The XC3S250E-4PQG208C is a versatile and cost-effective FPGA (Field Programmable Gate Array) from Xilinx’s proven Spartan-3E family, designed to deliver exceptional performance for a wide range of digital logic applications. This 208-pin PQFP package device combines advanced functionality with competitive pricing, making it an ideal choice for engineers developing consumer electronics, industrial automation, and embedded systems.
Product Specifications
The XC3S250E-4PQG208C offers robust specifications that meet demanding application requirements:
Logic Capacity & Architecture:
- 250,000 system gates providing ample logic resources
- 5,508 logic cells for complex digital designs
- 432 CLB (Configurable Logic Block) slices
- 216 dedicated 18×18 multipliers for DSP applications
- 216 Kbits of block RAM for efficient data storage
Performance Characteristics:
- Speed grade -4 delivering fast signal processing capabilities
- Maximum operating frequency up to 320 MHz
- Low power consumption optimized for battery-powered applications
- Advanced process technology ensuring reliable operation
Package & I/O Features:
- 208-pin PQFP (Plastic Quad Flat Package) for easy PCB mounting
- 158 user I/O pins supporting various voltage standards
- Commercial temperature range (0ยฐC to +85ยฐC)
- RoHS compliant lead-free package construction
Memory & Connectivity:
- Distributed RAM capabilities for flexible memory implementation
- Multiple clock management units (CMTs) with DLL/PLL
- Support for various I/O standards including LVTTL, LVCMOS, and differential signaling
- Boundary scan (JTAG) support for testing and debugging
Price
The XC3S250E-4PQG208C is competitively priced to provide excellent value for development projects and volume production. Pricing varies based on quantity, distributor, and current market conditions. For the most current pricing information:
- Contact authorized Xilinx distributors for volume pricing
- Check electronic component suppliers for small quantity purchases
- Educational discounts may be available for academic institutions
- Consider lifecycle status when planning long-term projects
Note: Prices fluctuate based on market demand and availability. Always verify current pricing with suppliers before finalizing designs.
Documents & Media
Comprehensive documentation supports the XC3S250E-4PQG208C throughout the design process:
Datasheets & Technical Documents:
- Spartan-3E FPGA Family Complete Data Sheet
- XC3S250E Device Utilization and Performance Summary
- Spartan-3E FPGA Packaging and Pinout Specifications
- DC and AC Switching Characteristics
- Configuration User Guide
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Constraint files and UCF templates
- Reference designs and application notes
- Power estimation spreadsheets and tools
Support Materials:
- PCB layout guidelines and land pattern recommendations
- Thermal management application notes
- Signal integrity design considerations
- Migration guides from other FPGA families
Related Resources
The XC3S250E-4PQG208C integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Tools:
- Xilinx ISE WebPACK (free development environment)
- ChipScope Pro for embedded logic analysis
- PlanAhead design planning and floorplanning tool
- CORE Generator for IP core integration
Evaluation Platforms:
- Spartan-3E Starter Kit for rapid prototyping
- Compatible development boards from third-party vendors
- Educational FPGA boards for learning and training
IP Cores & Libraries:
- Free and premium IP cores from Xilinx
- Third-party IP solutions for common functions
- Open-source HDL libraries and examples
- Community-contributed designs and tutorials
Family Alternatives:
- XC3S100E-4PQG208C for smaller designs
- XC3S500E-4PQG208C for increased logic capacity
- Migration path to newer Spartan families
- Pin-compatible options for design flexibility
Environmental & Export Classifications
The XC3S250E-4PQG208C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (Restriction of Hazardous Substances)
- Lead-free package construction and assembly
- Green package marking for environmental identification
- Conflict minerals compliance reporting available
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Extended temperature variants available upon request
- Humidity tolerance per JEDEC standards
- ESD protection exceeding industry requirements
Export & Trade Classifications:
- Export Control Classification Number (ECCN) compliance
- Dual-use technology considerations for international shipping
- Country-specific import/export documentation requirements
- Trade compliance certifications available
Quality & Reliability:
- Automotive-grade options available for critical applications
- Military and aerospace qualified variants
- ISO 9001 certified manufacturing processes
- Comprehensive quality assurance testing
Packaging & Handling:
- Moisture sensitivity level (MSL) rating for storage
- Tape and reel packaging for automated assembly
- Anti-static packaging for component protection
- Traceability documentation for quality control
The XC3S250E-4PQG208C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its comprehensive support ecosystem and proven reliability make it a trusted choice for engineers worldwide developing next-generation electronic systems.
