Product Specifications
Core Architecture
- Device Family: Spartan-II E Series
- Logic Cells: 13,824 equivalent logic cells
- System Gates: 600,000 typical gates
- CLBs (Configurable Logic Blocks): 1,728 CLBs
- Total I/O: 514 user I/O pins
- Package Type: Fine-pitch Ball Grid Array (FG676)
- Speed Grade: -7 (high performance)
Memory Resources
- Block RAM: 288 Kbits total block RAM
- Distributed RAM: 216 Kbits distributed RAM
- ROM: Configurable ROM capabilities
Clock Management
- Digital Clock Managers (DCMs): 4 DCMs
- Global Clock Networks: 8 global clock networks
- Maximum Frequency: Up to 200+ MHz (design dependent)
Physical Characteristics
- Package: 676-pin Fine-pitch BGA (FG676)
- Operating Temperature: Industrial grade (-40ยฐC to +85ยฐC)
- Supply Voltage: 2.5V core, 3.3V I/O (selectable 2.5V/3.3V I/O)
Pricing Information
The XC2S600E-7FG676I pricing varies based on quantity and supplier. Typical pricing ranges:
- Single Unit: $45-65 USD
- Volume (100+ units): $35-50 USD
- Production Quantities (1000+): Contact authorized distributors for volume pricing
Prices subject to market conditions and availability. Contact authorized Xilinx distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Product Data Sheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines
- Package Information: Mechanical drawings and pinout diagrams
- Migration Guide: Design transition recommendations
- Errata: Known issues and workarounds
Design Resources
- Reference Designs: Application-specific design examples
- IP Core Compatibility: Compatible IP core listings
- Timing Models: Detailed timing analysis files
- Simulation Models: VHDL/Verilog simulation libraries
Software Support
- ISE Design Suite: Full compatibility with Xilinx ISE software
- WebPACK: Free development tool support
- ChipScope: Integrated debugging capabilities
Related Resources
Development Tools
- Spartan-II E Evaluation Boards: Prototyping and development platforms
- Programming Cables: JTAG programming interfaces
- Configuration Devices: Compatible PROM and Flash memory solutions
Compatible Devices
- XC2S400E-7FG676I: Lower gate count alternative
- XC2S300E-7FG676I: Cost-optimized option
- XC2S150E-7FG676I: Entry-level solution
Application Areas
- Digital Signal Processing: High-speed signal processing applications
- Communications: Protocol processing and interface bridging
- Industrial Control: Automation and control systems
- Medical Equipment: Portable and stationary medical devices
- Automotive Electronics: Advanced driver assistance systems
Technical Support
- Xilinx Answer Database: Comprehensive FAQ and solutions
- Community Forums: Peer-to-peer technical discussions
- Application Notes: Detailed implementation guidance
- Training Resources: Online and instructor-led courses
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European RoHS directive requirements
- Lead-Free: Pb-free package construction
- Halogen-Free: Environmentally friendly packaging materials
- REACH Compliant: Complies with EU REACH regulation
Operating Conditions
- Operating Temperature Range: -40ยฐC to +85ยฐC (Industrial)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Thermal Resistance: ฮธJA = 23ยฐC/W (typical)
Export Classification
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- Schedule B: 8542.31.0001
- Country of Origin: Various (check specific part marking)
- Export License: May require export license for certain destinations
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality systems
- Automotive Grade: Available in automotive-qualified versions
- Military Grade: Contact Xilinx for military/aerospace versions
- Reliability Testing: Extensive qualification and reliability testing
Package Marking
The XC2S600E-7FG676I features clear package marking including part number, speed grade, date code, and lot traceability information for complete supply chain visibility.
The XC2S600E-7FG676I represents proven FPGA technology backed by Xilinx’s industry-leading support infrastructure, making it an excellent choice for both prototype development and volume production applications.
