1. Product Specifications
Core Features of XC2S300E-7FTG256C:
- Device Type: Spartan-IIE FPGA
- Logic Capacity: 6,912 logic cells, 300,000 system gates
- Package: 256-pin Fine-pitch Thin Ball Grid Array (FTG256)
- Speed Grade: -7 (Higher Performance)
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
- Operating Voltage: 1.8V core logic, I/O powered at 1.5V, 2.5V, or 3.3V
Memory Architecture:
- Block RAM: 64K bits total block RAM
- Distributed RAM: 98,304 bits distributed RAM
- Configuration: 16 bits/LUT distributed RAM, configurable 4K-bit true dual-port block RAM
I/O Specifications:
- Maximum User I/O: 182 user I/O pins in FT256 package
- I/O Standards: 19 selectable I/O standards including LVTTL, LVCMOS, HSTL, SSTL, AGP, CTT, GTL, LVDS and LVPECL differential I/O
- Differential I/O Pairs: Up to 83 differential I/O pairs
- Hot Swap Support: CompactPCI friendly hot swap capability
Clock Management:
- Global Clock Networks: Four primary low-skew global clock distribution nets
- DLL Support: Four dedicated DLLs (Delay-Locked Loops) for advanced clock control
- Clock Features: Eliminate clock distribution delay, multiply, divide, or phase shift
Advanced Features:
- Technology: 0.15 micron technology
- Reprogrammability: Unlimited in-system reprogrammability
- Boundary Scan: IEEE 1149.1 compatible boundary scan logic
- Configuration Options: Multiple configuration modes including Master Serial, Slave Serial, Slave Parallel, and Boundary Scan
2. Price Information
Current Market Pricing for XC2S300E-7FTG256C:
Based on current distributor information, the XC2S300E-7FTG256C is available from multiple sources:
- Stock Availability: New original stock available with 272 pieces in stock
- Lead Time: Standard commercial lead times apply
- Package Options: Available in both standard and lead-free (Pb-free) versions
- Quantity Pricing: Volume discounts available for larger quantities
Note: Prices vary by distributor, quantity, and market conditions. Contact authorized distributors for current pricing.
3. Documents & Media
Official Documentation:
- Primary Datasheet: DS077 Spartan-IIE FPGA Family Data Sheet (4 modules)
- Module 1: Introduction and Ordering Information
- Module 2: Functional Description
- Module 3: DC and Switching Characteristics
- Module 4: Pinout Tables
Development Resources:
- Design Software: Fully supported by Xilinx ISE development system
- IP Library: Extensive IP library including DSP functions and soft processors
- CORE Generator: CORE Generator tool functions with relative location constraints
Application Notes:
- XAPP179: Using SelectIO Interfaces in Spartan-II and Spartan-IIE FPGAs
- XAPP173: Block RAM usage and optimization
- XAPP174: DLL usage and implementation
- XAPP176: Configuration and Readback procedures
- XAPP188: Boundary-scan configuration
4. Related Resources
Development Tools:
- Xilinx ISE Design Suite: Complete design environment with automatic mapping, placement, and routing
- Design Entry Tools: Support for HDL design entry with multiple synthesis environments
- Simulation Support: Both software simulation and in-circuit debugging capabilities
- Timing Analysis: Static timing analyzer for performance verification
Compatible Products:
- Configuration PROMs: Xilinx Platform Flash in-system programmable configuration PROMs
- Development Boards: Various third-party development boards supporting FT256 package
- Programming Cables: Xilinx download cables for device programming and debugging
Application Areas:
- Digital Signal Processing: High-speed arithmetic and filtering applications
- Communications: Interface and protocol processing
- Industrial Control: Real-time control systems
- Consumer Electronics: Cost-effective digital processing solutions
- Prototyping: ASIC replacement and rapid prototyping
Migration Path:
- Footprint Compatibility: Family footprint compatibility in common packages for easy migration
- Upgrade Options: Clear migration path to higher-density Spartan devices
- Legacy Support: Superior alternative to mask-programmed ASICs
5. Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliance: Available in lead-free (Pb-free) package options (FTG256 becomes FTFG256)
- Operating Temperature: Commercial grade: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC storage temperature range
- ESD Protection: All pads protected against electrostatic discharge (ESD) and over-voltage transients
Package Environmental Data:
- Thermal Resistance: Junction-to-ambient thermal characteristics available for thermal management
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating for proper handling
- Package Mass: Approximately 1.0g ยฑ10% for FT256 package
Export Classifications:
- Export Control: Subject to U.S. export control regulations
- ECCN Classification: Check current export control classification number
- Country Restrictions: Verify country-specific import/export requirements
Compliance Standards:
- IEEE Standards: IEEE 1149.1 compatible boundary scan
- Industry Standards: Compliant with JEDEC and industry packaging standards
- Quality Standards: Manufactured under ISO quality management systems
Lifecycle Status:
- Product Status: OBSOLETE – This product is obsolete/discontinued per XCN12026
- Availability: Available through distributor stock and excess inventory
- Support: Legacy support available through Xilinx technical resources
- Migration: Consider newer Spartan families for new designs
Keywords: XC2S300E-7FTG256C, Xilinx FPGA, Spartan-IIE, 300K gates, FTG256 package, programmable logic, digital design, embedded systems, ASIC replacement
Related Part Numbers: XC2S300E-6FTG256C, XC2S300E-7FT256C, XC2S300E-6FT256C, XC2S300E-7PQG208C
For technical support, pricing, and availability of the XC2S300E-7FTG256C, contact authorized Xilinx distributors or legacy product specialists.
