The XC3S50A-FTG256 is a versatile and cost-effective field-programmable gate array (FPGA) from Xilinx’s Spartan-3A family, designed to deliver reliable performance for a wide range of digital logic applications. This compact yet powerful FPGA offers exceptional value for developers seeking flexible programmable logic solutions in a space-efficient package.
Product Specifications
The XC3S50A-FTG256 features a robust architecture built on advanced 90nm process technology. This FPGA contains 50,000 system gates with 1,584 logic cells, providing ample resources for complex digital designs. The device includes 108 Kbits of total block RAM and supports up to 195 user I/O pins, making it suitable for applications requiring significant memory and connectivity.
Key specifications include an operating voltage range of 1.2V for the core and 1.2V to 3.3V for I/O operations. The XC3S50A-FTG256 operates reliably across commercial temperature ranges from 0ยฐC to +85ยฐC. The 256-ball Fine-Pitch Ball Grid Array (FTG256) package measures 17mm x 17mm with a 0.8mm ball pitch, optimizing board space utilization while maintaining excellent thermal performance.
The device incorporates dedicated multipliers, distributed RAM, and flexible clock management resources. With its hierarchical design methodology support and extensive IP core library compatibility, the XC3S50A-FTG256 accelerates development cycles while reducing overall system costs.
Price
Pricing for the XC3S50A-FTG256 varies based on order quantity, speed grade, and supplier. Commercial pricing typically ranges from competitive rates for volume purchases, with educational and prototype quantities available at higher per-unit costs. Contact authorized Xilinx distributors for current pricing information, as semiconductor prices fluctuate based on market conditions and availability.
Volume discounts are generally available for orders exceeding standard quantity breaks. Many suppliers offer flexible payment terms and can provide pricing quotes for specific project requirements. Consider lifecycle costs and long-term availability when evaluating the XC3S50A-FTG256 for production applications.
Documents & Media
Comprehensive technical documentation supports XC3S50A-FTG256 implementation and design. The complete datasheet provides detailed electrical characteristics, timing specifications, and package information essential for proper circuit design. Application notes cover specific implementation topics including power management, signal integrity, and thermal considerations.
Reference designs and evaluation boards accelerate prototyping and proof-of-concept development. The Xilinx ISE Design Suite provides complete development tools including synthesis, place-and-route, and debugging capabilities specifically optimized for Spartan-3A devices. User guides detail the development flow from initial design entry through final bitstream generation.
Technical support resources include online forums, knowledge base articles, and direct engineering support for complex design challenges. Video tutorials and webinars provide additional learning resources for both new and experienced FPGA developers working with the XC3S50A-FTG256.
Related Resources
The XC3S50A-FTG256 integrates seamlessly with Xilinx’s broader ecosystem of development tools and IP cores. Compatible development boards provide immediate evaluation platforms, while third-party modules extend functionality for specialized applications. The device works with industry-standard design flows and supports popular HDL languages including VHDL and Verilog.
Complementary components include configuration memory devices, power management ICs, and high-speed interface solutions that enhance XC3S50A-FTG256 system implementations. Partner solutions extend capabilities into areas such as embedded processing, high-speed communications, and digital signal processing.
Training resources and certification programs help development teams maximize productivity with Spartan-3A technology. The active user community provides peer support and shares proven design techniques specific to the XC3S50A-FTG256 and related devices.
Environmental & Export Classifications
The XC3S50A-FTG256 meets stringent environmental compliance standards including RoHS directive compliance for lead-free manufacturing processes. The device qualifies for commercial temperature operation and standard MSL-3 moisture sensitivity level requirements during assembly processes.
Export classification follows standard semiconductor industry protocols. The XC3S50A-FTG256 generally falls under standard export control classifications, though specific applications may require additional review. Consult current export control documentation for applications involving sensitive technologies or restricted destinations.
Environmental operating specifications ensure reliable operation across industrial temperature ranges with appropriate thermal management. The device supports standard assembly processes and demonstrates excellent long-term reliability when operated within specified parameters. Proper handling procedures during storage and assembly maintain device integrity and performance characteristics.
