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XC2VP30-6FF896I: High-Performance Virtex-II Pro FPGA for Advanced Applications

Original price was: $20.00.Current price is: $19.00.

The XC2VP30-6FF896I is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, telecommunications, and embedded processing applications. This advanced FPGA combines high-density programmable logic with integrated PowerPC processors, making it an ideal solution for complex system designs.

Product Specifications

The XC2VP30-6FF896I features comprehensive technical specifications that make it suitable for high-performance applications:

Core Architecture:

  • Logic Cells: 30,816 system gates
  • Configurable Logic Blocks (CLBs): 2,448
  • Block RAM: 2,448 Kbits total memory
  • Dedicated multipliers: 136 embedded 18×18 multipliers
  • PowerPC 405 processors: 2 integrated hard processor cores

Package and Performance:

  • Package Type: FF896 (896-pin Fine-Pitch Ball Grid Array)
  • Speed Grade: -6 (high-performance grade)
  • Operating Temperature: Industrial range (-40ยฐC to +100ยฐC)
  • I/O pins: 556 user I/O pins
  • Differential I/O pairs: 278 pairs

Memory and Processing:

  • Distributed RAM: 38 Kbits
  • Block SelectRAM: 2,448 Kbits organized in 18-Kbit blocks
  • Clock management: Up to 8 Digital Clock Managers (DCMs)
  • Maximum system clock frequency: 420 MHz

The XC2VP30-6FF896I supports multiple I/O standards including LVDS, LVPECL, and single-ended standards, providing flexibility for interfacing with various system components.

Price Information

Pricing for the XC2VP30-6FF896I varies based on quantity, supplier, and market conditions. Industrial-grade FPGAs like the XC2VP30-6FF896I typically range from $200 to $800 per unit, depending on volume purchases and distributor pricing structures. For current pricing and availability of the XC2VP30-6FF896I, we recommend contacting authorized Xilinx distributors or electronic component suppliers who can provide real-time quotes based on your specific requirements.

Volume discounts are often available for the XC2VP30-6FF896I when purchasing in quantities of 100 units or more, making it cost-effective for production applications.

Documents & Media

Essential documentation for the XC2VP30-6FF896I includes:

Technical Documentation:

  • Virtex-II Pro FPGA Datasheet containing detailed electrical characteristics
  • XC2VP30-6FF896I pin configuration and package drawings
  • Power consumption analysis and thermal management guidelines
  • Programming and configuration specifications

Development Resources:

  • Xilinx ISE Design Suite compatibility information
  • Reference designs and application notes for the XC2VP30-6FF896I
  • PowerPC processor integration guides
  • Timing analysis and constraint files

Package Information:

  • FF896 package mechanical drawings and dimensions
  • Soldering profiles and assembly recommendations
  • Footprint libraries for PCB design tools

All documentation for the XC2VP30-6FF896I is available through Xilinx’s official documentation portal and authorized distributors.

Related Resources

Development Tools:

  • Xilinx Vivado Design Suite (legacy ISE support)
  • ChipScope Pro for debugging and verification
  • EDK (Embedded Development Kit) for PowerPC development
  • ModelSim simulation tools for XC2VP30-6FF896I designs

Evaluation Boards:

  • Virtex-II Pro development boards featuring the XC2VP30-6FF896I
  • Custom evaluation platforms for specific application testing
  • Reference design kits and starter projects

Software Support:

  • Device drivers and BSPs for embedded applications
  • IP core libraries compatible with the XC2VP30-6FF896I
  • Design examples and tutorials for first-time users

Alternative Components:

  • Other Virtex-II Pro family devices for scalability
  • Migration paths to newer FPGA families
  • Companion chips and supporting components

Environmental & Export Classifications

The XC2VP30-6FF896I meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS compliant (lead-free manufacturing)
  • REACH regulation compliance
  • Industrial temperature range qualification (-40ยฐC to +100ยฐC)
  • Moisture sensitivity level (MSL) rating: Level 3

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • Country of origin: Various (manufactured in multiple locations)
  • Export license requirements vary by destination country

Quality Standards:

  • ISO 9001 certified manufacturing
  • Military temperature screening available
  • Extended reliability testing and qualification

Package Environmental Data:

  • Pb-free and halogen-free options available
  • Compliant with automotive and aerospace standards
  • Long-term availability commitment from Xilinx

The XC2VP30-6FF896I is designed for applications requiring high reliability and extended operational life, with comprehensive testing and qualification procedures ensuring consistent performance across various environmental conditions.


The XC2VP30-6FF896I represents a mature, proven FPGA solution that continues to serve critical applications in telecommunications, aerospace, defense, and industrial automation. Its combination of high-performance logic, integrated processors, and robust package options makes it an excellent choice for systems requiring both processing power and programmable flexibility.