The XC3S700A-4FT256C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance and flexibility for a wide range of digital signal processing and embedded system applications. This versatile FPGA combines cost-effectiveness with robust functionality, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XC3S700A-4FT256C features comprehensive specifications that make it suitable for demanding applications:
Core Architecture:
- Logic Cells: 13,248 equivalent gates
- System Gates: 700,000
- CLB Array: 46 x 34 Configurable Logic Blocks
- Total Block RAM: 360 Kbits distributed across 20 blocks
- Dedicated Multipliers: 20 embedded 18×18 multipliers
Memory and I/O Capabilities:
- Distributed RAM: 82 Kbits
- Maximum User I/O: 196 pins
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Speed Grade: -4 (high performance)
Power and Performance:
- Core Voltage: 1.2V ยฑ 5%
- I/O Standards Support: LVTTL, LVCMOS, SSTL, HSTL, and differential standards
- Maximum Frequency: Up to 326 MHz (speed grade dependent)
- Low power consumption with advanced power management features
The XC3S700A-4FT256C incorporates Xilinx’s advanced 90nm process technology, ensuring optimal power efficiency while maintaining high performance characteristics essential for modern FPGA applications.
Price Information
Pricing for the XC3S700A-4FT256C varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, making the XC3S700A-4FT256C an economical solution for both prototyping and mass production requirements.
Documents & Media
Essential documentation and resources for the XC3S700A-4FT256C include:
Technical Documentation:
- Official Xilinx Spartan-3A datasheet with complete electrical and timing specifications
- User Guide covering architecture details and design considerations
- Package and pinout diagrams for the FT256 configuration
- DC and switching characteristics specifications
- Configuration and programming guidelines
Design Resources:
- Reference designs and application notes
- Development board schematics and layouts
- Power supply design recommendations
- PCB layout guidelines for optimal signal integrity
Software Tools:
- Xilinx ISE Design Suite compatibility information
- Constraint files and timing models
- Simulation libraries and behavioral models
All documentation for the XC3S700A-4FT256C is available through the official Xilinx support portal and authorized distribution channels.
Related Resources
The XC3S700A-4FT256C ecosystem includes various complementary products and resources:
Development Platforms:
- Spartan-3A evaluation boards featuring the XC3S700A-4FT256C
- Compatible development kits and starter boards
- Third-party evaluation platforms and modules
Compatible Devices:
- Other Spartan-3A family members for scalable designs
- Configuration memory devices (Platform Flash, SPI Flash)
- Power management ICs optimized for Spartan-3A FPGAs
Design Tools:
- Xilinx ISE Design Suite (legacy support)
- Third-party synthesis and simulation tools
- IP core libraries and reference implementations
Community Resources:
- Xilinx forums and community support for XC3S700A-4FT256C projects
- Application notes and design examples
- University program resources and educational materials
Environmental & Export Classifications
The XC3S700A-4FT256C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing process)
- REACH regulation compliance for European markets
- Halogen-free options available
- MSL (Moisture Sensitivity Level): Level 3 classification
Export and Trade Classifications:
- ECCN (Export Control Classification Number): 5A002
- HTS (Harmonized Tariff Schedule) code for customs classification
- Country of origin marking as required by international trade regulations
Quality and Reliability:
- Automotive grade versions available (extended temperature range)
- IEC/JEDEC standard compliance for reliability testing
- Extended lifecycle support for industrial applications
Operating Environment:
- Commercial temperature range: 0ยฐC to +85ยฐC junction temperature
- Industrial grade options: -40ยฐC to +100ยฐC
- Humidity tolerance: Non-condensing environments up to 85% RH
The XC3S700A-4FT256C represents an excellent balance of performance, cost-effectiveness, and reliability for FPGA-based designs. Its comprehensive feature set, robust documentation, and extensive ecosystem support make it a preferred choice for engineers developing advanced digital systems across industrial, communications, and consumer electronics applications.
