The XC3S1400A-4FT256C is a powerful FPGA (Field Programmable Gate Array) from Xilinx’s renowned Spartan-3 family, designed to deliver exceptional performance for demanding digital applications. This advanced programmable logic device combines high gate density with cost-effective pricing, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XC3S1400A-4FT256C features robust technical specifications that make it suitable for a wide range of applications:
Core Architecture:
- Logic cells: 1,400,000 system gates
- CLB array: 896 Configurable Logic Blocks
- Block RAM: 576 Kbits total capacity
- Distributed RAM: 128 Kbits
- Multipliers: 32 dedicated 18×18 multipliers
Package Details:
- Package type: FT256 (Fine-pitch Ball Grid Array)
- Pin count: 256 pins
- Speed grade: -4 (commercial temperature range)
- Operating temperature: 0ยฐC to +85ยฐC
- Supply voltage: 1.2V core, 3.3V I/O
Performance Features:
- Maximum frequency: Up to 326 MHz
- I/O standards support: LVTTL, LVCMOS, SSTL, HSTL
- Clock management: Up to 4 Digital Clock Managers (DCMs)
- Configuration memory: SRAM-based
Pricing Information
The XC3S1400A-4FT256C offers competitive pricing in the mid-range FPGA market segment. Pricing varies based on quantity, supplier, and current market conditions. For the most accurate and up-to-date pricing information, we recommend contacting authorized Xilinx distributors or checking major electronic component suppliers. Volume discounts are typically available for orders exceeding 100 units.
Documents & Media
Essential documentation for the XC3S1400A-4FT256C includes:
Technical Documentation:
- Spartan-3 FPGA Family Data Sheet (DS099)
- XC3S1400A-4FT256C Product Brief
- Spartan-3 FPGA User Guide
- Package and Pinout Specifications
- AC/DC Characteristics and Switching Specifications
Design Resources:
- Reference designs and application notes
- PCB layout guidelines for FT256 package
- Power consumption calculation worksheets
- Thermal management guidelines
Software Tools:
- Xilinx ISE Design Suite compatibility information
- Constraint files and UCF templates
- Simulation models and timing files
Related Resources
Development Tools:
- Xilinx ISE WebPACK (free development environment)
- ChipScope Pro Analyzer for debugging
- Spartan-3 Starter Kit and development boards
- Third-party development platforms supporting XC3S1400A-4FT256C
Application Areas:
- Digital signal processing applications
- Communications infrastructure
- Industrial control systems
- Automotive electronics
- Consumer electronics prototyping
- Educational and research projects
Compatible Components:
- Configuration memory devices (Platform Flash, SPI Flash)
- Power management ICs optimized for Spartan-3
- Clock generation and distribution components
- High-speed connectors and interface devices
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliant
- Halogen-free packaging options available
- Pb-free soldering compatible
Operating Conditions:
- Commercial temperature grade: 0ยฐC to +85ยฐC
- Humidity: 10% to 90% non-condensing
- Altitude: Up to 2000 meters
- Vibration and shock resistance per IEC standards
Export Classifications:
- ECCN (Export Control Classification Number): 3A001
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of origin: Various (check specific lot marking)
- Export license requirements may apply for certain destinations
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive grade versions available (AEC-Q100 qualified)
- Military and aerospace grades available upon request
- Full traceability and quality documentation provided
The XC3S1400A-4FT256C represents an excellent balance of performance, cost, and versatility, making it a preferred choice for engineers seeking reliable FPGA solutions. Its comprehensive feature set and extensive support ecosystem ensure successful implementation in diverse applications ranging from prototype development to high-volume production systems.
