The XC3S500E-FGG320DGQ is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3E family. This advanced programmable logic device delivers exceptional functionality and bandwidth optimization, making it an ideal choice for high-volume, cost-sensitive consumer electronics applications.
1. Product Specifications
Core Technical Specifications
- Part Number: XC3S500E-FGG320DGQ
- Manufacturer: Xilinx (now AMD)
- FPGA Family: Spartan-3E
- System Gates: 500,000 gates
- Logic Cells: 10,476 equivalent logic cells
- Maximum Frequency: 572 MHz
- Process Technology: 90nm CMOS technology
- Supply Voltage: 1.2V
- Package Type: 320-Pin F-BGA (Fine Ball Grid Array)
- Temperature Range: Commercial grade
- Operating Temperature: 0ยฐC to +85ยฐC
Memory and I/O Features
- Block RAM: Up to 1,728 Kbits total block RAM capacity
- Distributed RAM: Up to 432 Kbits total distributed RAM
- I/O Pins: Up to 633 I/O pins available
- Flip-Flops: 9,312 Flip-Flops/LUTs
- Slices: 4,656 configurable logic slices
- RAM16/SRL16: 4,656 distributed memory elements
Advanced Features
- SelectIO Signaling Technology
- 18 single-ended signal standards
- 8 differential signal standards (including LVDS and RSDS)
- Double Data Rate (DDR) support
- Digital Clock Manager (DCM)
- Four DCMs for advanced clock management
- Clock skew elimination
- Frequency synthesis capabilities
- High-resolution phase shifting
- Dedicated Multipliers: Built-in 18 x 18 multipliers for DSP applications
- JTAG Support: IEEE 1149.1/1532 compatible JTAG logic
- SelectRAM Hierarchical Memory: Flexible memory architecture
2. Price Information
The XC3S500E-FGG320DGQ offers competitive pricing for volume purchases:
Current Market Pricing (USD)
- 360+ units: $115.40 per unit
- 720+ units: $107.04 per unit
- 1,440+ units: $90.31 per unit
- 2,160+ units: $81.95 per unit
- 2,880+ units: $74.26 per unit
- 3,600+ units: $65.22 per unit
- 36,000+ units: $61.21 per unit
Pricing subject to market fluctuations and availability. Contact authorized distributors for current quotes and volume discounts.
Cost-Effectiveness Benefits
The XC3S500E-FGG320DGQ delivers exceptional value through:
- Enhanced logic-to-cost ratio compared to previous generations
- Reduced system implementation costs
- Lower power consumption reducing operational expenses
- Proven reliability reducing maintenance costs
3. Documents & Media
Technical Documentation
- Datasheet: Spartan-3E FPGA Family Complete Data Sheet (DS312)
- User Guide: Spartan-3E FPGA User Guide
- Configuration Guide: Spartan-3E Configuration User Guide
- SelectIO Resources: SelectIO Resources User Guide
- Package Information: FGG320 Package Specifications and Pinout
Software Tools and Development Resources
- Vivado Design Suite: Primary development environment (recommended)
- ISE Design Suite: Legacy development tools (compatibility maintained)
- ChipScope Pro: Hardware debugging and verification
- System Generator: MATLAB/Simulink integration tools
- Development Boards: Various third-party evaluation and development boards available
Application Notes and Reference Designs
- Consumer electronics reference designs
- Communication systems implementations
- Digital signal processing examples
- Interface and connectivity solutions
- Power management optimization guides
4. Related Resources
Development Ecosystem
- Evaluation Boards: ZedBoard, Basys 3, Nexys4-DDR platforms
- Starter Kits: Spartan-3E FPGA Starter Kit for rapid prototyping
- Development Tools: Comprehensive software suite for design and implementation
- IP Cores: Extensive library of verified intellectual property cores
- Community Support: Active developer forums and technical communities
Compatible Products and Alternatives
- XC3S500E-4FGG320C: Commercial temperature grade variant
- XC3S500E-4FGG320I: Industrial temperature grade option
- XC3S500E-FT256: Alternative package configuration
- XC3S1200E-FGG320: Higher capacity option in same package
Application Areas
The XC3S500E-FGG320DGQ excels in diverse applications:
- Broadband Access Equipment: Cable modems, DSL equipment
- Home Networking: Routers, switches, wireless access points
- Display Technology: Projection systems, LCD controllers
- Digital Television: Set-top boxes, video processing
- Industrial Control: Automation systems, motor controllers
- Communications: Protocol processing, interface bridging
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not RoHS compliant (contains restricted substances)
- REACH Compliance: Meets EU REACH regulation requirements
- WEEE Directive: Compliant with electronic waste regulations
- Environmental Grade: Standard commercial environmental rating
Operating Conditions
- Storage Temperature: -65ยฐC to +150ยฐC
- Operating Humidity: 10% to 85% relative humidity (non-condensing)
- Thermal Characteristics: Optimized for standard commercial environments
- ESD Sensitivity: Class 1 electrostatic discharge sensitive device
Export and Trade Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- Country of Origin: Manufactured in various locations under Xilinx/AMD quality standards
- Trade Compliance: Complies with international trade regulations
- Conflict Minerals: Follows industry conflict minerals reporting standards
Quality and Reliability Standards
- Manufacturing Standard: ISO 9001 certified manufacturing processes
- Reliability Testing: Comprehensive qualification and stress testing
- Quality Assurance: Full traceability and quality documentation
- Automotive Qualification: Standard commercial grade (automotive versions available separately)
Safety and Regulatory Certifications
- Safety Standards: Meets applicable electrical safety requirements
- EMC Compliance: Electromagnetic compatibility certified
- International Standards: Complies with relevant IEC and ANSI standards
- Product Marking: Complete part number and manufacturing traceability marking
The XC3S500E-FGG320DGQ represents Xilinx’s commitment to delivering cost-effective, high-performance FPGA solutions for volume production applications. With its advanced 90nm process technology, comprehensive feature set, and proven reliability, this device enables innovative designs across diverse market segments while maintaining competitive total cost of ownership.
For technical support, design assistance, or volume pricing inquiries, contact authorized Xilinx/AMD distributors or access the comprehensive online resources through the AMD Adaptive Computing documentation portal.
