The XC3S50AN-4FT256C is a cutting-edge FPGA (Field-Programmable Gate Array) from Xilinx’s renowned Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring non-volatile configuration storage. This advanced programmable logic device combines flexibility, reliability, and cost-effectiveness in a compact 256-pin FTBGA package.
Product Specifications
Core Architecture
The XC3S50AN-4FT256C features a robust architecture built around proven FPGA technology:
Logic Resources:
- 50,000 system gates providing ample logic capacity
- 1,728 configurable logic blocks (CLBs) for flexible digital design implementation
- 432 slices offering fine-grained logic control
- 1,728 4-input lookup tables (LUTs) for efficient Boolean function implementation
- 1,728 flip-flops supporting various clocking schemes
Memory Configuration:
- 72 Kbits of distributed RAM for high-speed data storage
- 108 Kbits of block RAM organized in efficient memory blocks
- Non-volatile In-System Flash memory eliminating external configuration devices
I/O Capabilities:
- 195 user I/O pins supporting various voltage standards
- LVTTL, LVCMOS, SSTL, and HSTL I/O standard compatibility
- Differential signaling support for high-speed applications
Package Details:
- 256-pin Fine-Pitch Ball Grid Array (FTBGA) package
- Compact 17mm x 17mm footprint optimizing board space
- -4 speed grade ensuring reliable operation up to specified frequencies
- Commercial temperature range (0ยฐC to +85ยฐC)
Performance Characteristics
The XC3S50AN-4FT256C delivers impressive performance metrics suitable for demanding applications:
- Maximum system clock frequency optimized for the -4 speed grade
- Low power consumption ideal for battery-operated devices
- Fast configuration time due to integrated non-volatile memory
- Excellent signal integrity through advanced package design
Price
The XC3S50AN-4FT256C is competitively priced to offer exceptional value for embedded system designers. Pricing varies based on quantity, with volume discounts available for production orders. Contact authorized Xilinx distributors for current pricing information, as costs may fluctuate based on market conditions and order volumes. Educational discounts and development kit bundles are often available for qualifying institutions and engineers.
For the most accurate and up-to-date pricing on the XC3S50AN-4FT256C, consult official Xilinx distributors or the manufacturer’s direct sales channels.
Documents & Media
Technical Documentation
Comprehensive documentation supports successful implementation of the XC3S50AN-4FT256C:
Datasheets and Specifications:
- Complete electrical characteristics and AC/DC parameters
- Package mechanical drawings and pinout diagrams
- Thermal performance data and junction temperature specifications
- Power consumption analysis across different operating conditions
Design Guides:
- PCB layout guidelines for optimal signal integrity
- Decoupling and power supply design recommendations
- Thermal management strategies for reliable operation
- EMI/EMC compliance guidelines
Software Resources:
- Xilinx ISE Design Suite compatibility information
- Constraint file templates and design examples
- IP core integration guides and reference designs
Application Notes
Specialized application notes provide detailed implementation guidance for common use cases with the XC3S50AN-4FT256C, covering topics such as memory controller design, communication protocol implementation, and system integration best practices.
Related Resources
Development Tools
The XC3S50AN-4FT256C integrates seamlessly with Xilinx’s comprehensive development ecosystem:
Design Software:
- Xilinx ISE Design Suite for complete design flow management
- ChipScope Pro for advanced debugging and analysis
- EDK (Embedded Development Kit) for processor-based designs
Evaluation Platforms:
- Spartan-3AN starter kits featuring the XC3S50AN-4FT256C
- Development boards with comprehensive peripheral interfaces
- Reference designs demonstrating key functionality
Compatible Components
The XC3S50AN-4FT256C works effectively with various companion devices:
- Configuration PROMs for additional non-volatile storage
- Clock generation and distribution devices
- Power management ICs optimized for FPGA applications
- High-speed transceivers for communication interfaces
Technical Support
Extensive technical support resources ensure successful project completion:
- Online forums and community support networks
- Application engineering assistance for complex designs
- Training courses and webinars covering FPGA design methodologies
- Comprehensive knowledge base with troubleshooting guides
Environmental & Export Classifications
Environmental Compliance
The XC3S50AN-4FT256C meets stringent environmental standards:
RoHS Compliance: Fully compliant with RoHS (Restriction of Hazardous Substances) directive, ensuring lead-free manufacturing and environmental responsibility.
REACH Regulation: Complies with European REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) requirements for chemical safety.
Halogen-Free: Available in halogen-free package options supporting green manufacturing initiatives.
Operating Conditions
Environmental specifications ensure reliable operation across diverse conditions:
- Temperature Range: Commercial grade (0ยฐC to +85ยฐC junction temperature)
- Humidity: Non-condensing environments up to 85% relative humidity
- Altitude: Operation certified up to 2000 meters above sea level
- Vibration and Shock: Meets standard automotive and industrial requirements
Export Classifications
The XC3S50AN-4FT256C complies with international trade regulations:
ECCN (Export Control Classification Number): Classified under appropriate ECCN for semiconductor devices, ensuring compliance with U.S. export administration regulations.
Country of Origin: Manufacturing location clearly identified for customs and regulatory compliance.
Conflict Minerals: Certified conflict-free sourcing in accordance with Dodd-Frank Act requirements.
The XC3S50AN-4FT256C represents an excellent choice for engineers seeking a reliable, high-performance FPGA solution with integrated non-volatile configuration storage. Its combination of robust specifications, comprehensive documentation, and environmental compliance makes it ideal for a wide range of embedded applications requiring programmable logic functionality.
