The XC3S400AN-5FGG400C is a versatile field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3AN family, designed to deliver exceptional performance and reliability for demanding electronic applications. This advanced FPGA combines programmable logic with integrated flash memory, making it an ideal solution for industrial, automotive, and consumer electronics projects.
Product Specifications
Core Features
- Device Family: Spartan-3AN FPGA
- Logic Cells: 400,000 system gates
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 400 pins
- Speed Grade: -5 (high performance)
- Operating Temperature: Industrial grade (-40°C to +100°C)
- Supply Voltage: 1.2V core, 3.3V I/O
Technical Specifications
The XC3S400AN-5FGG400C features 8,064 logic cells with distributed RAM capability and 20 dedicated multipliers for DSP applications. The device includes 288 Kb of block RAM and supports up to 264 user I/O pins, providing extensive connectivity options for complex designs. The integrated SPI flash memory eliminates the need for external configuration devices, reducing system cost and board space requirements.
Performance Characteristics
- Maximum Frequency: Up to 326 MHz
- Power Consumption: Optimized for low-power applications
- Configuration Time: Fast startup with integrated flash
- I/O Standards: Support for multiple voltage levels and signaling standards
- Clock Management: Digital Clock Manager (DCM) for precise timing control
Pricing Information
Pricing for the XC3S400AN-5FGG400C varies based on order quantity and distributor. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for quantities over 100 units. Educational institutions may qualify for special academic pricing programs.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and timing parameters
- User Guide: Comprehensive implementation guidelines
- Package Information: Mechanical drawings and pin assignments
- Application Notes: Design examples and best practices
- Errata: Known issues and workarounds
Development Resources
- Vivado Design Suite: Professional FPGA development environment
- IP Core Libraries: Pre-verified intellectual property blocks
- Reference Designs: Proven implementation examples
- Simulation Models: VHDL and Verilog behavioral models
Related Resources
Development Tools
The XC3S400AN-5FGG400C is fully supported by AMD Xilinx’s comprehensive development ecosystem. The Vivado Design Suite provides integrated design entry, synthesis, implementation, and debugging capabilities specifically optimized for Spartan-3AN devices.
Evaluation Platforms
Several evaluation boards featuring the XC3S400AN-5FGG400C are available to accelerate prototyping and development. These platforms include essential peripherals, connectors, and example designs to demonstrate the device’s capabilities.
Training and Support
AMD Xilinx offers extensive training programs, webinars, and technical support resources to help engineers maximize their success with the XC3S400AN-5FGG400C. The active user community provides additional support through forums and knowledge-sharing platforms.
Environmental & Export Classifications
Environmental Compliance
The XC3S400AN-5FGG400C meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device is manufactured using environmentally responsible processes and materials that minimize ecological impact.
Export Control Information
- ECCN Classification: 3A001.a.7
- HTS Code: 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export License: May require export authorization for certain destinations
Quality Standards
The XC3S400AN-5FGG400C is manufactured in ISO 9001 certified facilities and undergoes rigorous testing to ensure reliability in demanding applications. The device meets automotive AEC-Q100 qualification standards for automotive applications and industrial temperature requirements for harsh operating environments.
Package and Handling
The FBGA package provides excellent thermal performance and signal integrity while maintaining a compact footprint. Proper ESD handling procedures should be followed during assembly and testing. Storage recommendations include controlled temperature and humidity conditions to maintain device reliability.
The XC3S400AN-5FGG400C represents an excellent balance of performance, features, and cost-effectiveness for applications requiring programmable logic with integrated flash memory. Its robust design and comprehensive development support make it suitable for a wide range of industrial and commercial applications.
