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XC3090A-7PG175M – High-Performance FPGA from Xilinx XC3000 Series

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Performance Features

  • Device Family: Xilinx XC3000 Series FPGA
  • Logic Capacity: 6K equivalent gates
  • Configuration Logic Blocks (CLBs): 320 cells
  • Maximum Operating Frequency: 113MHz
  • Technology: High-performance CMOS static memory
  • Logic Delay: 5.1ns typical
  • Supply Voltage: 5V operation
  • Package Type: 175-Pin Plastic Grid Array (PG175M)
  • Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)

Memory and I/O Specifications

  • Configuration Memory: 7.8kB
  • I/O Blocks (IOBs): Perimeter arrangement for maximum flexibility
  • Interconnection Resources: Comprehensive routing matrix
  • Programming: In-system programmable via configuration bitstream

Architecture Highlights

The XC3090A-7PG175M features Xilinx’s proven three-tier architecture:

  • Input/Output Blocks (IOBs): Configurable I/O interface blocks around the device perimeter
  • Configurable Logic Blocks (CLBs): Core processing elements with flexible logic functions
  • Interconnection Matrix: Programmable routing resources connecting all elements

2. Price Information

Current Market Pricing (as of 2025):

  • Single Unit Price: $45 – $85 USD (varies by distributor)
  • Volume Pricing: Available for quantities 100+ pieces
  • Extended Lead Time: 8-16 weeks for standard orders
  • Obsolete Status: Legacy product with limited availability

Note: The XC3090A-7PG175M is a legacy component from Xilinx’s XC3000 series. Pricing fluctuates significantly due to limited supply. Contact authorized distributors for current quotations and availability.

Authorized Distributors:

  • Jotrin Electronics
  • FPGAkey
  • DigiPart
  • Ovaga Technologies
  • Various regional semiconductor distributors

3. Documents & Media

Official Documentation

  • Datasheet: XC3000 Series FPGA Datasheet (PDF)
  • User Guide: XC3090A Implementation Guide
  • Application Notes: XC3000 Design Guidelines
  • Package Information: PG175M Package Specifications

Design Resources

  • Development Tools: Xilinx ISE Design Suite (legacy support)
  • Design Entry: Schematic capture and HDL support
  • Simulation: Logic and timing simulation capabilities
  • Place and Route: Automatic place-and-route tools
  • Programming Files: Bitstream generation utilities

Reference Designs

  • Digital signal processing examples
  • Communication interface implementations
  • Control system applications
  • Test bench templates and verification flows

4. Related Resources

Compatible Development Platforms

  • Legacy Development Boards: XC3000 series evaluation kits
  • Programming Hardware: Xilinx download cables and programmers
  • Third-Party Boards: Various academic and research platforms

Alternative Solutions

For new designs, consider these modern Xilinx FPGA alternatives:

  • Artix-7 Series: Cost-effective, low-power FPGAs
  • Spartan-7 Series: Budget-friendly options for cost-sensitive applications
  • Zynq-7000 Series: ARM processor + FPGA SoC solutions

Technical Support

  • Legacy product support through Xilinx Answer Database
  • Community forums for XC3000 series discussions
  • Third-party consulting services for legacy system maintenance
  • Obsolete part specialists for continued supply

Application Areas

The XC3090A-7PG175M excels in:

  • Industrial Control Systems: PLC and automation applications
  • Communications: Protocol processing and interface bridging
  • Test Equipment: Custom measurement and analysis systems
  • Legacy System Maintenance: Replacement for existing designs
  • Educational Projects: Learning FPGA design concepts

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Status: Non-RoHS Compliant (Contains lead)
  • Manufacturing Date: Circa 1999 technology node
  • Halogen Content: Contains halogenated compounds
  • Environmental Rating: Standard commercial grade components

Package Materials

  • Lead Frame: Lead-containing alloy construction
  • Mold Compound: Standard epoxy resin packaging
  • Die Attach: Traditional silver-filled epoxy
  • Bond Wires: Gold wire bonding technology

Export Control Information

  • ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
  • Country of Origin: Manufactured in various Xilinx facilities
  • Export Restrictions: Standard semiconductor export controls apply
  • Documentation: End-user certificates may be required for certain destinations

Disposal and Recycling

  • Professional e-waste recycling recommended due to lead content
  • Compliance with local environmental regulations required
  • Contact certified electronics recyclers for proper disposal
  • Recovery of precious metals possible through specialized facilities

Quality and Reliability Standards

  • Quality Grade: Military temperature range options available
  • Reliability Testing: Standard semiconductor reliability protocols
  • Qualification Standards: MIL-STD-883 methods where applicable
  • Traceability: Full manufacturing traceability maintained

Important Notice: The XC3090A-7PG175M is a legacy product that is no longer in active production by AMD Xilinx. While existing stock may be available through distributors and brokers, lead times can be extended and pricing volatile. For new design applications, migration to current-generation FPGA families is strongly recommended for better performance, lower power consumption, and assured long-term availability.

For technical inquiries, pricing quotes, or availability information regarding the XC3090A-7PG175M, please contact authorized Xilinx distributors or legacy component specialists.