The XC2VP70-7FF1704C is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, telecommunications, and embedded processing applications. This advanced FPGA combines high-density programmable logic with integrated PowerPC processors, making it an ideal solution for complex system designs requiring both flexibility and processing power.
Product Specification
The XC2VP70-7FF1704C features an impressive array of specifications that position it as a premium choice for high-performance applications. This FPGA incorporates 70,336 logic cells, providing substantial programmable resources for complex designs. The device includes 2 embedded PowerPC 405 processors operating at speeds up to 400 MHz, enabling sophisticated embedded processing capabilities directly within the FPGA fabric.
Key specifications of the XC2VP70-7FF1704C include 328 dedicated multipliers for efficient digital signal processing operations, 4,176 configurable logic blocks (CLBs), and 8,352 slices for maximum design flexibility. The device offers 2,448 Kb of distributed RAM and 5,904 Kb of block RAM, ensuring ample memory resources for data-intensive applications. The FPGA supports multiple I/O standards and provides 996 user I/O pins in the FF1704 package, facilitating seamless integration with various system components.
The XC2VP70-7FF1704C operates with a -7 speed grade, delivering superior performance characteristics with maximum operating frequencies exceeding 400 MHz for many applications. The device supports advanced features including digital clock managers (DCMs) for precise clock generation and distribution, making it suitable for applications requiring tight timing constraints.
Price
Pricing for the XC2VP70-7FF1704C varies based on quantity, supplier, and market conditions. As a high-end FPGA from the Virtex-II Pro series, the XC2VP70-7FF1704C typically commands premium pricing reflecting its advanced capabilities and performance characteristics. Volume purchasers can expect significant cost reductions compared to single-unit pricing.
For current pricing information on the XC2VP70-7FF1704C, contact authorized Xilinx distributors or semiconductor suppliers. Many suppliers offer competitive pricing programs for engineering samples, prototype quantities, and production volumes. Educational institutions and research organizations may qualify for special academic pricing on the XC2VP70-7FF1704C.
Documents & Media
Comprehensive documentation and media resources are available to support XC2VP70-7FF1704C implementation and design optimization. The complete datasheet provides detailed electrical characteristics, timing specifications, and package information essential for successful integration. Application notes demonstrate best practices for utilizing the embedded PowerPC processors and optimizing performance for specific use cases.
The XC2VP70-7FF1704C is supported by extensive design tools including Xilinx ISE Design Suite, which provides synthesis, place-and-route, and timing analysis capabilities. Software development tools for the embedded PowerPC processors include compilers, debuggers, and real-time operating system support. Reference designs and example projects accelerate development cycles and demonstrate proven implementation techniques.
Technical documentation includes user guides for the Virtex-II Pro architecture, power estimation tools, and thermal management guidelines specific to the FF1704 package. Video tutorials and webinar recordings provide additional learning resources for engineers working with the XC2VP70-7FF1704C.
Related Resources
The XC2VP70-7FF1704C ecosystem includes numerous complementary products and resources that enhance its capabilities and simplify system integration. Development boards featuring the XC2VP70-7FF1704C provide complete prototyping platforms with onboard memory, connectivity options, and expansion interfaces. These boards accelerate proof-of-concept development and enable rapid system validation.
Software IP cores optimized for the XC2VP70-7FF1704C include DSP functions, communication protocols, and interface controllers that reduce development time and improve performance. Third-party IP providers offer specialized solutions for applications including video processing, wireless communications, and industrial control systems.
Training resources for the XC2VP70-7FF1704C include online courses, certification programs, and hands-on workshops that build expertise in FPGA design and PowerPC programming. Community forums and technical support services provide ongoing assistance throughout the design process.
Environmental & Export Classifications
The XC2VP70-7FF1704C meets stringent environmental and regulatory standards required for commercial and industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) requirements, ensuring environmental responsibility in manufacturing and deployment. Lead-free packaging options are available to meet evolving environmental regulations.
Export classification for the XC2VP70-7FF1704C falls under specific Electronic Classification Code (ECCN) categories as defined by the Export Administration Regulations (EAR). Users must verify current export control requirements and obtain appropriate licenses when shipping internationally or using in controlled applications. The device’s high-performance capabilities may subject it to additional export restrictions in certain jurisdictions.
Operating temperature ranges for the XC2VP70-7FF1704C span commercial and industrial grades, with proper thermal management ensuring reliable operation across specified conditions. The FF1704 package provides excellent thermal characteristics and mechanical reliability for demanding deployment environments.
The XC2VP70-7FF1704C represents a proven solution for applications requiring the highest levels of performance, integration, and reliability. Its combination of programmable logic, embedded processing, and comprehensive development support makes it an excellent choice for next-generation system designs across multiple industries and applications.
