The XC3S400A-FTG256I is a versatile and cost-effective field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family. This industrial-grade programmable logic device delivers exceptional performance for demanding applications while maintaining excellent value for money. The XC3S400A-FTG256I features advanced architecture optimized for high-speed digital signal processing, embedded control, and system integration tasks.
Product Specifications
Core Features of XC3S400A-FTG256I
- Logic Cells: 8,064 system gates with 400,000 equivalent system gates
- Package Type: FTG256 (Fine-pitch Ball Grid Array, 256 pins)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Speed Grade: -4 speed grade for high-performance applications
- Supply Voltage: 1.2V core, 3.3V I/O
- Configuration Memory: Non-volatile Flash-based configuration
Technical Specifications
- CLB (Configurable Logic Blocks): 896 CLBs
- Block RAM: 360 Kbits distributed across 20 blocks
- Distributed RAM: 56 Kbits
- Multipliers: 16 dedicated 18×18 multipliers
- DCM (Digital Clock Managers): 4 DCMs for advanced clock management
- I/O Pins: 172 user I/O pins
- Maximum System Clock: Up to 200 MHz
The XC3S400A-FTG256I incorporates Xilinx’s proven 90nm process technology, ensuring reliable operation and excellent power efficiency for industrial environments.
Price Information
Current Market Price Range: $15-45 USD per unit Pricing varies based on quantity, supplier, and market conditions. Contact authorized distributors for current volume pricing and availability.
Cost-Effective Benefits
- Competitive pricing compared to similar capacity FPGAs
- Excellent price-to-performance ratio for mid-range applications
- Long-term availability guaranteed by Xilinx
- Reduced total system cost through integration capabilities
Documents & Media
Essential Documentation
- XC3S400A-FTG256I Datasheet: Complete electrical and timing specifications
- Spartan-3A Family User Guide: Comprehensive architecture overview
- Package Information: FTG256 pinout diagrams and mechanical drawings
- Application Notes: Design guidelines and best practices
- Errata Documentation: Known issues and workarounds
Design Resources
- Reference Designs: Sample VHDL/Verilog code examples
- Constraint Files: UCF templates for common applications
- Simulation Models: Behavioral and timing simulation support
- CAD Libraries: Footprints for major PCB design tools
All documentation available through Xilinx Support Center and authorized distributor websites.
Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Real-time verification and debugging
- EDK (Embedded Development Kit): Embedded processor design tools
- ModelSim: Advanced HDL simulation platform
Compatible Products
- XC3S250A-FTG256I: Lower capacity alternative
- XC3S700A-FTG256I: Higher capacity option in same package
- Spartan-6 Family: Next-generation upgrade path
- Configuration PROMs: XCF02S, XCF04S for configuration storage
Application Areas
The XC3S400A-FTG256I excels in diverse industrial applications including:
- Digital signal processing systems
- Industrial automation and control
- Communications infrastructure
- Medical device electronics
- Automotive control systems
- Test and measurement equipment
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package construction
- REACH Regulation: Compliant with EU chemical safety standards
- Conflict Minerals: Responsibly sourced materials
- Environmental Grade: Industrial temperature range operation
Export Control Information
- ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.31.0001
- Country of Origin: Manufactured in various Xilinx facilities globally
- Export Restrictions: Subject to US export control regulations
Quality Certifications
- ISO 9001: Quality management system certified
- Automotive Grade: AEC-Q100 qualified versions available
- Military Standards: MIL-STD-883 screening options
Package Information
- Moisture Sensitivity Level: MSL-3 (168 hours at 30ยฐC/60% RH)
- Storage Temperature: -65ยฐC to +150ยฐC
- Package Material: BT (Bismaleimide Triazine) substrate
- Ball Material: SAC305 lead-free solder balls
The XC3S400A-FTG256I represents an ideal balance of performance, features, and cost-effectiveness for industrial FPGA applications. Its robust architecture, comprehensive development ecosystem, and proven reliability make it an excellent choice for demanding embedded system designs requiring programmable logic capabilities.
