The XC3S200AN-4FTG256C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional functionality for embedded system applications. This advanced FPGA combines programmable logic, dedicated memory, and integrated configuration flash to provide a complete system-on-chip solution.
Product Specifications
The XC3S200AN-4FTG256C features robust technical specifications that make it ideal for demanding applications:
Core Architecture:
- 200,000 system gates capacity
- 4,320 logic cells with advanced CLB (Configurable Logic Block) architecture
- Speed grade: -4 (standard performance)
- Package type: FTG256 (Fine-pitch Ball Grid Array)
- 256-pin FBGA package with 1.0mm ball pitch
Memory Resources:
- 12 dedicated 18Kb block RAMs providing 216Kb total memory
- Distributed RAM capability within logic cells
- Integrated SPI serial flash memory for configuration storage
- Non-volatile configuration eliminates need for external boot memory
I/O Capabilities:
- Up to 173 user I/O pins available
- Multiple I/O standards support including LVTTL, LVCMOS, and differential signaling
- Programmable drive strength and slew rate control
- Hot-swappable I/O support for live system insertion
Performance Features:
- Operating frequency up to 320MHz+ depending on design complexity
- Low power consumption optimized for portable applications
- Industrial temperature range: -40ยฐC to +100ยฐC
- Commercial and industrial grade options available
Price Information
The XC3S200AN-4FTG256C pricing varies based on order quantity and supplier:
Typical Pricing Structure:
- Single unit pricing: Contact authorized distributors for current rates
- Volume pricing available for quantities of 100+ units
- Educational and development discounts may apply
- Pricing subject to market conditions and availability
Where to Purchase:
- Authorized Xilinx distributors and partners
- Electronic component suppliers
- Online marketplaces for electronic components
- Direct from manufacturer for large volume orders
Note: Prices fluctuate based on market demand, manufacturing costs, and global supply chain factors. Contact suppliers directly for current pricing and availability.
Documents & Media
Comprehensive technical documentation supports the XC3S200AN-4FTG256C implementation:
Official Documentation:
- Product datasheet with complete electrical and timing specifications
- Spartan-3AN FPGA family overview and architecture guide
- Configuration and programming user guide
- Package and pinout documentation
- Migration and compatibility guides
Design Resources:
- Reference designs and application notes
- Schematic symbols and PCB footprints
- 3D mechanical models for CAD integration
- Signal integrity and power delivery guidelines
Software Support:
- Xilinx ISE Design Suite compatibility
- Vivado Design Suite support for newer design flows
- Programming and debugging tool documentation
- Third-party tool integration guides
Related Resources
The XC3S200AN-4FTG256C ecosystem includes various supporting components and resources:
Development Tools:
- Spartan-3AN development boards and starter kits
- Programming cables and debugging interfaces
- Evaluation modules and reference platforms
- Academic and hobbyist development resources
Compatible Components:
- Power management solutions optimized for Spartan-3AN
- Clock generation and distribution circuits
- Memory interfaces and peripheral controllers
- Communication protocol implementations
Technical Support:
- Xilinx technical support portal and community forums
- Application engineering assistance
- Training materials and webinars
- Design consultation services
Software Ecosystem:
- IP core libraries and pre-built functions
- Operating system and middleware support
- Compiler and toolchain compatibility
- Third-party development environment integration
Environmental & Export Classifications
The XC3S200AN-4FTG256C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Halogen-free package options available
- Lead-free soldering process compatible
Quality Standards:
- Automotive grade versions available (AEC-Q100 qualified)
- Industrial temperature grade: -40ยฐC to +100ยฐC
- Commercial temperature grade: 0ยฐC to +85ยฐC
- Moisture sensitivity level (MSL) rating provided
Export Classifications:
- ECCN (Export Control Classification Number): Check current regulations
- Country of origin labeling for trade compliance
- Export license requirements vary by destination country
- Re-export restrictions may apply in certain regions
Reliability Information:
- MTBF (Mean Time Between Failures) data available
- Qualification test results and reliability reports
- Package integrity and thermal cycling specifications
- Long-term availability and lifecycle information
The XC3S200AN-4FTG256C represents a mature, reliable FPGA solution that continues to serve critical applications across industries including telecommunications, industrial automation, medical devices, and aerospace systems. Its combination of integrated flash memory, robust I/O capabilities, and proven architecture makes it an excellent choice for projects requiring dependable programmable logic functionality.
