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XC2VP70-6FFG1517I FPGA: High-Performance Virtex-II Pro Solution

Original price was: $20.00.Current price is: $19.00.

The XC2VP70-6FFG1517I is a premium Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-II Pro family, designed to deliver exceptional performance for demanding applications. This advanced programmable logic device combines high-density logic resources with embedded processing capabilities, making it ideal for telecommunications, aerospace, defense, and high-performance computing applications.

Product Specifications

The XC2VP70-6FFG1517I features robust technical specifications that set it apart in the FPGA market:

Core Architecture:

  • Logic Cells: 70,000 system gates
  • Configurable Logic Blocks (CLBs): Provides flexible digital signal processing capabilities
  • Block RAM: Integrated memory blocks for efficient data storage and retrieval
  • Speed Grade: -6 (high-performance variant)
  • Package Type: FFG1517 (Fine-Pitch Ball Grid Array)
  • Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)

Key Features:

  • PowerPC 405 embedded processor cores for system-level integration
  • Advanced clock management with Digital Clock Manager (DCM)
  • SelectIO technology supporting multiple I/O standards
  • Built-in boundary scan for enhanced testability
  • Low power consumption with advanced power management

Physical Characteristics:

  • Package: 1517-pin Fine-Pitch Ball Grid Array (FFG)
  • Dimensions: Compact form factor optimized for space-constrained applications
  • Pin Count: 1517 pins providing extensive I/O connectivity
  • Lead-free RoHS compliant construction

Price

The XC2VP70-6FFG1517I is competitively priced within the high-performance FPGA segment. Pricing varies based on:

  • Order quantity and volume discounts
  • Distribution channel and regional availability
  • Current market conditions and supply chain factors
  • Packaging and shipping requirements

For current pricing information on the XC2VP70-6FFG1517I, contact authorized Xilinx distributors or request a quote through official channels. Volume pricing and long-term supply agreements are available for qualifying customers.

Documents & Media

Comprehensive technical documentation supports the XC2VP70-6FFG1517I implementation:

Technical Documentation:

  • Official datasheet with complete electrical specifications
  • Pin configuration diagrams and package drawings
  • Power consumption analysis and thermal management guidelines
  • Programming and configuration user guides
  • Application notes for specific use cases

Design Resources:

  • Reference designs and evaluation boards
  • Software development tools and IP cores
  • Simulation models and timing analysis files
  • PCB layout guidelines and design recommendations

Support Materials:

  • Errata documents and silicon revision notes
  • Migration guides from previous generation devices
  • Training materials and webinar resources

Related Resources

The XC2VP70-6FFG1517I integrates seamlessly with Xilinx’s comprehensive ecosystem:

Development Tools:

  • Xilinx Vivado Design Suite for advanced design implementation
  • ModelSim simulation environment compatibility
  • ChipScope Pro for real-time debugging and analysis
  • EDK (Embedded Development Kit) for processor-centric designs

Compatible Products:

  • Other Virtex-II Pro family members for scalable solutions
  • Complementary Xilinx FPGAs for multi-device architectures
  • Third-party IP cores and development boards
  • Memory interfaces and high-speed connectivity solutions

Technical Support:

  • Xilinx technical support forums and knowledge base
  • Field Application Engineer (FAE) assistance
  • Training programs and certification courses
  • User group communities and design contests

Environmental & Export Classifications

The XC2VP70-6FFG1517I meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS (Restriction of Hazardous Substances) compliant
  • WEEE (Waste Electrical and Electronic Equipment) directive compliance
  • Lead-free manufacturing process
  • Halogen-free package options available

Quality Standards:

  • ISO 9001 certified manufacturing
  • Automotive grade variants available (AEC-Q100 qualified)
  • Military and aerospace grade screening options
  • Extended temperature range variants for harsh environments

Export Classifications:

  • Export Administration Regulations (EAR) compliance
  • ECCN (Export Control Classification Number) designation
  • Country-specific import/export documentation
  • Trade compliance and restricted party screening

Reliability Testing:

  • Comprehensive qualification and reliability testing
  • JEDEC standard compliance
  • Accelerated life testing and failure analysis
  • Quality assurance and statistical process control

The XC2VP70-6FFG1517I represents a proven solution for applications requiring high-performance programmable logic with embedded processing capabilities. Its combination of advanced features, comprehensive support resources, and regulatory compliance makes it an excellent choice for mission-critical applications across multiple industries.