Product Specifications
The XC2S300E-6FGG456C features robust specifications that make it ideal for complex digital implementations:
Core Architecture:
- Device Family: Spartan-II E series
- Logic Cells: 300,000 system gates
- Configurable Logic Blocks (CLBs): 1,176 CLBs
- Input/Output: 333 user I/O pins
- Block RAM: 40 Kbits of distributed RAM
- Speed Grade: -6 (high-performance grade)
Package Details:
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 456 pins
- Package Code: FGG456
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Performance Features:
- Advanced routing architecture for optimal signal integrity
- Dedicated carry logic for high-speed arithmetic operations
- Multiple clock domains support
- Low power consumption design
- High-speed I/O capabilities
The XC2S300E-6FGG456C supports various I/O standards including LVTTL, LVCMOS, PCI, and differential signaling standards, making it compatible with diverse system architectures.
Price
Pricing for the XC2S300E-6FGG456C varies based on order quantity, supplier, and current market conditions. As a legacy Xilinx component, prices typically range from $50 to $150 per unit for standard quantities. For current pricing and volume discounts, contact authorized Xilinx distributors or electronic component suppliers. Educational institutions and qualified development projects may be eligible for special pricing programs.
Documents & Media
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- Configuration user guide and programming instructions
- Pin-out diagrams and package mechanical drawings
- Application notes for design optimization
- Reference designs and example implementations
Development Tools:
- Xilinx ISE Design Suite compatibility
- ChipScope Pro analyzer support
- ModelSim simulation libraries
- Synthesis tool integration guides
Design Resources:
- IP core libraries and reference designs
- Timing constraint templates
- PCB layout guidelines and recommendations
- Signal integrity analysis tools
Related Resources
Development Platforms:
- Spartan-II E evaluation boards and starter kits
- Compatible development modules and expansion boards
- Programming cables and configuration devices
Software Tools:
- Xilinx ISE WebPACK (free version) support
- Third-party synthesis and simulation tools
- Debug and verification utilities
Educational Materials:
- Online tutorials and training courses
- University program resources
- Community forums and technical support
Complementary Products:
- Configuration memory devices (Platform Flash)
- Clock generation and management solutions
- Power management ICs optimized for FPGA applications
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Yes, lead-free package available
- Halogen-Free: Standard packages may contain halogens
- Operating Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 85% non-condensing
Quality Standards:
- Manufactured to automotive-grade quality standards
- ISO 9001 certified production facilities
- Comprehensive reliability testing and qualification
Export Classifications:
- ECCN (Export Control Classification Number): Varies by configuration
- HTS (Harmonized Tariff Schedule): Electronic integrated circuits classification
- Country of Origin: Typically manufactured in Asia-Pacific facilities
- Export Restrictions: Subject to semiconductor export regulations
Packaging and Handling:
- Moisture sensitivity level (MSL) rated packaging
- Anti-static handling requirements
- Tape and reel packaging for automated assembly
- Lead-free soldering process compatible
The XC2S300E-6FGG456C represents proven FPGA technology suitable for applications requiring reliable programmable logic solutions. While part of Xilinx’s mature product line, this device continues to serve in established designs where long-term availability and cost optimization are priorities. For new designs, consider current-generation alternatives that offer enhanced performance and modern development tool support.
Note: Availability may be limited as this is a legacy product. Contact authorized distributors for current stock levels and lead times. Consider design migration paths to newer FPGA families for long-term product strategies.
