1. Product Specifications
Core Architecture
- Logic Elements: 10,800 logic cells organized in 2,400 CLBs (40 x 60 array)
- System Gates: 400,000 gates (145,000-400,000 range for logic and RAM)
- Memory Architecture:
- Block RAM: 160K bits in 4-column configuration
- Distributed RAM: 153,600 bits
- Dual-port synchronous RAM capability
Electrical Specifications
- Core Voltage (VCCINT): 1.8V ยฑ5%
- I/O Voltage (VCCO): 1.2V to 3.6V (standard dependent)
- Operating Temperature: Commercial (0ยฐC to +85ยฐC), Industrial (-40ยฐC to +100ยฐC)
- Power Consumption: Low-power 0.15 micron technology
- Maximum User I/O: 410 pins with 172 differential I/O pairs
Performance Characteristics
- System Performance: Beyond 200 MHz operation
- Toggle Frequency: Up to 400 MHz (export control considerations)
- Configuration Options: Multiple modes including Master/Slave Serial, Slave Parallel (SelectMAP), and Boundary Scan
Package Details
- Package Type: FTG256 (Fine-pitch Ball Grid Array)
- Pin Count: 256 balls
- Ball Pitch: 1.0mm
- Package Dimensions: 17mm x 17mm footprint
- Height: 1.55mm maximum
- RoHS Compliance: Available (FTG256 version)
2. Pricing Information
Current Market Pricing (Subject to quantity and availability):
- Small Quantity (1-10 units): Contact for quote
- Production Quantities (100+): Volume pricing available
- Sample Pricing: Available through authorized distributors
Note: Pricing varies by distributor, quantity breaks, and market conditions. Contact authorized distributors like Allelco Electronic for current pricing and availability.
Cost Considerations:
- Competitive alternative to mask-programmed ASICs
- Eliminates NRE costs and lengthy development cycles
- Field-upgradeable reducing long-term maintenance costs
3. Documents & Media
Official Documentation
- Datasheet: DS077 Spartan-IIE FPGA Family Complete Data Sheet
- Module 1: Introduction and Ordering Information
- Module 2: Functional Description
- Module 3: DC and Switching Characteristics
- Module 4: Pinout Tables
Development Resources
- ISE Design Suite: Fully supported development environment
- CORE Generator: IP library with DSP functions and soft processors
- Application Notes:
- XAPP179: Using SelectIO Interfaces
- XAPP174: DLL Application Guidelines
- XAPP176: Configuration and Readback
- XAPP188: Boundary-scan Configuration
Technical References
- User Guides: Configuration, debugging, and optimization guides
- Reference Designs: Example implementations and best practices
- Simulation Models: IBIS models for signal integrity analysis
- BSDL Files: Boundary scan description language files for test
4. Related Resources
Development Tools
- Xilinx ISE WebPACK: Free development environment
- ModelSim: Advanced simulation and verification
- ChipScope Pro: On-chip debugging and analysis
- Platform Flash PROMs: Configuration memory solutions
Evaluation Platforms
- Spartan-IIE Starter Kits: Rapid prototyping platforms
- Development Boards: Various third-party evaluation boards
- Reference Designs: Communication, DSP, and control applications
Support Ecosystem
- Technical Support: Comprehensive online resources and forums
- Training: Webinars, workshops, and certification programs
- Partner Network: Extensive ecosystem of design service providers
- Community Forums: Active developer community support
Compatible Components
- Configuration Devices: Platform Flash and Serial PROMs
- Power Management: Voltage regulators and power sequencing
- Clock Sources: Crystal oscillators and clock generators
- Interface Components: Level translators and signal conditioning
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Compliant lead-free package options available
- REACH Regulation: Full material declaration available
- Conflict Minerals: Compliance documentation provided
- Environmental Certifications: ISO 14001 manufacturing standards
Package Environmental Data
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Storage Temperature: -65ยฐC to +150ยฐC
- Junction Temperature: Up to +125ยฐC maximum
- ESD Protection: HBM > 2000V, CDM > 750V
Export Control Information
- ECCN Classification: Export administration regulations apply
- Country Restrictions: Standard semiconductor export controls
- End-Use Applications: Commercial and industrial applications
- Re-export Requirements: Compliance with applicable regulations
Quality & Reliability
- Qualification Standards: JEDEC and military standards testing
- Quality Management: ISO 9001 certified manufacturing
- Reliability Data: MTBF and failure rate information available
- Test Coverage: 100% production testing and screening
Disposal & Recycling
- Material Content: Full material composition documentation
- Recycling Programs: Electronic waste recycling guidelines
- End-of-Life: Proper disposal and recycling procedures
- Packaging: Recyclable anti-static packaging materials
Applications & Markets
The XC2S400E-6FTG256I serves diverse applications including:
- Communications: Protocol processing, packet filtering, interface bridging
- Industrial Control: Motor control, automation systems, sensor interfaces
- Consumer Electronics: Set-top boxes, gaming, multimedia processing
- Automotive: Engine control, driver assistance, infotainment systems
- Test & Measurement: Signal processing, data acquisition, instrument control
Note: This product is marked as OBSOLETE as of August 2013. For new designs, consider current AMD Xilinx FPGA families with enhanced features and performance.
