The XC3S500E-FT256DGQ is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance and flexibility for a wide range of digital design applications. This cost-effective FPGA solution combines advanced features with reliable operation, making it an ideal choice for engineers and developers seeking robust programmable logic capabilities.
Product Specifications
Core Features of XC3S500E-FT256DGQ
Logic Capacity & Architecture:
- 500,000 system gates providing substantial logic resources
- 10,476 logic cells for complex digital implementations
- 4-input lookup tables (LUTs) with dedicated carry logic
- 20 dedicated multipliers for efficient DSP operations
- 360 Kbits of block RAM for on-chip memory requirements
I/O and Package Details:
- FT256 package in fine-pitch BGA format
- 190 user I/O pins for comprehensive connectivity
- LVTTL, LVCMOS, SSTL, and HSTL I/O standards support
- Commercial temperature range (0ยฐC to +85ยฐC)
- Lead-free RoHS compliant packaging
Performance Specifications:
- Maximum operating frequency up to 326 MHz
- Low power consumption with multiple power management modes
- Fast configuration through multiple interfaces
- In-system programmability for design flexibility
Memory and Connectivity:
- Distributed RAM capability within logic cells
- Block SelectRAM for efficient memory implementation
- Digital Clock Manager (DCM) for clock synthesis and management
- JTAG boundary scan for testing and debugging
Pricing Information
The XC3S500E-FT256DGQ pricing varies based on quantity, supplier, and market conditions. For current pricing information and volume discounts:
- Small quantities (1-10 units): Contact authorized distributors
- Production volumes (100+ units): Request quotation from Xilinx partners
- Development samples: Available through Xilinx design centers
- Educational pricing: Special rates available for academic institutions
Note: Prices are subject to change based on market conditions and availability. Contact authorized suppliers for real-time pricing.
Documents & Media
Technical Documentation for XC3S500E-FT256DGQ
Datasheets and Specifications:
- Spartan-3E FPGA Family Complete Data Sheet
- XC3S500E-FT256DGQ Product Brief
- Electrical Characteristics and Operating Conditions
- Package and Pinout Information (FT256 BGA)
Design Resources:
- Xilinx ISE Design Suite compatibility guide
- Constraint files and UCF templates
- Reference designs and application notes
- Power estimation spreadsheets
Development Tools:
- ISE WebPACK (free development environment)
- ChipScope Pro for debugging
- EDK (Embedded Development Kit) support
- IP Core Generator compatibility
Application Notes:
- Clock management best practices
- I/O planning guidelines
- Power optimization techniques
- PCB design recommendations for FT256 package
Related Resources
Compatible Development Boards
Xilinx Development Platforms:
- Spartan-3E Starter Kit
- Nexys2 Academic Board
- Digilent Basys2 Educational Platform
Third-Party Solutions:
- Custom carrier boards for specific applications
- Evaluation modules from authorized partners
- Industrial-grade development systems
Software Tools and IP Cores
Design Software:
- Xilinx Vivado (for newer projects with migration path)
- ModelSim simulation environment
- Synopsys Synplify synthesis tools
IP Portfolio:
- MicroBlaze soft processor core
- Communication interfaces (UART, SPI, I2C)
- Memory controllers and DSP functions
- Custom IP development frameworks
Training and Support
Educational Resources:
- Online training modules for Spartan-3E architecture
- Video tutorials for ISE Design Suite
- Academic course materials and lab exercises
Technical Support:
- Xilinx Answer Database with solutions
- Community forums and user groups
- Application engineering support
Environmental & Export Classifications
Environmental Compliance
RoHS Compliance: The XC3S500E-FT256DGQ meets RoHS (Restriction of Hazardous Substances) requirements, ensuring environmental responsibility and regulatory compliance for global markets.
Environmental Standards:
- Lead-free manufacturing process
- Halogen-free package options available
- WEEE compliant for end-of-life recycling
- REACH regulation conformance
Operating Environment
Temperature Specifications:
- Commercial grade: 0ยฐC to +85ยฐC ambient temperature
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity tolerance: Up to 85% relative humidity (non-condensing)
Export and Trade Classifications
Export Control Information:
- ECCN (Export Control Classification Number): Classified under US export regulations
- HTS (Harmonized Tariff Schedule): Semiconductor classification
- Country of Origin: Manufacturing location varies by production batch
Regulatory Compliance:
- FCC compliance for electromagnetic emissions
- CE marking eligibility for European markets
- ISO 9001 quality management system compliance
Trade Considerations:
- Subject to export licensing requirements for certain countries
- Documentation available for customs clearance
- Certificate of origin provided upon request
The XC3S500E-FT256DGQ represents an excellent balance of performance, cost-effectiveness, and design flexibility, making it suitable for applications ranging from industrial automation to consumer electronics. With comprehensive development tool support and extensive documentation, this FPGA enables efficient design implementation and rapid time-to-market for innovative digital solutions.
