824 equivalent gates providing substantial processing capability
- System gates: 700,000 gates for complex logic implementations
- Configurable Logic Blocks (CLBs): 1,728 CLBs with 4-input lookup tables
- Input/Output pins: 190 user I/O pins for versatile connectivity
- Package type: 256-pin Fine-Pitch Ball Grid Array (FTBGA256)
Memory and Storage:
- Block RAM: 360 Kbits of dedicated block RAM for data storage
- Distributed RAM: Flexible distributed memory options
- Configuration memory: Non-volatile configuration storage
Performance Characteristics:
- Operating voltage: 1.2V core voltage with 3.3V I/O compatibility
- Speed grade: -4 speed grade for high-performance applications
- Maximum frequency: Up to 326 MHz system clock performance
- Temperature range: Commercial temperature grade (0ยฐC to +85ยฐC)
Advanced Features:
- Built-in multipliers for DSP applications
- Phase-Locked Loops (PLLs) for clock management
- JTAG boundary scan for testing and debugging
- Multiple I/O standards support including LVTTL, LVCMOS, and differential signaling
Price Information
The XC3S700A4FTG256C offers competitive pricing that reflects its position as a mid-range FPGA solution. Pricing varies based on quantity, distribution channel, and current market conditions. For the most accurate and up-to-date pricing information:
- Contact authorized Xilinx distributors for volume pricing
- Check major electronic component suppliers for current stock prices
- Consider end-of-life status and availability when planning projects
- Bulk pricing discounts typically available for quantities over 100 units
Note: As the Spartan-3 family has reached end-of-life status, pricing may fluctuate based on remaining inventory levels.
Documents & Media
Comprehensive documentation and support materials are available for the XC3S700A4FTG256C:
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- User guide detailing architecture and programming instructions
- Application notes covering design best practices and implementation tips
- Package drawings and pinout diagrams for PCB layout design
Development Resources:
- Reference designs and example projects
- Constraint files for timing analysis
- Simulation models for verification workflows
- Programming files and bitstream examples
Software Support:
- ISE Design Suite compatibility for synthesis and implementation
- ChipScope Pro analyzer support for debugging
- ModelSim simulation environment integration
- Third-party tool compatibility documentation
Related Resources
Engineers working with the XC3S700A4FTG256C can leverage numerous related resources:
Development Boards:
- Spartan-3 Starter Kit for rapid prototyping
- Third-party evaluation boards featuring the XC3S700A
- Custom development platforms from various vendors
Design Tools:
- Xilinx ISE WebPACK (free version) for basic development
- Xilinx ISE Foundation and Standard editions for advanced features
- Third-party synthesis and verification tools
Migration Paths:
- Upgrade options to newer Spartan families (Spartan-6, Spartan-7)
- Compatibility considerations for legacy design migration
- Performance comparison guides for family selection
Community Support:
- Xilinx community forums for technical discussions
- Application-specific user groups and communities
- Online tutorials and training materials
Environmental & Export Classifications
The XC3S700A4FTG256C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for chemical substances
- Halogen-free package options available
- Environmental stress screening standards met
Export Control Classifications:
- Export Control Classification Number (ECCN) designated
- International Traffic in Arms Regulations (ITAR) compliance where applicable
- Country-specific import/export documentation requirements
- End-use restrictions for certain applications and regions
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive-grade versions available for AEC-Q100 compliance
- Military/aerospace temperature ranges for extended applications
- Long-term supply commitment and lifecycle management
Reliability Specifications:
- Mean Time Between Failures (MTBF) calculations available
- Temperature cycling and thermal shock testing completed
- Electrostatic discharge (ESD) protection built-in
- Comprehensive failure analysis and quality reporting
The XC3S700A4FTG256C represents a proven solution for engineers requiring reliable, high-performance programmable logic capabilities. Its combination of substantial logic resources, flexible I/O options, and comprehensive development support makes it suitable for applications ranging from telecommunications and industrial control to consumer electronics and automotive systems.
