1. Product Specifications
Core Architecture
- Part Number: XC2S600E-6FGG676I
- Family: Xilinx Spartan-II FPGA
- System Gates: 600,000 gates
- Logic Cells: 15,552 logic cells
- Speed Grade: -6 (high-performance grade)
- Package Type: FGG676 (Fine-pitch Ball Grid Array)
- Pin Count: 676 pins
- Temperature Grade: Industrial (-40ยฐC to +85ยฐC)
Memory and Resources
- Block RAM: 288 Kbits distributed across 32 blocks
- Distributed RAM: 49,152 bits
- Input/Output: Up to 512 user I/O pins
- Global Clock Networks: 4 dedicated global clock networks
- DLL (Delay Locked Loops): 4 DLLs for precise clock management
Performance Characteristics
- Maximum Operating Frequency: Up to 200 MHz (design dependent)
- Power Supply: 2.5V core voltage, multiple I/O voltage standards supported
- Package Dimensions: 27mm x 27mm BGA package
- Ball Pitch: 1.0mm
- Moisture Sensitivity Level: MSL-3
Supported I/O Standards
The XC2S600E-6FGG676I supports multiple I/O voltage standards including:
- LVTTL/LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
- PCI (3.3V, 5V tolerant)
- GTL/GTL+
- SSTL-2, SSTL-3
- HSTL Class I, II, III, IV
2. Price
Pricing Information
- Unit Price (1-99 pieces): Contact for current pricing
- Volume Pricing (100+ pieces): Available upon request
- Lead Time: Typically 4-12 weeks from major distributors
- Minimum Order Quantity: 1 piece
- Price Currency: USD (prices subject to change)
Note: Pricing varies based on market conditions, order quantity, and distributor. Contact authorized Xilinx distributors for current pricing and availability.
Authorized Distributors
- Digi-Key Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Future Electronics
3. Documents & Media
Technical Documentation
- Datasheet: XC2S600E Complete Product Specification (DS031)
- User Guide: Spartan-II FPGA Family Complete Data Sheet
- Application Notes:
- XAPP158: Spartan-II Configuration
- XAPP176: Getting Started with Spartan-II FPGAs
- XAPP138: Spartan-II FPGA Power Distribution Design
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE 14.7 and earlier
- Reference Designs: Available through Xilinx Application Center
- Evaluation Boards: Spartan-II Development Kit available
- IBIS Models: Signal integrity simulation models provided
Package Information
- Package Drawing: FGG676 mechanical specifications
- Pin Assignment: Complete pinout documentation
- Thermal Characteristics: Junction-to-ambient thermal resistance data
- Assembly Guidelines: BGA mounting and soldering recommendations
4. Related Resources
Development Tools
- Xilinx ISE WebPACK: Free development environment
- ChipScope Pro: Logic analyzer for debugging
- ModelSim: HDL simulation software compatibility
- FPGA Editor: Floor planning and constraint management
Compatible Products
- Configuration Devices: XC18V series PROM family
- Power Management: Compatible voltage regulators and power solutions
- Oscillators: Clock generation solutions for FPGA designs
- Connectors: High-speed differential pair connectors
Application Areas
The XC2S600E-6FGG676I is ideal for:
- Industrial automation and control systems
- Communications infrastructure equipment
- Digital signal processing applications
- High-speed data acquisition systems
- Protocol conversion and bridging
- Custom computing accelerators
Design Services
- Xilinx Alliance Program: Access to certified design partners
- Reference Design Library: Pre-verified IP cores and designs
- Training Resources: Online courses and documentation
- Technical Support: Community forums and direct support options
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU RoHS directive requirements
- REACH Compliance: Compliant with EU REACH regulation
- Halogen-Free: Package materials meet halogen-free requirements
- Conflict Minerals: Compliant with conflict minerals regulations
Quality Standards
- Quality Grade: Industrial temperature grade
- Reliability Standards: Meets JEDEC standards for semiconductor reliability
- Qualification Level: Fully qualified for industrial applications
- Package Reliability: Extensive testing for BGA package integrity
Export Control Classification
- ECCN (Export Control Classification Number): 3A991.a.2
- Export License: May require export license for certain destinations
- Country of Origin: Manufactured in various global facilities
- Customs Tariff: Classified under HS code 8542.31
Storage and Handling
- Storage Temperature: -55ยฐC to +150ยฐC
- Humidity Requirements: <85% RH non-condensing
- ESD Sensitivity: Class 1 (>1000V HBM)
- Package Handling: Anti-static precautions required
Certifications
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management system
- TS 16949: Automotive quality standard (where applicable)
- UL Recognition: Component recognition where required
Why Choose XC2S600E-6FGG676I?
The XC2S600E-6FGG676I represents an excellent balance of performance, reliability, and cost-effectiveness for industrial FPGA applications. With its robust industrial temperature rating, extensive I/O capabilities, and proven Spartan-II architecture, this device provides the flexibility and performance needed for demanding embedded system designs.
Whether you’re developing communication protocols, implementing digital signal processing algorithms, or creating custom logic solutions, the XC2S600E-6FGG676I delivers the programmable logic resources and industrial-grade reliability your project demands.
For technical support, pricing information, or design assistance with the XC2S600E-6FGG676I, contact your local Xilinx representative or authorized distributor.
