The XC3S700A-4FG484C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for complex digital applications. This versatile programmable logic device combines advanced features with cost-effective implementation, making it an ideal choice for engineers developing sophisticated electronic systems.
Product Specifications
The XC3S700A-4FG484C features a robust architecture built on proven Spartan-3A technology. This FPGA incorporates 700,000 system gates with 13,824 logic cells, providing ample resources for demanding applications. The device includes 360 Kb of distributed RAM and supports up to 126 user I/O pins, offering extensive connectivity options.
Key specifications of the XC3S700A-4FG484C include a -4 speed grade ensuring fast signal processing capabilities, packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) format. The device operates across commercial temperature ranges and supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, ensuring compatibility with various system requirements.
The XC3S700A-4FG484C integrates advanced features such as dedicated multiply-accumulate blocks, phase-locked loops for clock management, and extensive routing resources. These capabilities enable implementation of complex digital signal processing algorithms, embedded processors, and high-speed communication interfaces.
Price
Pricing for the XC3S700A-4FG484C varies based on quantity, packaging options, and supplier relationships. Commercial distributors typically offer competitive pricing structures with volume discounts available for large-scale production requirements. The cost-effective nature of the Spartan-3A family makes the XC3S700A-4FG484C an attractive option for budget-conscious projects without compromising performance.
For current pricing information and volume quotes, contact authorized Xilinx distributors or semiconductor suppliers. Educational discounts may be available for academic institutions and research organizations utilizing the XC3S700A-4FG484C in educational projects.
Documents & Media
Comprehensive documentation supports the XC3S700A-4FG484C implementation process. The official datasheet provides detailed electrical characteristics, timing specifications, and pinout information essential for PCB design and system integration. Application notes offer practical guidance for common implementation scenarios and design optimization techniques.
Development resources include reference designs demonstrating typical XC3S700A-4FG484C applications, from basic logic implementations to advanced DSP functions. Technical support documentation covers programming procedures, configuration options, and troubleshooting guidelines to streamline the development process.
Software support encompasses the complete Xilinx ISE Design Suite, providing synthesis, place-and-route, and simulation tools specifically optimized for the XC3S700A-4FG484C architecture. This comprehensive toolchain ensures efficient design implementation and verification workflows.
Related Resources
The XC3S700A-4FG484C ecosystem includes various development boards and evaluation platforms enabling rapid prototyping and system validation. Third-party IP cores extend functionality with pre-verified implementations of common interfaces and processing blocks, accelerating time-to-market for XC3S700A-4FG484C-based designs.
Compatible devices within the Spartan-3A family offer migration paths for different resource requirements while maintaining design compatibility. This flexibility allows designers to optimize cost and performance by selecting the most appropriate device variant for specific applications.
Training resources and community forums provide ongoing support for XC3S700A-4FG484C users, facilitating knowledge sharing and best practice development. Online tutorials and video guides offer step-by-step instruction for common design tasks and advanced optimization techniques.
Environmental & Export Classifications
The XC3S700A-4FG484C meets stringent environmental compliance standards including RoHS directive compliance for lead-free manufacturing. The device packaging utilizes environmentally friendly materials and processes, supporting sustainable electronics manufacturing practices.
Export classification information ensures proper handling of XC3S700A-4FG484C shipments across international borders. The device falls under standard semiconductor export categories with specific classification codes provided in official documentation for customs and regulatory compliance.
Temperature specifications for the XC3S700A-4FG484C support operation across commercial ranges, with extended temperature variants available for harsh environment applications. Reliability testing validates long-term operation under specified environmental conditions, ensuring consistent performance throughout the product lifecycle.
Quality certifications demonstrate the XC3S700A-4FG484C manufacturing process adherence to industry standards, providing confidence in device reliability and performance consistency. These certifications support deployment in mission-critical applications requiring verified component quality.
The XC3S700A-4FG484C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its comprehensive feature set and robust support ecosystem make it a preferred choice for engineers developing next-generation electronic systems requiring programmable logic capabilities.
