Product Specification
The XC3S50AN-4TQG144C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional value for cost-sensitive applications. This advanced FPGA combines programmable logic with integrated non-volatile configuration memory, eliminating the need for external configuration devices.
Key Technical Specifications:
Logic Capacity & Architecture:
- Logic cells: 1,584 equivalent gates
- System gates: 50,000
- CLB array: 8 x 12 Configurable Logic Blocks
- Total block RAM: 108 Kbits distributed across 3 blocks
- Distributed RAM: 12 Kbits
I/O and Connectivity:
- User I/O pins: 108
- Package type: TQFP-144 (Thin Quad Flat Pack)
- Differential I/O pairs: 39
- Maximum user I/O standards supported: 19 different standards
- High-speed I/O capability with LVDS support
Performance Characteristics:
- Speed grade: -4 (commercial temperature range)
- Operating temperature: 0°C to +85°C (commercial grade)
- Maximum frequency: Up to 200+ MHz depending on design
- Power consumption: Optimized for low-power applications
Integrated Features:
- On-chip configuration Flash memory
- Dedicated multipliers: 4 x 18-bit multipliers
- Digital Clock Manager (DCM) for clock synthesis and management
- IEEE 1149.1 JTAG boundary scan support
The XC3S50AN-4TQG144C incorporates Xilinx’s proven 90nm process technology, ensuring reliable performance while maintaining cost-effectiveness for high-volume production.
Price
The XC3S50AN-4TQG144C is competitively priced within the entry-level FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions.
Typical Pricing Structure:
- Unit price (1-99 pieces): Contact authorized distributors
- Volume pricing (1000+ pieces): Significant discounts available
- Engineering samples: Available through Xilinx direct sales
Cost Considerations: The integrated configuration memory eliminates the need for external Flash devices, reducing overall system cost and board space requirements. This makes the XC3S50AN-4TQG144C particularly cost-effective for applications requiring non-volatile configuration storage.
Availability: The XC3S50AN-4TQG144C is available through authorized Xilinx distributors worldwide, including major electronics distributors and online marketplaces. Lead times typically range from stock to 12-16 weeks depending on demand and quantity requirements.
Documents & Media
Official Documentation:
- Datasheet: Spartan-3AN FPGA Family Complete Data Sheet (DS557)
- User Guide: Spartan-3AN FPGA User Guide
- Package Information: 144-pin TQFP Package specifications and pinout diagrams
- Migration Guide: Spartan-3 to Spartan-3AN Migration Guidelines
Design Resources:
- Reference Designs: Starter kit projects and application examples
- PCB Layout Guidelines: High-speed design considerations and routing recommendations
- Schematic Symbols: CAD library components for major EDA tools
- 3D Models: Mechanical models for PCB visualization tools
Software Support:
- ISE Design Suite: Complete development environment compatibility
- IP Core Libraries: Pre-verified intellectual property blocks
- Simulation Models: VHDL and Verilog behavioral models
- Programming Files: Configuration bitstream generation tools
Application Notes:
- Power management and thermal considerations
- Clock domain crossing best practices
- I/O standard implementation guidelines
- Configuration and debugging procedures
All documentation is available through the official Xilinx website and requires registration for access to the most current versions.
Related Resources
Development Boards:
- Spartan-3AN Starter Kit: Complete evaluation platform featuring the XC3S50AN-4TQG144C
- Third-party development boards: Various options from ecosystem partners
Complementary Products:
- Configuration Tools: JTAG programmers and debugging interfaces
- Power Management ICs: Recommended power supply solutions
- Oscillators and Crystals: Compatible timing solutions
- Protection Devices: ESD protection and filtering components
Software Tools:
- Xilinx ISE WebPACK: Free development software for Spartan-3AN devices
- ModelSim: Advanced simulation and verification tools
- ChipScope Pro: On-chip debugging and analysis capabilities
Training and Support:
- Online Training Courses: FPGA design fundamentals and advanced topics
- Design Consulting: Professional services for complex implementations
- Community Forums: Peer-to-peer technical support and knowledge sharing
- FAE Support: Field Application Engineer assistance for design challenges
Alternative Devices:
Consider related Spartan-3AN family members for different capacity requirements:
- XC3S200AN-4TQG144C for higher logic density
- XC3S50AN-4FTG256C for increased I/O requirements
Environmental & Export Classifications
Environmental Compliance:
The XC3S50AN-4TQG144C meets stringent environmental standards required for global market acceptance:
RoHS Compliance:
- Fully compliant with RoHS 2011/65/EU directive
- Lead-free package and assembly processes
- Restriction of hazardous substances certification
REACH Regulation:
- Compliant with EU REACH regulation (EC) No 1907/2006
- Substance of Very High Concern (SVHC) declarations available
- Material composition documentation provided
Temperature and Reliability:
- Operating Temperature Range: 0°C to +85°C (commercial grade)
- Storage Temperature Range: -65°C to +150°C
- Humidity: 5% to 95% non-condensing
- Thermal resistance: Junction-to-ambient and junction-to-case specifications available
Export Classifications:
ECCN (Export Control Classification Number):
- Classification: 3A001.a.2
- Export license requirements vary by destination country
- Compliance with US Export Administration Regulations (EAR)
International Trade Classifications:
- HS Code: 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Certificate of Origin available upon request
Quality Standards:
- ISO 9001:2015 certified manufacturing processes
- Automotive Grade: Industrial temperature range available for automotive applications
- Qualification Standards: JEDEC and military standards compliance options
Packaging and Shipping:
- MSL (Moisture Sensitivity Level): Level 3 classification
- ESD Sensitivity: Class 2 per JEDEC JS-001
- Packaging: Anti-static tubes and tape & reel options available
- Lead-free Compatible: Compatible with lead-free soldering processes
The XC3S50AN-4TQG144C is manufactured in facilities certified for quality and environmental management, ensuring consistent product quality and regulatory compliance for global deployment.
The XC3S50AN-4TQG144C represents an optimal balance of performance, integration, and cost-effectiveness for embedded system designers requiring reliable FPGA solutions with integrated configuration memory.
