The XC2VP50-5FF1517I is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-speed digital processing systems.
Product Specification
The XC2VP50-5FF1517I features a robust architecture built on advanced 90nm process technology. This FPGA incorporates 53,136 logic cells with 4,176 configurable logic blocks (CLBs), providing extensive programmable logic resources for complex digital designs. The device includes 232 embedded 18Kb block RAMs, offering a total of 4,176 Kb of distributed memory for data storage and buffering applications.
Key specifications include 536 user I/O pins configured in a 1517-pin Fine-Pitch Ball Grid Array (FF1517) package. The device operates at a commercial temperature range with a speed grade of -5, ensuring reliable performance in standard operating conditions. The XC2VP50-5FF1517I supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, making it compatible with various system interfaces.
The FPGA includes four PowerPC 405 processor cores running at up to 400MHz, enabling embedded processing capabilities within the programmable logic fabric. These hard processor cores are complemented by 16 rocket I/O multi-gigabit transceivers, supporting high-speed serial communication protocols up to 3.125 Gbps per channel.
Price
Pricing for the XC2VP50-5FF1517I varies based on quantity, distribution channel, and current market conditions. For accurate pricing information and volume discounts, contact authorized Xilinx distributors or visit official electronics component suppliers. Educational institutions and development teams may qualify for special pricing through Xilinx university programs.
Documents & Media
Comprehensive technical documentation is available for the XC2VP50-5FF1517I, including the complete datasheet with electrical characteristics, timing specifications, and pin configuration details. The Virtex-II Pro Family User Guide provides detailed architecture information, configuration procedures, and design guidelines.
Additional resources include package thermal and mechanical specifications, PCB layout guidelines, and power supply design recommendations. Application notes covering specific use cases such as high-speed digital signal processing, embedded system design, and multi-gigabit communication implementations are available through the Xilinx documentation portal.
Development tools documentation includes ISE Design Suite user guides, constraint file templates, and reference designs demonstrating optimal utilization of the XC2VP50-5FF1517I capabilities.
Related Resources
The XC2VP50-5FF1517I is supported by a comprehensive ecosystem of development tools and resources. The Xilinx ISE Design Suite provides complete design entry, synthesis, implementation, and verification capabilities specifically optimized for Virtex-II Pro devices.
Evaluation boards and development kits featuring the XC2VP50-5FF1517I enable rapid prototyping and system validation. These platforms typically include power supplies, configuration interfaces, I/O connectors, and reference designs to accelerate development cycles.
Third-party IP cores and design services are available from the Xilinx Alliance Program partners, offering pre-verified solutions for common functions such as memory controllers, communication protocols, and digital signal processing algorithms optimized for the XC2VP50-5FF1517I architecture.
Training resources include online courses, technical webinars, and hands-on workshops covering FPGA design methodologies, PowerPC processor integration, and high-speed I/O implementation techniques specific to the Virtex-II Pro family.
Environmental & Export Classifications
The XC2VP50-5FF1517I complies with international environmental standards including RoHS (Restriction of Hazardous Substances) directive for lead-free manufacturing processes. The device meets WEEE (Waste Electrical and Electronic Equipment) requirements for responsible disposal and recycling.
Export classification follows standard semiconductor trade regulations. The XC2VP50-5FF1517I is subject to U.S. Export Administration Regulations (EAR) and may require export licenses for certain destinations or end-use applications, particularly in aerospace, defense, or dual-use technology sectors.
Environmental operating specifications include commercial temperature range operation from 0ยฐC to 85ยฐC junction temperature, with appropriate thermal management solutions required for high-performance applications. The device is designed for operation in standard industrial environments with proper ESD protection and power supply filtering.
Quality standards compliance includes ISO 9001 manufacturing processes and automotive-grade reliability testing where applicable. The XC2VP50-5FF1517I undergoes comprehensive testing including thermal cycling, moisture sensitivity, and electrical parameter validation to ensure consistent performance across production lots.
