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XC2VP40-6FGG676C – Xilinx Virtex-II Pro FPGA

Original price was: $20.00.Current price is: $19.00.

The XC2VP40-6FGG676C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-II Pro family, designed to deliver exceptional processing power for demanding applications. This advanced programmable logic device combines embedded PowerPC processors with configurable logic blocks, making it ideal for complex digital signal processing, communications, and embedded system applications.

Product Specifications

Core Features

  • Part Number: XC2VP40-6FGG676C
  • Family: Virtex-II Pro
  • Logic Cells: 40,000 equivalent system gates
  • Speed Grade: -6 (high performance)
  • Package Type: FGG676 (Fine-Pitch Ball Grid Array)
  • Pin Count: 676 pins
  • Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)

Technical Specifications

  • Embedded PowerPC Processors: 2 hard-core 32-bit RISC processors
  • Block RAM: 1,728 Kbits total
  • Distributed RAM: 320 Kbits
  • Multiplier Blocks: 192 dedicated 18×18 multipliers
  • Digital Clock Manager (DCM): 4 units
  • I/O Standards: Support for multiple standards including LVDS, LVTTL, LVCMOS
  • Configuration Memory: SRAM-based with external storage support
  • Maximum Operating Frequency: Up to 420 MHz (speed grade dependent)

Package Details

The XC2VP40-6FGG676C features a robust FGG676 package that provides excellent thermal performance and signal integrity. The fine-pitch BGA design ensures optimal electrical characteristics while maintaining a compact footprint suitable for high-density applications.

Price Information

Note: Pricing for the XC2VP40-6FGG676C varies based on quantity, supplier, and market conditions. This is a legacy product that may have limited availability.

  • Small Quantity (1-99 units): Contact authorized distributors for current pricing
  • Production Quantities (100+ units): Volume discounts available
  • Engineering Samples: Available through Xilinx representatives

Pricing is subject to change without notice. Contact authorized Xilinx distributors for the most current pricing and availability information.

Documents & Media

Technical Documentation

  • Product Data Sheet: Comprehensive specifications and electrical characteristics
  • User Guide: Detailed implementation guidelines and best practices
  • Application Notes: Design examples and optimization techniques
  • Package and Pinout Information: Mechanical drawings and pin assignments
  • Migration Guide: Information for upgrading from previous generations

Development Resources

  • Reference Designs: Pre-built designs for common applications
  • IP Core Library: Compatible intellectual property cores
  • Design Examples: Sample code and implementation guides
  • Timing Reports: Performance analysis and optimization data

Software Support

  • ISE Design Suite: Complete development environment
  • EDK (Embedded Development Kit): Tools for embedded processor development
  • ChipScope Pro: On-chip debugging and analysis tools

Related Resources

Compatible Products

  • XC2VP20-6FGG676C: Lower gate count option in same package
  • XC2VP50-6FGG676C: Higher gate count alternative
  • XC2VP30-7FGG676C: Different speed grade option

Development Boards

  • ML310 Development Platform: Reference design board featuring XC2VP40
  • Custom Evaluation Boards: Third-party development solutions
  • Prototyping Modules: Rapid development platforms

Support Tools

  • Xilinx Alliance Program: Access to certified design services
  • Technical Support: Online resources and direct engineering support
  • Training Programs: Educational resources and certification courses

Application Areas

The XC2VP40-6FGG676C excels in various applications including:

  • Digital Signal Processing (DSP) systems
  • Communications infrastructure
  • Industrial automation and control
  • Aerospace and defense applications
  • Medical imaging and instrumentation
  • High-performance computing accelerators

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
  • WEEE Directive: Compliant with Waste Electrical and Electronic Equipment regulations
  • REACH Regulation: Conforms to European chemicals regulation requirements
  • Conflict Minerals: Compliant with Dodd-Frank Act Section 1502

Operating Conditions

  • Operating Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
  • Storage Temperature Range: -65ยฐC to +150ยฐC
  • Humidity: 5% to 95% relative humidity (non-condensing)
  • Altitude: Up to 2,000 meters above sea level

Export Classifications

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.33.0001
  • Country of Origin: Manufactured in various locations (check specific units)
  • Export Restrictions: Subject to U.S. export administration regulations

Quality Standards

  • ISO 9001: Manufacturing quality management system certified
  • ISO 14001: Environmental management system compliant
  • Automotive Grade: Not recommended for automotive applications
  • Military/Aerospace: Contact Xilinx for extended temperature and military-grade options

Packaging and Handling

  • Moisture Sensitivity Level (MSL): Level 3
  • ESD Sensitivity: Class 1 (>2000V HBM)
  • Lead-Free: Compatible with lead-free soldering processes
  • Shelf Life: Unlimited when stored properly

The XC2VP40-6FGG676C represents a mature, proven FPGA solution that continues to serve critical applications worldwide. While newer FPGA families offer enhanced features, this device remains valuable for existing designs and applications requiring its specific capabilities.