The XC3S400A-4FG400I is a powerful and versatile FPGA (Field-Programmable Gate Array) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for a wide range of digital signal processing and embedded system applications. This advanced programmable logic device combines cost-effectiveness with robust functionality, making it an ideal choice for engineers and developers seeking reliable FPGA solutions.
Product Specifications
The XC3S400A-4FG400I features comprehensive technical specifications that demonstrate its capability for demanding applications. This FPGA incorporates 400,000 system gates with 8,064 logic cells, providing substantial processing power for complex digital designs. The device includes 126 user I/O pins housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package, ensuring excellent connectivity options for system integration.
Key specifications of the XC3S400A-4FG400I include a speed grade of -4, indicating optimized performance characteristics, and an industrial temperature range operation from -40ยฐC to +100ยฐC. The device operates on multiple voltage levels, with core voltage requirements of 1.2V and I/O voltage support ranging from 1.2V to 3.3V, providing flexibility for various system architectures.
Memory resources within the XC3S400A-4FG400I encompass 360 Kbits of total block RAM, distributed across 20 dedicated 18-Kbit block RAM modules. Additionally, the FPGA includes 16 dedicated multipliers for efficient digital signal processing operations, making it particularly suitable for applications requiring intensive mathematical computations.
Pricing Information
The XC3S400A-4FG400I offers competitive pricing within the FPGA market segment, reflecting its position as a cost-effective solution for mid-range applications. Pricing for the XC3S400A-4FG400I typically varies based on quantity, distribution channel, and current market conditions. Volume pricing discounts are generally available for larger orders, making this FPGA an economical choice for production deployments.
For current pricing information on the XC3S400A-4FG400I, customers should contact authorized Xilinx distributors or electronic component suppliers. Educational institutions and research organizations may qualify for special academic pricing programs, further enhancing the value proposition of the XC3S400A-4FG400I for learning and development purposes.
Documents & Media
Comprehensive documentation supports the XC3S400A-4FG400I throughout the design and implementation process. The official datasheet provides detailed electrical characteristics, pinout information, and timing specifications essential for proper device utilization. Package and pinout diagrams offer visual references for PCB design and component placement.
Application notes specific to the XC3S400A-4FG400I cover various implementation scenarios, including power management, signal integrity considerations, and thermal design guidelines. These resources help engineers optimize their designs and avoid common pitfalls during development.
Design software support for the XC3S400A-4FG400I includes compatibility with Xilinx ISE Design Suite, providing a complete development environment for FPGA programming and configuration. Reference designs and example projects demonstrate practical applications of the XC3S400A-4FG400I in real-world scenarios.
Related Resources
The XC3S400A-4FG400I ecosystem includes numerous complementary resources that enhance its utility and ease of implementation. Development boards featuring the XC3S400A-4FG400I provide hands-on learning platforms and rapid prototyping capabilities for engineers and students.
Configuration devices compatible with the XC3S400A-4FG400I, such as Platform Flash PROMs, enable standalone operation without external configuration sources. Power management solutions specifically designed for Spartan-3A FPGAs ensure optimal performance and efficiency in battery-powered applications.
Third-party IP cores optimized for the XC3S400A-4FG400I architecture expand functional capabilities, including communication protocols, digital signal processing algorithms, and interface controllers. These pre-verified modules accelerate development timelines and reduce design risk.
Environmental & Export Classifications
The XC3S400A-4FG400I meets stringent environmental and regulatory standards required for global deployment. RoHS compliance ensures the device contains no hazardous substances, supporting environmentally responsible manufacturing practices. The industrial temperature grade qualification of the XC3S400A-4FG400I enables operation in harsh environmental conditions.
Export classification for the XC3S400A-4FG400I follows applicable trade regulations, with specific Export Control Classification Numbers (ECCN) assigned based on device capabilities and intended applications. Customers must verify current export requirements for their specific use cases and destinations.
Reliability testing of the XC3S400A-4FG400I includes extensive qualification procedures covering temperature cycling, humidity exposure, and mechanical stress conditions. These comprehensive evaluations ensure consistent performance throughout the device lifecycle, supporting mission-critical applications where reliability is paramount.
The XC3S400A-4FG400I represents an excellent balance of performance, cost, and versatility within the FPGA landscape, making it a preferred choice for engineers developing next-generation electronic systems across diverse industries and applications.
